Friday, September 28, 2012

CUI Inc announces that their AMT Series modular encoder is now being carried by MicroMo Electronics, Inc., the North American distributor for the Faulhaber Group. The AMT utilizes CUI’s proprietary capacitive technology, which holds numerous advantages over the optical technology typically used in today’s modular encoders. The AMT’s design allows users to select from a range of resolutions via an on-board dip switch, creating flexibility for companies utilizing multiple encoders in their applications. Additionally, common problems associated with optical encoders, including fragility of the optical disk, led burn-out, limited temperature range, and high current consumption are eliminated by capacitive technology.

The AMT has been paired with several MicroMo DC motors ranging from 22 to 32 mm diameters and is being sold as a value added package. Dodd Disler, MicroMo’s Vice President and COO observes, “CUI provides a competitive encoder solution using unique technology. This provides another great tool for MicroMo to integrate into our custom motion solutions and value added drive systems.”

The combination of the AMT and the MicroMo DC motor is ideal for indication and control of shaft velocity and direction of rotation as well as for positioning. The AMT102 is configured with a side or radial exit connector and the AMT103 is configured with a top or axial connector. The supply voltage for the encoder and the DC motor, as well as the output signals, are interfaced with separate cables for connection.

Matt McKenzie CUI’s President states, “MicroMo is an industry leader in its space and CUI greatly values their partnership.”

CUI Inc's power line, V-Infinity, announced a new line of step-down constant current dc-dc converters that have been designed for driving high power LEDs. The VLD24 series has efficiency levels of up to 95% and a wide input range of 5.5 to 36 Vdc. The series has two means of LED dimming: PWM digital dimming and analog dimming control via a trim POT. The VLD24 is ideal for a wide range of LED applications where precise accuracy and brightness control is needed, including signage, transport, consumer electronics, and signaling.

Available output currents include 300, 350, 500, 600, and 700 mA with an output voltage range of 2 to 32 Vdc. The VLD24 series has an ambient operating temperature range of -40°C to +85°C at full load in the 300 mA and 350 mA versions and -40°C to +71°C in the 500 mA, 600 mA, and 700 mA versions. Short-circuit protection and on/off control are standard features. This series is compact, measuring 0.897 x 0.401 x 0.374 inches in a pcb mount package. The VLD24 series is available immediately through Digi-Key with prices starting at $10.50 per unit. For quantities over 500 pieces, please contact CUI directly for OEM pricing.

CUI Inc introduces a new panel mount optical encoder that has a 2-bit quadrature resolution and can be used in a wide variety of applications. The C14 series is of high quality with a clean, crisp square wave output and no plastic components. Possible applications include audio, aircraft, medical and test equipment, or as a replacement for a panel mount potentiometer.

The C14 series has a 16 or 32 angle of throw position along with three shaft options that include 3.175 mm with slotted end, 6 mm diameter round, and 6.35 mm with D-cut. Detent options include 16, 32, or non-detent. A push switch is available and there are four termination options including solder holes, 130 mm cable with connector, pcb mount, and panel mount. The C14 series will be available through Digi-Key soon with prices starting at under $23 per unit. Please contact CUI directly for OEM pricing.

CUI Inc's power line, V-Infinity, introduces a new line of rugged dc-dc converters that feature an ultra-wide 4:1 input and provide 50~200 W of output power. These chassis-mount units are enclosed in an aluminum case measuring 4.25x4.00x1.50 inches and include a built-in heat sink for improved thermal performance. The VHK series is perfectly suited for various communications and industrial applications where rugged design is required.

Users can select from an input voltage range of 9~36 Vdc or 18~72 Vdc and output voltages of 3.3, 5, 12, 15, 24, or 48 Vdc. The standard operating temperature range is -40~85°C, with the 50 W model operating up to 60°C under convection-cooled conditions. Safety features of the VHK series include over current, over temperature, input transient, and short circuit protections. Additional features include high efficiency, fast transient response, remote sense, and remote on/off control. Most models are available immediately through Digi-Key with prices starting at $125 per unit. Please contact CUI directly for OEM quantities.

CUI Inc's power line, V-Infinity, introduced a new line of dc-dc converters that provide 12 W output power in a compact 24-pin DIP package. The VAWQ12 series is an isolated board mount converter featuring a wide 4:1 input range and efficiencies of up to 88%. This series measures 1.26 x 0.79 x 0.41 inches and is housed in a five-sided metal shielded casing with an industry standard pinout. The VAWQ12 series is well suited for many applications where space is at a premium and a wide input range is needed such as data transfer equipment or battery operated equipment.

The VAWQ12 series has an input range from 9-36 Vdc at a nominal input of 24 Vdc, or from 18-75 Vdc at nominal input of 48 Vdc. Output voltages include 3.3, 5, 12, and 15 Vdc. The series has an operating temperature range of -40 to 85°C and an I/O isolation voltage of 1,500 Vdc. Features include over voltage protection, short circuit protection, and remote on/off control. The VAWQ12 series is available immediately through Digi-Key with prices starting at $41 per unit. Please contact CUI directly for OEM pricing.

Coto Technology has introduced a  high-sensitivity reed relay to its line of economical "Spartan" SIP's.

The 5-volt 9007-05-40 has 1000 ohm coil resistance (rather than the standard 500 ohm) and includes an external  magnetic shield.  The new SIP is available only in Form A with an optional diode.  The 9007-05-40 is .25" wide and .810" long with .2" spacing between  the four leads and has contact ratings of 10 watts and up to 200 volts or 0.5 Amp switching.  Like other SIP's in Coto's economical Spartan series, the 9007-05-40  is a general purpose relay ideally suited for security, industrial and telecom applications.  The SIP offers high-insulation resistance and high-speed switching when compared to electromechanical relays.

The 9007-05-40 is available with stock to six week lead times.

Coto Technology of North Kingstown, Rhode Island, is offering a high-performance, high-reliability molded SIP Reed Relay that occupies 41% less board space than Coto's other high-performance 9000 series SIP's.

Like the 9000 series, Coto's  9090 series reed relay is ideally suited for Automatic Test Equipment, Instrumentation, RF and Telecommunications applications. The 9090 series has a molded thermoset body on an  integral lead frame design. It features high insulation resistance and high reliability, hermetically-sealed contacts for long life. The relay is tested to 1 Billion operations. The  9090 SIP reed relay has a stock to six-week turnaround. Additional options and customization are readily available.

Coto Technology of North Kingstown, Rhode Island,  is now offering a surface mountable DIP Reed Relay.

The 8061 is a 1-Form C (single-pole, double-throw) SMD available in 5.0, 12.0, and 24.0 V coil.  Ideally suited to the needs of  Automated Test Equipment, Instrumentation, Data Acquisition, and Process Control requirements, Coto's 8061 relay provides high-insulation resistance and high reliability, hermetically-sealed contacts for  long life.  Available in the industry-standard 14-pin DIP package, the 8061 relay has a seven-week turnaround. Additional options include co-axial shield and diode.

Coto Technology of North Kingstown, Rhode Island, has introduced the Spartan Series of SIP and DIP Reed Relays.

Designed for economy, the Spartan 9007 4-Pin SIP is a general purpose,  high-reliability relay best suited for Security, Instrumentation, and Modem applications. The 9007 offers high insulation resistance and high-speed switching when compared to electromechanical relays.

The Spartan 8L00 DIP, in the industry standard 14-pin molded DIP package, will cross to all competitive DIP packages, such as CP Clare's DSS series and  Hamlin's HE3600 series and is ideal for use in telecom, security and other general purpose applications.  The 8L00 is available in Form 1A, 1C, and 2A packages, 5,12, and 24 V coil designs, and with electrostatic shield and diode options.

The Spartan SIP is available from stock to 6-week leadtimes.   

Coto Technology's 3500 and 3600 series Low Thermal EMF Reed Relays reduce thermocoupling and provide for true voltage measurements at very low signal levels.

The 3500 & 3600 series Reed Relays  address the problem of stray voltages introducing errors into the signal path when measuring low level signals (tens to hundreds of microvolts).  Typically, as temperature increases, stray voltages are generated by  "thermocouples" in the circuit, resulting from the dissimilar materials of a relay.

Coto's low thermal relays incorporate a patented thermal chip which provides thermal  equilibrium while maintaining electrical isolation.  This helps to compensate for the effects of thermal gradients which cause EMF voltages. Coto's low thermal relays are available  with maximum thermal EMF ratings between  0.5 V and 10 V and are 100% production tested.  Other available features include: Switching voltages up to 1000VDC; dry- or  mercury-wetted reed switches; up to 3-form-A switch configuration; control voltage of 5 or 12 VDC; and an optional electrostatic shield.  In addition, Coto's low thermal relays  have fast switching times (.07mS for turn-on and 0.1mS for turn-off) allowing for a high sample rate when monitoring several processes.

Contact your local sales representative or Coto Technology for additional details and assistance with specific applications.

The Coto 8L00 series is a general purpose Dual Inline Package (DIP) Reed Relay which has been streamlined for economy.

The Coto 8L00 Series matches the industry standard for fit, form and function and is ideal for telecommunications, process control and  instrumentation applications. The Coto 8L00 Series is available in both surface mount and thru-hole packages. Diode and shield options are available. Standard  configurations are 1A,1B,1C and 2A. Custom configurations are also available. The Coto 8L00 is designed to cross all DIP packages at an extremely competitive price. Stock 4-6 weeks.

A softened version of earlier Contura styles featuring gently curved corners and edges assuring compatibility with most any panel design. Intuitive feel is maximized by the use of 2 embossed circular pads located at opposite ends of the rocker. Any combination of Bar or Oval style lenses can be located in the pads providing a truly unique look, exclusive to Contura VII.

V-Series Switches Product Highlights
  •     Maximum sealing protection with dual seals around lamps and rocker stem certified to IP66 & IP68. Optional panel seals for additional protection.
  •     Silver plated butt contact mechanism provides 50 to 100 thousand electrical cycles and a variety of different electrical ratings.
  •     Roller pin mechanism does not require lubricants and allows the switch to withstand extreme temperatures.
  •     The switch base accommodates up to 10 terminals and a large variety of switch and lighting circuits.
  •     The multi-step mounting wings provide a secure fit for panel thicknesses of 0.032” thru 0.250” in an industry standard 0.830” x 1.450” mounting hole.
  •     The switch connector allows the user to preload FQC terminals for easy assembly to switch base.
  •     Numerous choices of removable rockers allow for style change without having to retest or re-qualify the switch base.
  •     Illumination options are endless with bar, oval, and square lenses available in choices of incandescent, neon and a wide variety of LEDs including superbrite, megabrite, flashing and bicolor lighting.
  •     Available with a variety of complimentary mounting panels, hole plugs, illuminated indicators and boots to accommodate most any design need.

OctoPlex’s touchscreen control of AC/DC circuit protection enables remote placement of breaker panels close to loads, the elimination of extensive home-run wiring to main panels, and substantial savings in wire, weight, and installation costs. Panels may be placed in unobtrusive, hidden locations, freeing up valuable cabin space onboard. Dual NMEA2000 communication plus redundant component architecture virtually eliminate the possibility of single-point failure. A generic module can replace any failed DC breaker and immediately assume the previous breaker’s settings. With over 30,000 OctoPlex DC circuit breakers currently in use, fewer than eight returned breakers have failed. The AC panels employ standard Carling breakers with manual operation capability, plus dual-bus communications.

Multi-function capabilities
OctoPlex will monitor AC power, batteries, DC open-load condition, and power feeds for alarming or for device activation, plus operate any desired single or multiple breakers from a mechanical switch. Any combination of AC or DC breakers may be activated. For example, one switch could turn off, or on, all outside lighting. Bilge and sump pump installation would utilize off-system circuit protectors to supply float-switch power, monitored by OctoPlex, and touchscreen manual pump operation and test. Maretron’s N2KView vessel monitoring displays NMEA2000 device data, with alarm functionality and touchscreen control of equipment such as air conditioners, ice makers, and watermakers. Displayed information may include engine and generator data, tankage, AC/DC electrical, battery monitoring, vessel position, course, weather, cameras, and much more. Display pages may be easily custom configured by the operator.

Mobile device compatibility
Apple and Android devices may run N2KView (the app is available at no charge). Page views may be easily configured by the user on the vessel’s N2KView server, and downloaded locally or remotely to the devices. Alerts may be configured for instant messaging or email notification. Maretron also offers a cloud service for offvessel connection. Owners may link to their vessels from virtually anywhere to view data and cameras, plus remotely control desired loads such as water heaters, air conditioners, and lighting. This not only saves electricity but also allows them to enjoy the convenience of setting devices as desired for later arrival at the vessel. If a high-water alarm is received subsequent to a float switch failure, the appropriate bilge pump could be activated while the owner is away from the vessel. Live cameras may also be viewed remotely. An owner could provide a function limited N2KView configuration to friends and relatives, enabling them to remotely view boat location, speed, course, weather conditions, plus live outside cameras.

Seamless operation
Working together, N2KView and OctoPlex have achieved seamless operation of vessel automatic load shedding. Any breakers may be listed in priority for load shedding. N2KView will automatically shed and reconnect the breakers in priority to prevent exceeding entered not-to-exceed amperages set for up to two power sources. Less power will be used during peak demand periods, and the aggravation of dock breaker tripping will be virtually eliminated. During times the galley is active, guests are taking showers, and hair dryers are being used, those totally aggravating blackout power shutdowns may be avoided. Additionally, automatic load shedding can facilitate the installation of appropriately sized generators, resulting in improved generator loading and longevity, plus weight and cost savings.

Together, OctoPlex and N2KView work to make an eco-friendly vessel. Enjoy the benefits of Green SeaEnergy.

ILLUMRA, the leader in wireless battery-free controls, announced the release of a new solar-powered light sensor that can run indefinitely on a few hours of light a day. The new product, when used with other wireless devices, creates a daylight harvesting solution that is both easy to install and use. This breakthrough technology may be seen at the upcoming LIGHTFAIR trade show in Las Vegas (EnOcean/ILLUMRA booth #2027).

“The new light sensor gives building owners a powerful tool to control costs,” said Jan Finlinson, director at ILLUMRA.Wireless Light Sensor “By reducing electrical light levels in a room and taking advantage of the ambient light, we could greatly reduce the world’s $200+ billion light bill*.”

The ILLUMRA light sensor communicates to controls through the uncrowded 315 MHz band, saving energy by lowering the output of artificial light when daylight is present in a room. Customers can reduce energy consumption 20 to 60 percent, depending on the devices used and the room configuration.

The wireless battery-free sensor communicates to a host of wireless products: relays, dimmers, room and task on/off controllers. It also integrates into systems using BACnet and wireless RS-232/Ethernet gateways.

Customers can use the new product in open-loop and closed-loop daylight-harvesting applications. When fully charged, the sensor can work in total darkness up to three days.

The ILLUMRA light sensor is small, measuring approximately 4x4x1 inches (10 x 10 x 2.5cm), and mounts on a ceiling or wall. Developed for indoor use, it has an internal antenna for best appearance, and an option to extend the antenna for best performance. The ILLUMRA light sensor is made of recyclable plastic, is RoHS compliant, qualifies for LEED credits and helps buildings comply with International Green Construction Code standard 189.1.

ILLUMRA, the premier supplier of self-powered, battery-free, wireless lighting and HVAC controls in North America has won "Best Dimming or Control" at The LED Show in Las Vegas. A panel of LED experts reviewed the dimmer and announced the award on August 27, 2010. The constant-voltage dimmer is available in a wireless or wired configuration that responds to hardwired or wireless battery-free controls to adjust the brightness of LED fixtures. The wired version is also available with an industry standard 0-10V input.

"ILLUMRA is providing the LED community with game changing technology," said James Highgate, Lighting Consultant and Director of the LED Show. "We are impressed with the dimming capabilities in such a small package. We see the potential for many manufactures to incorporate the ILLUMRA LED dimmer into their product line."

The new device uses 65,000 dimming steps to provide ultra smooth LED dimming at all light levels, eliminating the flicker that is commonly associated with LED dimmers. The units can dim 12V or 24V LED strips and are rated for loads of up to 5 amperes.

"We are proud to offer our award winning LED dimming solutions to customers who are embracing the future of lighting technology, " said Jan Finlinson, Director, ILLUMRA. "We are honored to have the LED experts confirm what our customers have been saying about the innovation and quality offered in our LED dimmer products."

Each dimmer has an input for a wired occupancy sensor. The wireless version responds to as many as 30 wireless switches or sensors. Buildings using ILLUMRA products may qualify for LEED credits and Energy-Star ratings. ILLUMRA products are manufactured in a ISO 9001:2000 facility, are RoHS compliant, and are FCC and IC approved.

ILLUMRA, the leader in wireless battery-free controls, announced the release of a new solar powered wireless Door/Window Sensor. This new product maximizes the energy savings of heating and air conditioning systems by providing wireless status of windows and/or doors. The breakthrough technology may be seen at the GreenBuild Show in Chicago, Illinois (EnOcean/ILLUMRA booth #583).

Energy waste can be reduced by 20 to 60 percent by disabling blowers and/or adjusting temperature setpoints in HVAC systems when windows and doors are left open. The wireless Door/Window Sensor is a key component to reducing energy waste in hotel, condominium and dormitory buildings.

“We are excited to help building operators reduce energy waste through the use of the easy to install, tamper resistant, maintenance free window/door sensors,” said Jan Finlinson, Director at ILLUMRA. “Energy management professionals can leverage this product to reduce operating costs and the environmental impact of the buildings for which they are responsible.”

The wireless battery-free sensor communicates using the EnOcean protocol to a variety of compatible actuator and controller products: thermostats, relays, room controllers; as well as BACnet and Ethernet gateways for integration with energy management systems. The sensor also includes on board energy storage that can operate the device in darkness for several days.

The ILLUMRA light sensor is small, measuring only 3.86 x .62 x .81 inches (98.04 x 15.75 x 20.57 mm) and attaches easily to doors and windows (peel and stick). The ILLUMRA light sensor is made of recyclable plastic, is RoHS compliant, qualifies for LEED credits and helps buildings comply with International Green Construction Code standard 189.1.

Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced that it has added a low-band RF mixer that enhances the user’s mobile connectivity experience by reducing intermodulation distortion in the crowded frequency spectrum for 4G LTE, 3G, and 2G systems. IDT’s new Zero-Distortion™ base transceiver station (BTS) diversity mixer offers improved system third-order intermodulation distortion (IM3) performance with reduced power consumption, covering the 450 MHz, Long-term Evolution (LTE) and extended global system for mobile communications (EGSM) frequency range.

The IDT F1102 is a low-power, low-distortion dual 400 - 1000 MHz RF-to-IF mixer that improves IM3 by over 15 dB, while simultaneously reducing power consumption by over 40 percent compared to standard mixers. These performance qualities result in better signal-to-noise ratio (SNR) for improved quality of service (QoS), along with lowered heat dissipation to ease heat-sinking requirements in the densely-populated radio card enclosure (1.15 W at 5 V and up to +43 dBm IP3O). Offering unmatched performance and efficiency, the F1102 is ideal for multi-carrier, multi-mode 4G LTE and EGSM BTS systems.

“Having observed the superior performance of our high- and mid-band mixers, our customers are demanding this product,” said Tom Sparkman, vice president and general manager of the Communications Division at IDT. “Our Zero-Distortion technology enables the customer to increase the radio card’s front-end gain to improve SNR, while simultaneously reducing distortion in the crowded EGSM and U.S. cellular bands. With our broad portfolio of high-performance, low-power variable gain amplifiers (VGAs), industry-leading timing, serial switching, data conversion and data compression products, IDT is a one-stop shop for communications signal chain solutions.”

As with other members of IDT’s mixer family, the F1102 offers fast settling time and a constant local oscillator (LO) input impedance in power-up and -down modes. This allows customers to power-down the mixer between time-division duplex (TDD) receiver slots, further reducing power consumption. In addition, the IDTF1102 can be used with either high-side or low-side injection, and is pin-compatible with existing devices on the market, offering a compelling upgrade option.

Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced the world’s lowest-power PCI Express® timing family. The new family of buffers and synthesizers offer unprecedented power savings and integration for communications, computing, and consumer markets.

The IDT 9FGVxxxx (synthesizers) and 9DBVxxxx (buffers) are the latest members of IDT’s leading portfolio of PCI Express solutions, which also includes switches, bridges, signal repeaters, flash controllers and timing. The new timing devices consume less than 50 mW of power – less than one-tenth the power required by previous solutions. The ultra-low power consumption reduces heat dissipation to ease cooling requirements in large-scale cloud computing applications, resulting in a typical datacenter energy cost saving of over $600 per rack per year.

“As the leaders in timing and PCI Express switching solutions, IDT’s expert engineering teams worked in concert to develop the best solution for PCI Express timing,” said Fred Zust, vice president and general manager of the Timing and Synchronization Division at IDT. “We understand that our customers want the highest level of performance with the lowest power consumption, and that’s exactly what our new family of devices delivers. Combined with our low-power PCIe® switches and flash controllers, IDT offers the most competitive and complete PCIe solution on the market.”

The new clock synthesizers and buffers are available with either integrated or external termination on the differential outputs. External termination provides designers maximum flexibility when working in a non-homogenous timing environment. Conversely, internal termination provides the most space savings and lowest discrete component count when working in a homogenous timing environment with 100 ohm differential transmission lines. All members of the new PCI Express timing family meet PCIe Gen 1, Gen 2, and Gen 3 performance requirements, allowing for long-lifecycle designs that customers can re-use through several generations of their products.

Most members of the new timing family feature a selectable SMBus address so that multiple devices can seamlessly share the same SMBus segment without the cumbersome additional logic that is often required with other solutions. Each differential output features an output enable (OE#) pin, providing system designers with the flexibility required for advanced power management schemes. In addition, the devices feature SMBus-configurable differential slew rate for each output and SMBus-configurable differential amplitude for signal integrity tuning. The new synthesizers and buffers are currently offered in 2-, 4- and 8-output variants. Additional functions and output variants are under development.

Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced the industry’s first NVM Express (NVMe) enterprise flash memory controller with native support for PCIe® Gen 3. IDT’s NVMe flash controller family provides a standards-based solid-state drive (SSD) solution, enabling storage and server original equipment manufacturers (OEMs) to overcome latency and throughput bottlenecks inherent to legacy SAS/SATA-based SSD designs.

IDT’s new flash memory controller family consists of two versions: 16-channel with PCIe x4 Gen 3 (89HF16P04AG3) and 32-channel with PCIe x8 Gen 3 (89HF32P08AG3). The flash controllers are designed to fully comply with the NVMe standard – a standard that defines an optimized register interface, command set, and feature set for PCIe SSDs. The goal of the standard is to help enable the broad adoption of PCIe-based SSDs, and to provide a scalable interface that realizes the performance potential of SSD technology now and into the future. This eliminates the need for OEMs to qualify multiple SSD drivers, facilitating the widespread use of PCIe SSDs and helping bring to market dramatic improvements in storage latency, throughput, power consumption and cost. 

“As a founding member of the NVMe promoter group and developer of the world’s first PCIe enterprise flash controller announced last year, IDT is leading the charge in PCIe-based flash controller innovation,” said Kam Eshghi, senior director of marketing of the Enterprise Computing Division of IDT. “For many data center applications, NAND flash read and write speeds are exceeding the capabilities of legacy SAS/SATA interconnects. IDT has developed a family of NVMe-compliant PCIe flash controllers that dramatically boost the number of random I/O operations per second (IOPS) that a system can process, while concurrently reducing latency, power and cost by eliminating the traditional storage infrastructure. Early traction and other positive indicators suggest a rapid proliferation of this technology, and IDT is ready to support it.”

“NVM Express delivers a critical building block for the broad adoption of PCIe-based SSD solutions,” said Amber Huffman, senior principal engineer in the Storage Technologies Group at Intel (NASDAQ: INTC) and chairperson for the NVM Express Workgroup. “IDT is an early adopter and contributor to the PCIe and NVMe ecosystem. We’re pleased to see NVMe SSD controller products shipping from companies like IDT as part of a growing NVMe ecosystem enabling next-generation PCIe SSD designs.”

“The enterprise SSD market is expected to undergo tremendous growth, comprising approximately half of the total SSD market sales in 2012,” said Joseph Unsworth, research vice president at Gartner. “By 2015, we expect the PCIe enterprise controller market to more than quadruple to nearly 3.5 million units. Companies who can deliver fully functional high-performance controller solutions will be best positioned to penetrate the market opportunity.

IDT’s PCIe flash controllers are sold to enterprise SSD developers who manufacture standards-based NVMe SSDs with PCIe Gen 3 or Gen 2 host interfaces. These SSDs are then used in enterprise-class centralized storage systems, server caching applications, and other systems requiring high-performance storage drives. End users deploy these PCIe SSD-based systems in their data centers for cloud computing and business-critical applications, such as online transaction processing, financial data processing, database mining and any other applications that are sensitive to storage performance.

In addition to fully supporting the PCIe Gen3 host interface for maximum throughput, IDT’s flash controllers are fully programmable, enabling customers to differentiate their solutions with custom firmware that leverages IDT’s reference firmware. Moreover, IDT’s product family is architected to maximize random storage I/O performance – a critical requirement driven by multi-core CPU designs and virtualization. The flash controllers also support enterprise-class features, including advanced encryption, data integrity and reliability features.

Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced that it has become a member of the Alliance for Wireless Power (A4WP), an independently operated organization composed of global wireless power and technology industry leaders. The A4WP will focus on a new wireless power transfer technology that provides spatial freedom for charging of electrical devices in cars, on table tops and for multiple devices simultaneously.

“We are excited to join the A4WP and to help steer the direction of a new technology standard,” said Arman Naghavi, vice president and general manager of the Analog and Power Division at IDT. “With IDT’s experience in developing the award-winning, highly integrated IDTP9030 and IDTP9020 wireless power transmitter and receiver chipset, we look forward to meeting the challenges of next-generation wireless power transfer technologies.”

“We are pleased to welcome IDT as a member of the Alliance for Wireless Power,” said Dr. Kamil A. Grajski, president of the A4WP. “Mobile consumer electronics devices, including smartphones and tablets, are more power-hungry than ever. Wireless power incorporating spatial freedom promotes flexible ease-of-use in charging these devices at home, in the office and on the go. IDT is a key addition to the growing list of global leaders in this new wireless power ecosystem.”

The goals of the A4WP are to establish an industry standardization body to provide innovative methods of supplying charging technology based on spatial freedom to a broad base of consumer electronic devices, and to grow the use of cable-free-power technology worldwide. IDT has become a leading innovator in wireless power ICs, having recently announced the world’s first true single-chip wireless power transmitter solution.

Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced that it will demonstrate its industry-leading products at the 2012 Intel® Developer Forum, September 11-13. IDT will exhibit select products that power, connect, and support Intel-based products and systems, including NVM Express (NVMe) flash controller, PCI Express® (PCIe®), timing, signal integrity, and RapidIO® solutions.

IDT will display a performance demonstration of its recently announced NVMe PCI Express flash memory controller. The 16-channel PCIe x4 Gen 3 (89HF16P04AG3) and 32-channel PCIe x8 Gen 3 (89HF32P08AG3) flash controllers are designed to fully comply with the NVMe standard – a standard that defines an optimized register interface, command set, and feature set for PCIe SSDs. This allows OEMs to build standards-based solid-state drive (SSD) solutions that dramatically improve performance and overcome throughput and latency bottlenecks inherent to legacy SAS/SATA-based SSD designs. IDT will also participate in the NVMe community booth at IDF alongside other industry leaders active in the development and use of NVMe. The NVMe community will be in Booth 440.

Alongside the NVMe flash controller, IDT will demonstrate its latest high-performance PCIe switches along with the industry’s first PCIe 3.0 signal-conditioning re-timers, targeted at enterprise computing, storage and communications applications. IDT will also showcase the industry’s first PCI Express Gen 2 to Serial RapidIO Gen 2 protocol conversion bridge – a breakthrough device that extends scalable RapidIO-enabled peer-to-peer multiprocessor clusters to the x86 processor environment.

Information on IDT’s current wireless power solutions and a recently announced development partnership with Intel will be available at the IDT booths. Intel recently selected IDT to develop an integrated transmitter and receiver chipset for Intel’s wireless charging technology based on resonance technology, as a result of IDT’s proven skill to integrate the required features and functionality into a monolithic solution. The IDT wireless power solutions offer unprecedented integration that results in significant space and cost savings in next-generation wireless power products.

Intematix, a leading innovator of patented phosphors and phosphor components for high-quality LED lighting, today announced three-dimensional additions to its ChromaLit™ Collection. The new forms and light output levels improve the quality of light from LED bulbs, lamps and innovative fixture designs. The latest ChromaLit technology will be on display at LIGHTFAIR International 2011, the world’s largest annual architectural and commercial lighting trade show and conference, May 17-19 in Philadelphia, PA.

“Our newest ChromaLit products offer almost 360 degree light distribution, effectively serving as the core of the next generation LED light bulb,” said Julian Carey, Intematix Director of Marketing. “In the past, bulb designs have presented challenges to LED lighting designers. Our latest remote phosphor solutions accelerate the development of products with high light quality, high efficacy and smooth and broad radiation patterns needed by the marketplace.”

Compared to conventional LED designs, where blue chips are coated with a phosphor compound, the ChromaLit Collection leverages a phosphor composite separated from the blue LED energy source. The latest ChromaLit products employ compound optical forms and offer a choice of wide radiation patterns ideal for bulb, pendant, lantern, decorative and other lighting applications. Additional benefits include:
  •     High color quality and color consistency
  •     Glare-free LED bulb and fixture design
  •     Unprecedented design freedom for solid-state lighting
  •     Streamlined supply and production of LED lighting systems
  •     Up to 30 percent higher system efficacy compared to conventional LED lighting designs
  •     Improved thermal performance
  •     Customizable shape, size and color

Intematix, a leading innovator of patented phosphors for high-quality LEDs, today announced new additions to the ChromaLit™ Collection of remote phosphor light sources. In response to high demand following its January launch, ChromaLit light sources are now available in 110 optimal shapes, color temperatures and Color Rendering Indexes (CRI). ChromaLit optimizes light quality and efficacy performance for applications like down, spot, under-cabinet, linear, task, area, ceiling panel and industrial lighting systems. The entire ChromaLit family is now available through Future Lighting Solutions, a global provider of LED lighting solutions.

"We are pleased to offer the complete ChromaLit light source family of products to our customers," said Jamie Singerman, Corporate Vice President of Future Lighting Solutions. "This transformative technology opens doors for the lighting industry and effectively complements Future's extensive lighting technology portfolio."

In order to provide more options for customers, ChromaLit is now available in additional round options, as well as square, linear and panel varieties. Compared to conventional LED designs, where blue chips are coated with a phosphor compound, ChromaLit leverages a phosphor composite precisely layered onto a substrate, separated from the blue LED energy source. In all of the ChromaLit products, this architecture provides unparalleled design freedom, more efficient manufacturing processes, exceptional light quality and up to 30 percent higher system efficacy.

"We are excited to work with Future Lighting Solutions. Future's deep LED lighting knowledge and broad technology offering enable creative solutions and support for Chromalit customers," said Julian Carey, Director of Marketing at Intematix. "ChromaLit is an incredibly versatile product that elevates luminaire design freedom. The new shapes, color temperatures and CRI values we've added to the collection offer virtually limitless options to our growing customer base."

The ChromaLit Collection implements precision optics manufacturing and Intematix's cutting-edge phosphor technology to provide lighting manufacturers with the capability to create previously unimaginable lighting systems in any shape and any color. In addition to the standard sizes, ChromaLit products are customizable in geometry, color temperature, CRI and substrate material, offering flexibility and creative opportunities never before seen in luminaires.

Technical data and samples are available upon request. More information is available at Future Lighting Solutions and the Intematix website.

Intematix, a leading innovator of patented phosphors for high-quality LEDs, today introduced ChromaLitTM, the groundbreaking family of remote phosphor light source solutions. ChromaLit is now generally available to LED luminaire and lighting module manufacturers, providing unparalleled design freedom, more efficient manufacturing processes, exceptional light quality and up to 30 percent higher system efficacy.

The ChromaLit collection implements precision optics manufacturing and Intematix’s cutting-edge phosphor technology to provide lighting manufacturers with the capability to create previously unimaginable lighting systems in any shape and any color. ChromaLit products are customizable in geometry, color temperature, CRI and substrate material, offering flexibility and creative opportunities never before seen in luminaires. Uniform, curvilinear and three-dimensional lighting designs are now made possible where challenges existed with conventional LED approaches.

“By separating the phosphor from the chip, Intematix has created a customizable lighting solution of the highest quality, an innovation destined to disrupt the lighting industry,” said Mark Swoboda, CEO of Intematix. “ChromaLit is the natural culmination of Intematix’s dedication to materials discovery and phosphor expertise, designating the phosphor as the arbiter of light quality.”

Compared to conventional LED designs, where blue chips are coated with a phosphor compound, ChromaLit leverages a phosphor composite precisely layered onto a substrate, separated from the blue LED energy source. This new technique allows lighting system manufacturers to keep the phosphor performance stable over the module’s lifetime and design color-consistent, uniform luminaires. In applications such as retail and hospitality lighting where color consistency is as challenging as it is critical, ChromaLit creates uniform, high-quality, diffuse light throughout the space.

“Our ChromaLit light sources add great momentum to the conversion of general lighting to solid state,” said Julian Carey, director of product marketing at Intematix. “We offer the critical link that enables our customers to achieve the efficacy and reliability benefits of LED lighting while overcoming the challenges historically posed by LED architectures. Now, solid-state luminaires can have phenomenal design freedom, streamlined production and glare-free, consistent light.”

Additionally, luminaire manufacturers now have the option of interchangeable ChromaLit light sources. This enables manufacturers to simplify LED binning management and reduce inventory. A blue LED energy supply unit can be stocked, along with compact and easily swappable ChromaLit light sources instead of many individual completed luminaires.

Since it operates at a lower temperature and maximizes photon extraction, the ChromaLit architecture produces significantly more light per input power. In addition, ChromaLit eliminates the necessity of a diffuser and provides up to 30 percent higher system efficacy than conventional LED lighting systems, both in white illumination and in colored specialty lighting applications like signs and signals.

Expanding its product portfolio in high-density Integrated Passive Devices, IPDiA, a leading supplier of Silicon passive components, has today introduced a new generation of PICS technology, dubbed PICS3, which has recorded 250 nF/mm2 capacitance density for demanding applications including medical, aerospace, industrial, communication and defense.

“Delivery of Silicon capacitors with several µFarad capacitances is now a reality”, said Laurent Dubos, IPDiA marketing manager.

Thanks to its patented and leading PICS technology, IPDiA integrates up to hundred passive components (resistors, capacitors, inductors and diodes) in a single silicon die, as well as a single 10 µfarad capacitor offering an upgrade solution to tantalum or ceramic capacitors with the “out of standard performance” of the silicon passive component.

IPDiA produces standalone Integrated Passive Devices (IPD) or passive component networks that can be reflow or bumped, both on main electronic boards as well as in System in Package (SiP).

IPDiA, leader in 3D Silicon components, will develop new high performance Integrated Passive Devices (IPD) and innovative System in Package technologies with its partners (CEA LETI, CNRS - LAAS and - CRISMAT, 3D Plus, ELA Medical, Gemalto, Kalray, MOVEA).

To reach miniaturization and reliability requirements increasingly necessary in applications such as implantable medical devices and smart cards, IPDIA will develop new structures and processes to:
- Design new high performance Integrated Passive Devices working in severe environments.
- Develop new packaging technologies for system miniaturization.

PRIIM supports IPDiA real innovative industrial services for IPDs and Assembly.

IPDiA, a leading supplier of silicon passive components and 3D silicon packaging is offering what is probably the first call to participate to a Through Silicon Via (TSV) Multi Part Wafer (MPW) or so-called “pizza mask”.

Through Silicon Via technology is known to offer numerous advantages:

• Application and electrical performance benefits with shortest connections between dies for sensitive signals;

• Double side assembly solution resulting in package design simplification and better power supply redistribution;

• High density packing and financial benefit with a high degree of miniaturization and therefore lower costs.

Thanks to this MPW opportunity, companies which would like to make an evaluation design with Through Vias in Silicon could take advantage of this open proposal and have the product available within a very short leadtime for applications such as:

• Interposer with System in Package (SiP);

• Wafer Level Package (WLP);

• Interposer for Submount;

• Die stacking for volume constrained applications;

• HB LED packaging platform.

IPDiA to introduce, what is probably the first 100 Volt TVS protection diode available for HB LED lighting application.

IPDiA, leader in 3D Silicon components, brings innovation and vision to the High Brightness LED marketplace by introducing 100 Volt ESD component protection specifically designed for HB LED ESD protection.

More and more , in order to reach the level of lumen that could be compliant with the latest market requirements, HB LEDs are designed using serial string of LEDs. Furthermore, these HB LEDs are extremely sensitive to electrostatic discharge, and should be protected by side mounting TVS component or Silicon submount platform integrating this ESD protection.

CEA-Leti and IPDiA have formed a common lab to capitalize on their complementary expertise in miniaturization and 3D integration on silicon.

The common lab is dedicated to developing new 3D-integration technologies for passive electronics components on silicon and will open the door to new applications in promising markets such as LED lighting, healthcare and aerospace that require extreme miniaturization. The partnership also will pave the way to improved miniaturization of passive components such as resistors, capacitors and inductors.

Specifically, the common lab is designed to develop:
  •     Very high-end passive components on silicon that will resist harsh environments
  •     Functional sub-mounts for lighting components
  •     Innovative assembly technologies allowing ultra-miniaturization of future products
IPDiA was founded in 2009 to commercialize innovative 3D technologies for integrating passive components. The company’s two axes of focus are integrated devices for high brightness LEDs and integrated passive devices for new medical, industrial, aerospace and defense markets.

CEA-Leti’s expertise in 3D technologies will allow IPDiA to go beyond the third generation of Passive Integration Connecting Substrate (PICS) components (250nF/mm²), which are being produced at IPDiA’s Caen site, and pursue the development of a future generation of PICS components (1µF/mm², then 2µF/mm²) and their assembly.

These products are designed, developed and manufactured by IPDiA in its production unit.

“The technologies to be developed in the common lab are one of the corner stones for industrial development of IPDiA, and our competencies in developing passive components in silicon will allow us to put a real industrial and independent offer in place,” said Franck Murray, CEO of IPDIA. “This partnership is also the result of a great human adventure, a common work between teams from various backgrounds generating creativity and new ideas.”

“This collaboration is in line with Leti’s strategy of working with innovative partners to develop and commercialize new technologies, it and will allow us to position ourselves in the front line of high-performance passive components on silicon

interposers,” said Leti CEO Laurent Malier. “Our complementary competencies in materials and 3D-silicon integration bring strong added value to this common lab.”

Thursday, September 27, 2012

HARTING developed a high flexible coding system designed for the D-Sub miniature connector ranges. This coding system prevents to connect cable assemblies to the wrong I/O front panel port equipped with several identical D-Sub miniature connectors.

The HARTING coding system offers 36 different variants adaptable on all D-Sub miniature ranges with shell type E. It may either be assembled by the customer with an adapted HARTING service tool or be delivered as a complete assembled version. The new system is suitable for Standard D Sub 9 poles, D Sub High Density 15 poles and D Sub mixed 2W2 – 2W2C – 5W1.

The HARTING D-Sub coding system can be fitted with two female screw locks on existing front panels without any specific modification. For the cable side, the coding frame and standard cable connector fit into the HARTING Inducom metal hood ranges.

The new Han®Shielded Module is now available for the HARTING technology group’s Han-Modular® series. This is specifically intended for applications in which shielded signal cables are to be designed to function free of interference and to mate securely.

A special hallmark of the system is the fact that up to 20 shielded signal contacts can be connected with a minimum space requirement. The perfect metallic shielding reduces to zero any interference from directly adjacent power modules. Specifically in applications with frequency converters, the power cables can often transfer interference to signal cables. With the new shielded
Han® Shielded Module, the signal contacts are now shielded against any such adverse effects. This now enables power and signal modules to be transferred in a connector without interference and securely, even in extreme electrical signal conditions.

In the form of the fully screened Han® Megabit Module, the HARTING Han-Modular® series is joined by a new member, which is especially suited for applications in industry and railway technology. Two data cables can be connected per module and assembly convenience and product compactness prove to be a great advantage for users.  Here, the screening design is independent of that of the housing. The proven Han® D crimp contacts are used. These can be installed into the inserts and arranged to be easily accessible.

Because its mechanical properties meet those of the proven Han®Quintax, the Han® Megabit Module is ideally suited for applications with the highest mechanical specifications, for example for use as an Ethernet interface in railway carriage connections – with the module taking up only half as much space as conventional solutions.

The successful Ha-VIS preLink® technology from HARTING is taking further components on board. Whatever a particular application requires, a connector module can be fitted into the recently developed, universal M12 housing. Possible types are a D-coded version for 4-core data cables with transfer rates of up to 100 Mbit or a variant with X-coding for 8-core data cables, suitable for 10 Gbit.

Among the special features of innovative preLink® connection technology is a termination block, which is connected to the individual cores of the particular data cable via internal, innovative insulation displacement terminations, which remain stable over time and are vibration-proof. The cable assembled in this way is attached securely to the connector by means of the spring contacts fitted in the module, enabling the stringent shock and vibration standards of railway standard DIN EN 50155 to be met.

In addition, the module is designed with a shielding spring which creates a reliable contact between the cable screening and the metallic M12 housing. A set of seals with slotted seals completes the scope of delivery.

HARTING has now equipped its established Han® HC Modular 650 contacts with crimp termination. These are plug-compatible with existing variants with axial screw termination and create even greater design flexibility for customer applications.

The contacts are fixed in a plastic insert, which creates a one-pole high-current contact. This can be inserted into the existing frames, which means that various interfaces with between 1 and 4 contacts can be created in connection with the Han® HPR housing series. The crimping tools to create the termination between the new Han® HC Modular 650 Crimp Contacts and the appropriate cable cross sections are of course included in the HARTING product portfolio.

High-current contacts are used predominantly in the railway industry. By introducing the new crimp variants, HARTING is responding to requests for alternatives to axial screw termination technology. Assemblies of large cable cross sections can now be produced in ideal configurations using either crimp or field-assembled axial screw technology.

HARTING strives consistently to expand its technical expertise in the field of M12 connectors. As well as field-assembled connectors, the M-12 D-coded overmolded cable assemblies, with straight and angled versions, are now also part of the product portfolio. This ensures reliable data transmission, also in environments affected by electromagnetic interference.

The outstanding screening concept combined with a design aimed at optimum data rates ensures reliable and interference-free data transmission, also where special industrial standards are expected of the M12 cable assemblies. Naturally, all 4-wire cable connections from the HARTING portfolio are overmolded with the new optimized M12 components. This enables the new development to meet the different requirements encountered in the industrial Ethernet segment. Accessories include the appropriate cables in 100-meter rings and also 500 meter cable drums.

HARTING has decided to expand its well-known Han-Eco® series with more housing variants. Han-Eco® - robust connector housings in glass fiber reinforced high-performance plastic – gives the customer weight advantages, plus others, not least of improved cost / performance ratio. Their distinctive features are outstanding mechanical properties and excellent resistance to environmental factors. In comparison with the Han® B standard series, they also provide greater contact density through an additional module space.

In addition to products already available, an extra variant for outdoor applications has been available since May 2012. High-quality profile and flange gaskets in fluorine rubber (FPM) extend the range of uses to outdoor applications. The particular feature of FPM as a special sealing material is its excellent resistance to the effects of the weather, especially UV radiation, ozone pollution and high temperatures. It also impresses with high chemical resistance, for example to mineral oils, synthetic hydraulic fluids, fuels, aromatic compounds, many organic solvents and chemicals. This material has stood the test of decades of use in the Han® M housing series.

In combination with the high-performance plastic used, HARTING has developed a product which, seen as a whole, also creates weight advantages for outdoor applications.

HARTING has added a slim variant to the product portfolio for the gigabit Ethernet application environment. The new har-speed M12 Slim Design with crimp connection technology is significantly smaller in both diameter and length. The external diameter was cut back to 16.5 mm to achieve high integration density on relevant devices, switches for example. The design also has a considerably more robust housing capable of resisting torques greater than 1.5 Nm. The connector is designed to conform to IEC 61076-2-109 and meets Cat. 6A and performance class EA. In the 8-wire Ethernet environment, the new HARTING har-speed M12 connector definitely cuts a fine, slim figure.

Han® HC Individual is the new HARTING product family for universal contact arrangement options. Individually sealed 350 A contacts (protection class IP 66) can be arranged in adjacent configurations of up to 10 connections on one supporting rail. This interface can be very easily separated thanks to a stainless steel lever system with integrated contact guide. Each individual connection can be assembled separately, and engaged and exchanged individually.

Depending on the application demands, the supporting rails can be stacked one above the other to create a high-voltage block with a variety of extension options in the vertical and horizontal planes. The current version is capable of supporting a cable range of between 25 mm² and 120 mm² with up to 350 A rated current and 3600 V rated voltage. All components were subjected to vibration and shock tests pursuant to railway standard IEC 61 373 and are in flammability class I2/F2 under NFF 16-101/102. These performance indicators in combination with the individual arrangement options qualify this product family for railway applications involving carriage connections, traction engines and converters.

HARTING is expanding its product portfolio with regard to crimping tools for Han® high-voltage contacts. As well as the proven 130 kN manual crimping tool, a battery-driven hydraulic crimping tool is now available, which simplifies and accelerates the assembly of high-voltage contacts.

Using the new battery-driven hydraulic crimping tool, crimp contacts can be made with cable cross sections of between 10 mm2 and 240 mm2. For cable cross sections between 10 mm2 and 150 mm2, the existing pressure dies of the manual crimping tool are used and inserted into the appropriate die holder.  For crimping cable cross sections between 185 mm2 and 240 mm2, special crimping dies inclusive of die holder are available. Because of the construction consisting of a die holder and pressure die, it is easy and quick to switch to a different cable cross section. The scope of supply includes a battery charger and a second battery, which is especially helpful for large volume crimping operations.

In developing the HARTING D20 full metal housing for DIN 41612 connectors the emphasis was on flexibility and handling convenience. For example, where components are installed in difficult-to-reach or confined spaces, to ensure they can be screwed in easily, internal hexagonal screws were selected as fixing screws for the D20 housing. Even if the angle is less than 25°, a ball head screwdriver can still be used.

These new metal fixing elements represent an excellent addition to the housing range plus further locking options. The new metal fixing elements create a robust mechanical connection thanks to their established screwing technology combined with a recently developed alternative screwless locking option. The D20 full metal housings can be secured manually with a noticeable ‘click’ – no additional tool needed. This makes locking and unlocking more convenient and faster. The locking levers simplify operation significantly and can also be used to aid insertion or removal of daughter cards in the 19” rack. Especially when a large number of daughter cards, closely packed, are used, this easily accessible removal aid is a great help because less force is needed. The permanent electrical connection provided by the fixing element ensures that the housing and the racking system are always in contact, hence the ideally enhanced screening properties with screening attenuation of over 30 dB characteristic of the special HF D20 housing. The robust and vibration-proof D20 housing range is the system of choice for railway applications. This explains why the new fixing element is also designed to be vibration-proof and why the plastic used for the ejection lever has the fire classification and smoke index suitable for railway applications: I2/F1 under NFF 16-101.

In less than 40 years, the Villefranche-sur-Saône site in France, located right in the heart of Beaujolais, has become one of the leading sites in Europe.

Above all endowed with an ideal geographic location, thanks to its central position in Europe, the site in Villefranche-sur-Saône ensures the production of some industrial use adhesives, including notably hot melt adhesives, a type of thermoplastic adhesive. The site has industrial clients all around Europe and also several customers from Turkey, Africa, the Middle East, Canada, Australia and South America. The plant is one of Henkel’s biggest European sites manufacturing hot melts used in lighting and the assembly of vehicle parts.

Essential attributes
As well as its geographic positioning and its high production capacity, the site has a good number of other attributes. For example, its hot melt production testing unit (pilot plant) is one of them. New adhesives developed in research laboratories can only be made in maximum quantities of 1 to 5 kg in the labs. Often, customers require 15, 20 or even 200 kg of product to test the new adhesive on their machines. However, our factories only produce quantities of at least 1 tonne. The on-site pilot plant enables Henkel to scale up new products to customers’ needs but also to check, learn and optimize their future manufacturing process before making the transition to an industrial scale. This pilot facility constitutes a considerable competitive advantage as not all adhesive manufacturers dispose of such a tool.

Villefranche-sur-Saône site also benefits from having high-capacity storage warehouses, located within the site and managed internally, as well as an application laboratory dedicated to providing technical assistance for customers, regardless of the market concerned. Finally, Villefranche-sur-Saône boasts a fantastic customer services department supporting the business at some 670 clients, and benefits from the ISO 9001 version 2000 and ISO TS 1649 certifications for the automotive industry, as well as ISO 14001 and OHSAS 18001.

Permanently evolving
Particularly dynamic, Villefranche-sur-Saône site is constantly working to improve its services: increasing productivity, new packaging line automation for certain adhesives, production procedures uploaded to the Intranet, improvement of the organization and cleanliness of the site, safety and communication, and so on. With a highly enthusiastic team, composed of more than 135 people of 13 different nationalities, the site does much to encourage multicultural enrichment and team spirit. Thanks to the pleasant working environment, it is clear to see the conviviality and personal investment of the employees of the Villefranche-sur-Saône site, as well as their close involvement in the development of the site and their clear aim to constantly improve it, both economically and in terms of relations. Understandably, the teams thus prove very successful in the development of joint actions, either for internal purposes (open day for families, safety day), aiming to develop a positive working atmosphere, or on a larger scale, like the organization of an event for the Telethon, an annual national event to collect money for medical research.

Adhesive technologies are increasingly used in the car industry and in vehicle repair shops. Adhesive bonding is replacing conventional joining techniques such as welding, riveting or bolting. This not only increases safety but also simplifies many production operations. At Automechanika 2012, Henkel will be presenting recent product innovations and a broad product portfolio for reliable car repair in OEM quality.

Henkel has developed two new high-performance adhesives for repairing plastic components on vehicles and for bonding body parts. The new products are particularly low in emissions and thus offer excellent health and safety attributes. More and more automotive components – from bumpers, fenders and spoilers to the fuel flap – are made from plastics of every kind. If these components crack or break, then a dependable adhesive is required.

Teroson PU 9225 SF ME and Teroson PU 6700 ME
Mixing the two-component adhesives is extremely easy thanks to a special mixing nozzle that is used to apply them. The two components are mixed automatically in the nozzle, ensuring the optimal quality of the adhesive during application. Teroson PU 9225 SF ME can be used to repair all plastic parts on the vehicle exterior. The product has a pot life of two minutes, is applied at room temperature and subsequently cured using an infrared heat source at 60 to 70 degrees Celsius. Teroson PU 6700 ME is ideal for bonding different materials. The product can be used for metal, wood and most plastics and on painted surfaces. The adhesive cures in around ten minutes, regardless of the ambient temperature and the humidity level.

Low odour and low bloom: Loctite 403, 408 and 460
Loctite 403, 408 and 460 are three improved instant adhesives from Henkel that can be used for bonding virtually any materials. Already market leaders in terms of health and safety, these products now offer even better performance.

The three Loctite instant adhesives are suitable for bonding almost all materials, from plastic through metal to rubber. Thanks to a special formulation, they do not irritate the skin, nor does their safety data sheet list any hazard symbols or chemical substances that pose a risk to health. In launching these improved products, Henkel is strengthening its portfolio of innovative solutions with regard to occupational health and safety. The improved formulation has higher moisture tolerance and leads to a longer lasting bond.

Long processability, straightforward mixing: Terokal 5010 TR
Terokal 5010 TR, the two-component material being unveiled by Henkel at Automechanika, is an entirely new solution for the perfect repair of body damage – and far superior to hot soldering using tin. The product, which is sold under the Teroson brand name, has been tested by the “Allianz Zentrum fuer Technik” with positive results.

For workshops, the use of Terokal 5010 TR offers significant time and labour savings. In contrast to working with tin, no high temperatures are required and the vehicle components do not have to be dismantled and then fitted again following the repairs. Neither is there any impact on the plastic components close to the repair, as the application and curing temperatures are no higher than if the vehicle was standing in bright sunlight.

New flange sealant silicones suitable for throughout the vehicle
Sealing mechanical components is made even easier with Loctite new silicone products, Henkel is unveiling at this year’s Automechanika in Frankfurt. The innovative premium silicones were developed to satisfy the highest demands in automotive repair shops. Henkel is completing and optimising its silicone sealant line with two new products Loctite SI 5660 and Loctite SI 5990 in addition to the well-known Loctite SI 5980 Quick Gasket. The silicones can be used for sealing a variety of components on the vehicle, for example in the engine compartment they are used on the oil pan, water pump and valve covers. All three products adhere to both metals and plastics.

Henkel, the world’s largest manufacturer of adhesives, sealants and surface technologies, supplies the innovative products in a user-friendly ready-to-use cartridge developed especially for workshops. The sealant is applied from the pressurised cartridge through the integrated nozzle, without the need for an additional dispensing device.

Environmentally compatible corrosion protection at OEM level
Free from volatile organic compounds, or VOCs, the Terotex Aqua product line from Henkel is designed for corrosion protection on vehicles. Working with the products does not pose any risks to the user’s health, while the repair shop can reduce its VOC emissions.

Welded metal repairs, new body panels, retrofitted spoilers, tuning components and even spare parts are used during the repair work all require comprehensive corrosion protection. In most cases, only a primer has been applied to the parts and this is insufficient to prevent corrosion occurring in the long term. In addition, the existing corrosion protection may have been removed or damaged by welding, cutting or grinding work and the associated high temperatures. The result is weaknesses in the body that compromise the safety, comfort and look of the vehicle.

For comprehensive corrosion protection, Henkel has developed the Terotex Aqua product line for the auto repair industry. This high-quality coating range guarantees maximum corrosion protection and, because it does not contain solvents, also offers an environmentally friendly alternative to conventional products. The products do not pose any health risks for the workshop employee, while the workshop can reduce its VOC emissions in compliance with legislation.

Further training initiative with added value benefits for practitioners
Messe Frankfurt has launched a “Further training” campaign as part of this year’s Automechanika. An important component of the campaign will be the “accident damage repairs” training package. The goal here is to give interested participants practical sessions on this demanding area of work and allow them to try out tools and methods themselves. One workshop will be hosted by Henkel.

During the “Body bonding techniques” workshop – Henkel, with its Teroson branded products, will show participants chemical bonding materials as important elements of today’s vehicle bodies. They will receive information about health and safety regulations regarding the use of chemical products and will have the chance to apply the products themselves. Participants will also find out about the main tools used to apply sealants and adhesives. Here too there will be a hands-on component, the aim of which will be to return a vehicle body as closely as possible to its original appearance following the repair process.

Henkel at the fair
At the leading international show for the automotive industry, visitors can learn about the latest innovations in adhesives and sealants at the Henkel stand A05 in Hall 11. Visitors will find Henkel as well at the education and training hall GAL1 at stand A03.

Free from volatile organic compounds, or VOCs, the Terotex Aqua product line from Henkel is designed for corrosion protection on vehicles. Working with the products does not pose any risks to the user’s health, while the repair shop can reduce its VOC emissions.

Welded metal repairs, new body panels, retrofitted spoilers, tuning components and even spare parts are used during the repair work all require comprehensive corrosion protection. In most cases, only a primer has been applied to the parts and this is insufficient to prevent corrosion occurring in the long term. In addition, the existing corrosion protection may have been removed or damaged by welding, cutting or grinding work and the associated high temperatures. The result is weaknesses in the body that compromise the safety, comfort and look of the vehicle.

For comprehensive corrosion protection, Henkel has developed the Terotex Aqua product line for the auto repair industry. This high-quality coating range guarantees maximum corrosion protection and, because it does not contain solvents, also offers an environmentally friendly alternative to conventional products. The products do not pose any health risks for the workshop employee, while the workshop can reduce its VOC emissions in compliance with legislation.

Environmentally compatible corrosion protection at OEM level
Terotex Aqua is fully compatible with the corrosion protection materials used in the auto industry, thereby ensuring a good match with the existing PVC coating on the original parts. One particular advantage for workshops is the restoration of a uniform surface texture in OEM quality that matches the original finish.

Terotex Record 2000 Aqua for perfect underbody protection
The underbody is an expansive area that is particularly vulnerable to corrosion. It can be damaged by stones thrown up by the wheels, road salt and other environmental influences. Terotex Record 2000 Aqua provides uncompromising protection and an OEM appearance for new parts. Alongside high abrasion resistance, the waterborne protective film has good adhesive properties, even at very low temperatures. Straightforward to apply, the product is also suitable for coating large areas. A protective film is applied to the underbody using a spray gun at a distance of around 30cm. Only one pass is required for an optmum wet-film thickness of 1.2mm. Terotex Record 2000 Aqua provides a strong and permanent bond with the underbody, and can be overpainted with water-based paints after a period of 24 hours.

Terotex Super 3000 Aqua for effective protection against stone chips
Stone chips are another frequent cause of damage to paintwork and undercoating, which in turn leads to the formation of rust. Terotex Super 3000 Aqua was developed to provide perfect protection in OEM quality. This waterborne corrosion protection product is compatible with all vehicle substrates and is available in white, black or grey, allowing the original OEM structure to be recreated. After the repair area has been thoroughly cleaned, Terotex Super 3000 Aqua stone chip protection is applied using a practical gun with pressure regulator or a filler/paint gun. The opportunity to produce different surface structures and layer thicknesses from coarse to fine ensures a uniform appearance, even following repair work. After around three hours of air drying, the area can be overpainted using any standard water-based vehicle repair paint. The body colour may be added to all three colors.

Terotex HV 450 Aqua for cavity protection
Following repairs to components with cavities (e.g. replacing a side panel), it is extremely important to apply the correct corrosion protection, as it is here that condensation and moisture can lead to concealed rust. This is major factor in ensuring that a vehicle holds its value. Terotex HV 450 Aqua is an excellent choice. It completely seals the surface and, with very good creep properties, penetrates into the furthest corners of the cavity. This waterborne preservative can be applied cleanly using a pressure-feed spray gun. A range of application tools can be attached to the gun’s nozzle: flexible, straight and hook-shaped tools are available depending on the cavity properties. The product is applied to the cavities until a small quantity of material can be seen from the drain holes. Terotex HV 450 Aqua can be worked at low temperatures from 15 degrees Celsius and has optimum moisture suppression characteristics. A high dropping point of over 150 degrees Celsius furthermore ensures that the protective film does not degrade, even in the high temperatures of the summer months. As a waterborne product, Terotex HV 450 Aqua does not cause any unpleasant solvent odours in the vehicle interior.

A technical data sheet including a detailed description of how the products should be applied is available.

Henkel has developed two new high-performance adhesives for repairing plastic components on vehicles and for bonding body parts. The new products are particularly low in emissions and thus offer excellent health and safety attributes.

More and more automotive components – from bumpers, fenders and spoilers to the fuel flap – are made from plastics of every kind. If these components crack or break, then a dependable adhesive is required. Henkel is now rounding off its portfolio of tried-and-tested adhesives for repairing plastic parts with a duo of two-component polyurethane-based products with low emission values.

Mixing the two-component adhesives is extremely easy thanks to a special mixing nozzle that is used to apply them. The two components are mixed automatically in the nozzle, ensuring the optimal quality of the adhesive during application.

Teroson PU 9225 SF ME and Teroson PU 6700 ME
Teroson PU 9225 SF ME can be used to repair all plastic parts on the vehicle exterior. The product has a pot life of two minutes, is applied at room temperature and subsequently cured using an infrared heat source at 60 to 70 degrees Celsius. The repair can be sanded with ease and, with the additional use of the Terokal 150 bonding agent, can also be painted without any difficulty.

Teroson PU 6700 ME is ideal for bonding different materials. The product can be used for metal, wood and most plastics and on painted surfaces. The adhesive cures in around ten minutes, regardless of the ambient temperature and the humidity level.

Messe Frankfurt has launched a “Further training” campaign as part of this year’s Automechanika. An important component of the campaign is the “accident damage repairs” training package. The goal here is to give interested participants practical sessions on this demanding area of work and allow them to try out tools and methods themselves. One workshop is hosted by Henkel.

During the “Body bonding techniques” workshop – Henkel, with its Teroson branded products, shows participants chemical bonding materials as important elements of today’s vehicle bodies. They receive information about health and safety regulations regarding the use of chemical products and have the chance to apply the products themselves. Participants also find out about the main tools used to apply sealants and adhesives. Here too there is a hands-on component, the aim of which is to return a vehicle body as closely as possible to its original appearance following the repair process.

Whether steel, aluminum or plastic, modern automobile bodies contain materials of every kind. Despite their conflicting demands, both body strength and lightweight construction are prerequisits resulting in the use of thin-walled high-strength roof skins and other structural components.

Bonding in the vehicle as a state-of-the-art joining method
By halting the passenger airbag, bonded windows provide increased occupant protection. Moreover, almost all passenger cars today feature bonded windows to increase torsional rigidity. At the least, the windscreen fulfils this role. In many cases, the strategy for body repairs is a case of bonding rather than welding. The workshop participants learn – in some cases during hands-on sessions – how to repair plastic parts, how laser-welded roof skins can be replaced using a bonded joint, how vehicle windows can be detached and rebonded, and how the original condition of the body can be restored by the professional application of sealants.

An essential precondition for ensuring the long service life of machines is that the components installed will withstand stresses such as vibrations, thermal expansion of materials and major temperature variations. For secure locking of threaded connections, the Loctite brand from Henkel offers high-performance liquid threadlockers that are easy to use and prevent threads from loosening.

Every mechanical engineer knows the challenge of finding ways to prevent nuts and bolts from working loose. Machine components have to be highly durable and withstand even micro-movements caused, for example, by the different thermal expansion rates of materials such as steel and aluminum. A variety of means exist to secure threaded connections against loosening when exposed to external factors such as vibration or corrosion of the thread. Mechanical methods, however, can fail rapidly. Anaerobic threadlockers from Loctite – whether medium-strength or high-strength – can be relied on to assure a durably secure connection every time.

When a threaded connection fails
Regardless of its thread diameter, a screw or bolt is always stretched axially (along its length) like a spring when it is tightened. It builds up a preload or clamping force by means of friction in the threads due to pressure between the mating flanks and the surface pressure acting on the screw head. The connection thus achieved can, however, fail and the screw may work loose. In gearboxes and engine blocks, for example, this can ultimately lead to leakage.

If salt water or moisture penetrates a thread, the surfaces can become corroded. A screw may shear off or threads become stripped when parts are being dismantled. Care should also be taken when using different types of material, as galvanic corrosion may cause them to rust. This can happen when different metallic materials come into contact with an electrolyte like water. The less noble of the two metals will then be destroyed.

Mechanical aids for retaining screws and bolts, such as serrated lock washers or screws with ribbed or sawtooth heads, will not always guarantee a lasting connection either. Even when they have been properly inserted and tightened, the connection may still fail due to expansion and contraction of the materials caused by high temperature differences in the machine.

Chemical threadlockers: resistant to vibration and temperature
A reliable way of achieving durable threaded connections is to use anaerobic adhesives. When properly applied, chemical thread retention – by means of anaerobic adhesive bonding – offers many advantages over mechanical retention methods. To begin with, anaerobic adhesives make the connection resistant to vibration and allow controlled preloading of the fastener. In addition, the threadlocker cures only in the absence of air and in contact with metal. When the products have been properly applied, they will spread evenly over the thread surfaces, thus filling the clearance between mating threads. A good choice for medium-strength and medium-viscosity threadlocking is Loctite 243. It ensures that the threaded connection is resistant to vibration, media and temperature, while still allowing disassembly. It acts both as a retainer and as a sealant and prevents corrosion in the thread. Two further products, the medium-strength threadlocker Loctite 2400 and its high-strength counterpart Loctite 2700, contain no harmful substances and so do not require hazard labeling. They thus make an important contribution to user health and safety. The adhesives are easy to use and economical. They also reduce complexity, since a single threadlocking product can be used for all thread sizes. All of these aspects result in significant cost advantages over mechanical retaining elements.

Hittite Microwave Corporation, the world class supplier of complete MMIC based solutions for communication & military markets, has introduced two new, 2 Watt GaAs pHEMT MMIC power amplifiers which cover the 9 to 14 GHz frequency range and are ideal for microwave radio, military and space, SATCOM and test & measurement applications.

The HMC952 and the HMC952LP5GE are four stage GaAs pHEMT MMIC 2 Watt Medium Power Amplifiers with temperature compensated on chip power detectors which operate between 9 and 14 GHz. These amplifiers provide 33 dB of gain, +35 dBm of saturated output power, and 27% PAE (Power Added Efficiency) from a +6V supply. With up to +43 dBm output IP3 the HMC952LP5GE is ideal for high linearity applications in military and space as well as high capacity point-to-point and point-to-multi-point radios. These powerful amplifiers also feature I/Os that are internally matched to 50 Ohms and require no external matching components which makes them ideal for use as drivers, or as the final power stage in a microwave transmitter chain.

The HMC952 die may be easily incorporated into MCMs, while the HMC952LP5GE leadless QFN 5 x 5 mm surface mount packaged version is compatible with high volume assembly equipment. Both amplifer versions are a much smaller alternative to bolt down power amplifier solutions, and complement Hittite's unmatched selection of active and passive components for microwave and millimeterwave radio applications.

Hittite Microwave Corporation, the world class supplier of complete MMIC based solutions for communication & military markets, has released a new broadband GaAs pHEMT MMIC low noise amplifier. The HMC374SC70E is housed in a compact 2.15 x 2.1 mm surface mount package and is ideal for automotive, fixed wireless, CATV, microwave radio, cellular infrastructure and repeater applications from 0.3 to 3.0 GHz.

The HMC374SC70E is a high dynamic range pHEMT MMIC LNA which delivers 1.6 dB noise figure, +34 dBm output IP3 and 14 dB small signal gain at 900 MHz. With saturated output power up to +19 dBm and output IP3 to +36 dBm, the HMC374SC70E is also ideal for driving the LO port of high linearity mixers and for transmitter pre-driver applications. This broadband MMIC LNA requires no external matching, is unconditionally stable, and operates from a single supply from +3 to +3.6V. Compared to a discrete implementation, the HMC374SC70E enables higher reliability, better consistency, less PCB area, and reduced component count.

The HMC374SC70E consumes only 75 mA from a +3.3V supply and is housed in a RoHS compliant plastic surface mount package. The HMC374SC70E is also available in a SOT-26 package as the HMC374E.

Hittite Microwave Corporation, the world class supplier of complete MMIC based solutions for communication & military markets, has released a new Broadband High IP3 Downconverter RFIC which operates from 700 to 3500 MHz. The HMC1090LP3E is ideal for space constrained frequency conversion applications in wireless infrastructure equipment such as base transceiver stations, remote radio units, small cells and repeaters.

The HMC1090LP3E is a high linearity downconverting mixer which is optimized for multi-standard diversity receiver applications where low power consumption and small size are required. This highly integrated RFIC features a wideband limiting LO amplifier and can be used in any 3GPP operating band from 700 to 3500 MHz. Unlike conventional narrow-band downconverter RFICs, the HMC1090LP3E supports both high-side and low-side LO injection over the entire RF band.

The HMC1090LP3E integrates LO and IF amplifiers, LO and RF baluns and a wideband passive mixer core with bias control. The unique architecture of this converter provides excellent LO/RF, LO/IF, and RF/IF isolations, while the RF and LO input ports are internally matched to 50Ω. The HMC1090LP3E exhibits noise figure as low as 8.5 dB and input IP3 up to +26 dBm making it ideal for demanding high linearity applications. For narrow-band applications, the input IP3 performance of the HMC1090LP3E can be further optimized with simple external matching.

Consuming only 0.9W of DC power, the HMC1090LP3E offers a very fast enable function which provides additional power conservation options in time division duplex (TDD) applications. The HMC1090LP3E is housed in a compact RoHS compliant, 3 x 3 mm plastic QFN package. The unique converter is also available in dual channel format as the HMC990LP4E.

Hittite Microwave Corporation, the world class supplier of complete MMIC based solutions for communication & military markets, has launched a new double-balanced mixer product which is ideal for microwave and VSAT radios, sensors, test equipment and military & space applications.

The HMC1048LC3B is a GaAs MMIC, general purpose, double-balanced mixer that can be used as a downconverter with DC to 4 GHz at the IF port and 2 to 18 GHz at the RF port. This mixer requires no external components or matching circuitry and exhibits excellent LO/RF and LO/IF isolation due to optimized balun structures. The mixer operates with LO drive levels from +9 dBm to +17 dBm and provides a typical input IP3 of 23 dBm. Ideal for downconversion in satellite transponder applications, the HMC1048LC3B is housed in a compact ceramic 3 x 3 mm SMT package.

The HMC1048LC3B complements the widest selection of microwave communication solutions available from any OEM. Samples and evaluation PC boards for all SMT packaged products are available from stock and can be ordered via the company's e-commerce site or via direct purchase order.

Hittite Microwave Corporation, the world class supplier of complete MMIC based solutions for communication & military markets, has launched two new power amplifier products which are ideal for microwave radio, EW, ECM and radar applications to 28 GHz. Also released is a unique wideband LNA which operates from 300 MHz to 20 GHz and is ideal for wideband multi-chip-module and subsystem applications.

The HMC994LP5E is a GaAs MMIC pHEMT Distributed Power Amplifier which operates between DC and 28 GHz. The amplifier provides 13 dB of gain, +29 dBm of saturated output power, and 23% PAE from a +10V supply. With up to +38 dBm Output IP3, the HMC994LP5E is ideal for high linearity applications in military and space as well as point-to-point and point-to-multi-point radios. The HMC998LP5E is a GaAs pHEMT MMIC Distributed Power Amplifier which operates between 100 MHz and 20 GHz. The amplifier provides 11 dB of gain, +41 dBm output IP3, and +31 dBm of output power at 1 dB gain compression while requiring only 500 mA from a +15V supply. The HMC994LP5E and the HMC998LP5E both exhibit very flat gain from 4 to 16 GHz and from 3 to 17 GHz respectively, making them ideal for EW, ECM, radar and test equipment applications. Both the HMC994LP5E and the HMC998LP5E are supplied in leadless QFN 5 x 5 mm surface mount packages and feature I/Os that are internally matched to 50 Ohms.

The HMC1049 is a GaAs MMIC pHEMT Low Noise Amplifier die which operates between 300 MHz and 20 GHz and employs a novel topology which maintains an excellent low noise figure of 1.7 dB at low frequencies. The amplifier also delivers 16 dB of small signal gain and output IP3 of +27 dBm, while requiring only 70 mA from a +7 V supply. The P1dB output power of +16 dBm enables the LNA to function as a LO driver for balanced, I/Q or image reject mixers. The HMC1049 is internally matched to 50 Ohms for ease of integration into multichip-modules (MCMs).

Hittite Microwave Corporation, the world class supplier of complete MMIC based solutions for communication & military markets, has introduced two new analog-to-digital converter (ADC) products which extend performance capabilities both in ultra low power consumption and in ultra high bandwidth applications.

The HMCAD1104 is a 10-bit octal channel ADC which offers an industry best combination of low power and high performance. Operating at 65 MSPS, the HMCAD1104 delivers a signal to noise ratio (SNR) of 61.6 dB, while dissipating only 30 mW of power per channel. This performance level represents a 50% improvement over the next closest competitor. The unique combination of low power consumption and compact 9 mm x 9 mm QFN SMT packaging, make the HMCAD1104 ideally suited for handheld and other portable instrumentation applications.

The HMCAD1104 is pin compatible with Hittite's family of 12-bit ADCs including the HMCAD1100, HMCAD1101, and HMCAD1102, all of which are compatible with the EasySuiteTM Test and Evaluation Tool for analysis and system configuration. Ease of use is further enabled by various modes and configuration settings that can be applied to the HMCAD1104 through the serial control interface (SPI); these include channel specific power down, common mode driver strength, and coarse and fine gain control. The HMCAD1104 is specified for operation over the industrial temperature range of –40°C to +85°C while the serial LVDS output is designed to easily interface with FPGAs from several suppliers.

For high performance applications which require sampling speeds to 26 GSPS, Hittite has also released the HMCAD5831LP9BE 3-bit ADC. This wideband ADC is targeted to extreme applications in radar, radio astronomy, and test and measurement equipment. The combination of very wide input bandwidth up to 20 GHz, and a sampling rate up to 26 GSPS make this ADC unique in the industry. These features enable quantization of high bandwidth signals up to 20 GHz with good INL and DNL performance. The HMCAD5831LP9BE is designed in a full flash architecture and provides Data XOR & Inhibit functions to ease FPGA programming. The HMCAD5831LP9BE is housed in a RoHS compliant 9 mm x 9 mm SMT package.

On Aug. 28, the Obama Administration announced the new Corporate Average Fuel Economy (CAFE) standard for cars and light-duty trucks, raising the standard to the equivalent of 54.5 miles/gallon by 2025. The CAFE standards are regulations, administered by the Dept of Transportation and the Environmental Protection Agency, that govern the average fuel efficiency of cars and light trucks sold in the U.S.

Honeywell is developing fuel-efficient turbochargers that help automakers achieve CAFE targets while meeting consumer demand for improved fuel economy without compromising engine performance.

According to Tony Schultz, Honeywell Turbo Technologies vice president for the Americas, Honeywell expects to see turbo penetration in light vehicle industry sales move from just more than 10 percent now to more than 20 percent by 2016 in the U.S., as manufacturers continue the process of downsizing and turbocharging to increase miles per gallon in all segments. The advancements being made in turbo technology will make it a key component of the solution for the even more aggressive standards now set for 2025.

Honeywell has U.S. launches with more than a dozen vehicle brands in the next few years including Ford, GM, Chrysler, Fiat, Volkswagen, and Nissan, which will more than double the company’s current annual launch rate for light vehicle turbochargers in North America.