Tuesday, October 09, 2012

86BSD Media Isolated Digital Output Pressure Sensor

Measurement Specialties, Inc. (NASDAQ: MEAS) has just released to production its new 86BSD media isolated digital output pressure sensor. This small 16mm, ASIC calibrated pirezoresistive silicon pressure sensor is designed to be mountable with an o-ring seal for high performance, low pressure applications. It utilizes silicone oil to transfer pressure from its 316L stainless steel diaphragm to its sensing element. It is one of the first standalone pressure components of its kind in the market.

The 86BSD is configured in a backside, header-less design with a pressure range of 1 – 300psi in either absolute or gage reference type. Operating from -40°C to +125°C, it features both pressure and temperature read-out capabilities, ±0.1% non-linearity, ±1.0 TEB (Total Error Band) and provides a digital output of 10~90% or 5~95% in I2C or SPI interface protocols. With a supply voltage of either 3.3 or 5.0Vdc, it comes with pads or a cable/connector, as well as a low power option.

This backside digital output pressure sensor can be used for various applications such as: level controls, tank level measurement, corrosive fluids and gas measurement systems, OEM equipment, sealed systems, manifold pressure measurement, barometric pressure measurement and submersible depth monitoring. MEAS is more than happy to work with engineers to meet specific requirements for their application purposes.

Measurement Specialties, Inc. designs and manufactures sensors and sensor-based systems. The company produces a wide variety of sensors and transducers to measure precise ranges of physical characteristics such as pressure, force, vibration, torque, position, temperature, humidity, fluid properties, mass air flow and photo optics. Measurement Specialties uses multiple advanced technologies – including piezo-resistive, electro-optic, electro-magnetic, variable reluctance, magneto resistive, digital encoders, thermistors, thermocouples, RTDs, capacitive, resonant beam, application specific integrated circuits (ASICs), micro-electromechanical systems (MEMS), piezoelectric polymers and strain gauges to engineer sensors that operate accurately and cost-effectively in customers' applications.

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