Wednesday, October 17, 2012

No-clean flux from Henkel delivers exceptional manufacturing latitude

Designed with modern manufacturing requirements in mind, Henkel Electronic Materials has formulated Multicore MF210, a no-clean sustained activity flux that is compatible with both lead-free and tin-lead processes. The halide-free, resin-free material is effective with a wide range of solder resists, as well as rosin and OSP-based protectants for maximum adaptability.

Multicore MF210’s wide process window affords electronics specialists the latitude necessary to accommodate varying conditions for both tin-lead and lead-free manufacturing. With a pre-heat temperature range of 80°C to 130°C and a one- to three-second contact time on the wave, Multicore MF210 delivers sustained activity without resin even in the most demanding environments. The material’s unique formulation enables its use in both single- and dual-wave processes, with no degradation in activity level and its low solids content results in very low residue levels for a no-clean operation.

Unmatched advantages

Henkel Global Technology Champion for Solder Materials, Richard Boyle, explains why Multicore MF210 is such a significant industry advance. “There are so many variables in manufacturing today and modern materials must be able to adapt,” comments Boyle. “Multicore MF210 delivers this adaptability and then some. It has an extremely wide process window, excellent performance on challenging oxidized surface finishes, works well in both tin-lead and lead-free processes, affords high speed soldering with both single- and dual-wave systems and, because of its low residues, offers improved first time yield for pin testing. Add to this its ability to be used with spray, foam or wave fluxing systems and Multicore MF210’s advantages are pretty much unmatched among fluxes.”

Multicore MF210’s sustained activity level ensures that cleaning of OSPs and highly oxidized bare copper is extremely effective, thereby enabling excellent solder wetting and through hole penetration. In addition, the activity capability helps reduce solder microballing by improving coalescence and limiting the presence of stray particles around the solder joint.

Ideal for any process where high throughput is a necessity and minimum flux residue is a key requirement, Multicore MF210’s performance has been proven for multiple applications in the consumer electronics, automotive and alternative energy sectors.

No comments: