Friday, September 28, 2012

Capacitance Breakthrough in Integrated Passive Devices

Expanding its product portfolio in high-density Integrated Passive Devices, IPDiA, a leading supplier of Silicon passive components, has today introduced a new generation of PICS technology, dubbed PICS3, which has recorded 250 nF/mm2 capacitance density for demanding applications including medical, aerospace, industrial, communication and defense.

“Delivery of Silicon capacitors with several µFarad capacitances is now a reality”, said Laurent Dubos, IPDiA marketing manager.

Thanks to its patented and leading PICS technology, IPDiA integrates up to hundred passive components (resistors, capacitors, inductors and diodes) in a single silicon die, as well as a single 10 µfarad capacitor offering an upgrade solution to tantalum or ceramic capacitors with the “out of standard performance” of the silicon passive component.

IPDiA produces standalone Integrated Passive Devices (IPD) or passive component networks that can be reflow or bumped, both on main electronic boards as well as in System in Package (SiP).

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