Thursday, August 30, 2012

Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced the availability of the new eTEG™ HV37 thermoelectric power generator, the next entry in the high-voltage (HV) series of clean energy generators based on thin-film thermoelectrics. The eTEG HV37 converts waste heat into electrical energy for a variety of self-powered applications in the wireless sensor, automotive, aerospace, industrial and medical device markets. The eTEG HV37 joins Nextreme's other power generators, the eTEG HV56 and HV14, to offer a complete line of thermoelectrics that address a range of power and voltage requirements.

The eTEG HV37 is capable of producing 1.0mW of output power and an open circuit voltage of 170mV at a 10K ΔT in a footprint of only 6mm² . At 50K ∆T, the HV37 produces 24mW of power and an open circuit voltage of 850mV. The module is extremely thin: only 0.6mm high, and can be configured electrically in series to produce higher voltage and power outputs.

Nextreme’s eTEG devices generate electricity via the Seebeck Effect where a voltage is produced from the temperature differential produced by heat flow through the device.

"Deployment of distributed sensors and sensor networks have led to an increased interest in renewable and autonomous power sources," said Dave Koester, vice president of engineering at Nextreme. "The use of waste heat is an attractive source of energy for many applications where power on the order of µW-mW is required."

The high voltage output of the HV37 is enabled by Nextreme’s proprietary micro-scale thermoelectric technology. Certain applications (e.g., generating power off the heat of the human body, or generating power for wireless sensors) require a high density of thermoelectric elements in order to generate power at low temperature differentials. Nextreme’s patented thermal bump fabrication process can achieve thousands of elements per square centimeter.

The eTEG HV37 is a replacement module for the eTEG UPF40, Nextreme's first thin-film power generator. The HV37 has similar power characteristics to the UPF40, but with much higher output voltage in a smaller footprint. The new module is RoHS-compliant and manufactured using eutectic gold-tin (AuSn) solder, which enables assembly temperatures as high as 320°C.

The eTEG HV37 module is available with an 8 to 10 week delivery lead time. Pricing is available upon request.

Nextreme engineers are currently working with customers in a variety of industries and applications. These include clean energy harvesting and storage solutions for wireless sensor networks and remote power management.

Nextreme recommends the use of its thermal modeling, design and engineering services to deliver fully-optimized energy harvesting solutions. Nextreme routinely conducts analytical and numerical thermal modeling at all design levels from component to module to subsystem. Advanced analysis of complex systems, components or packages often require more detailed modeling to understand heat flow and thermal gradients.

Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced the availability of the new eTEG™ HV56 thermoelectric power generator, the next entry in the high-voltage (HV) series of clean energy generators based on thin-film thermoelectrics, that operates at temperature differentials as low as 10 degrees K. When combined with batteries and energy cells, the HV56 offers an ideal steady-state energy solution for a variety of self-powered applications in the wireless sensor, automotive, aerospace, industrial and medical device markets.

The HV56 is capable of producing 1.5mW of output power and an open circuit voltage of 0.25V at a 10K ΔT in a footprint of only 11mm². At 50K ∆T, the HV56 produces 36.5mW of power and an open circuit voltage of 1.25V. The module is extremely thin: only 0.6mm high, and can be configured electrically in series to produce higher voltage and power outputs.

The use of thermoelectric power generators (TEGs), in which a temperature difference creates an electrical potential, can convert waste heat from thermal sources into electricity for an alternative source of energy. In reality, most heat sources come and go and the actual temperature difference depends on several factors such as the time of day, wind speed and heat output, among other variables. Trickle charging energy storage devices using an HV56 power generator offers an ideal solution to provide steady-state energy from variable heat sources.

"For trickle-charging applications using thermoelectrics, a power convertor is required to meet the minimum charge voltage of the cell, such as 3.3 volts for lithium ion batteries," said Dave Koester, vice president of engineering at Nextreme. "Our new HV56 power generator, in conjunction with the latest advances in voltage up-conversion, enables our customers to get the voltages they need at very low ΔTs."

The high voltage output of the HV56 is enabled by Nextreme’s proprietary micro-scale thermoelectric technology. Certain applications (e.g., generating power off the heat of the human body, or generating power for wireless sensors) require a high density of thermoelectric elements in order to generate power at low temperature differentials. Nextreme’s patented thermal bump fabrication process can achieve thousands of elements per square centimeter.

Nextreme engineers are currently working with customers in a variety of industries and applications. These include clean energy harvesting and storage solutions for wireless sensor networks and remote power management.

The eTEG HV56 is RoHS-compliant and manufactured using eutectic gold-tin (AuSn) solder, which enables assembly temperatures as high as 320°C. The module is available with an 8 to 10 week delivery lead time. Pricing is available upon request.

Nextreme recommends the use of its thermal modeling, design and engineering services to deliver fully-optimized energy harvesting solutions. Nextreme routinely conducts analytical and numerical thermal modeling at all design levels from component to module to subsystem. Advanced analysis of complex systems, components or packages often require more detailed modeling to understand heat flow and thermal gradients.

Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, is now offering an updated version of the OptoCooler HV14 that enables assembly temperatures as high as 320°C. These assembly temperatures make the HV14 compatible with eutectic gold-tin (AuSn) solder — the industry standard process for packaging optoelectronic devices that require tight tolerances. Specific applications include laser diodes, semiconductor optical amplifiers and sensors.

The OptoCooler HV14 module is a high heat pumping thermoelectric device that is designed for standard electrical power requirements. At 85°C, the HV14 operates at a maximum of 2.7V and can pump 1.7 watts of heat in a footprint of only 3mm². The module can create a temperature differential (ΔT) of up to 50°C between its hot and cold sides, making it suited for the cooling and temperature control of optoelectronic devices such as laser diodes.

AuSn solder provides excellent joint strength, strain resistance and thermal conductivity. After the initial reflow during device assembly, the melting point of this particular AuSn solder is 320°C, enabling subsequent attachment of laser diodes and other devices to Nextreme's thermoelectric modules at lower temperatures, typically at 283°C, which is the industry standard. The use of this strain resistant material is particularly important for the laser diodes where movement of solder as little as 10 microns can cause significant alignment issues.

“Nextreme now offers the standard for solder assembly established by the optoelectronics industry," said Dr. Paul A. Magill, vice president of marketing and business development for Nextreme. "The introduction of gold-tin in the HV14 product line addresses our customers’ most challenging assembly requirements."

Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, and Lockheed Martin [NYSE: LMT], have entered into a cooperation agreement to develop new products based on Nextreme's thin-film thermoelectric materials.

The agreement allows Lockheed Martin to use Nextreme's thin-film thermoelectric products and thermal and power management design services in solutions it is developing for government and civil applications.

“Lockheed Martin is proud to enter into this cooperation agreement with Nextreme,” said Brad Pietras, Director of Nanotechnology Programs at Lockheed Martin. “The agreement gives us the opportunity to offer our customers new and differentiated products for enhanced thermal and power management.”

“Lockheed Martin is a global leader and engaging with them is a tremendous step forward for Nextreme," said Jesko von Windheim, CEO of Nextreme. “They represent leading-edge technology and offer an exceptional channel into the government sector, both of which can accelerate the development of next generation products.”

Nextreme’s team of engineers offers thermal modeling, design and engineering services to deliver fully optimized microscale thermal and power management solutions using standard and customized products.

Nextreme uses its breakthrough thermal bump technology to produce discrete and integrated cooling and power generation devices. Nextreme currently offers several thermoelectric coolers, such as the OptoCooler HV14 and UPF40, that are capable of cooling and heating in ranges from 0.4 watts to 4 watts, with plans to provide higher heat pumping in the near future. Modules for electronics cooling and power generation are available for order now and pricing is available upon request.

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, introduces its new cellular, penta-band blade antennas with cable and SMA connectors. These antennas deliver at least 50% radiated efficiency in all frequency bands
in which they operate while still providing voltage standing wave ratio (VSWR) figures of 1.5 decibels (dB). They provide a wireless connection to cellular networks using 850, 900, 1800, 1900, and 2100 megahertz (MHz) frequencies typical in GSM, CDMA, DCS, PCS, WCDMA, UMTS, HSPA, GPRS, 3G, and EDGE in platforms, in applications such as machine-to-machine (M2M), smart metering, monitoring, security, data logging, and data collection. They are a cost-effective M2M antenna for the industrial marketplace.

Pulse's penta-band blade antennas come in two configurations, the W1920G0915, which has a three-foot cable, and the W1920G3658, with a 12-foot cable. Measuring 110 x 22 x 5 millimeters and weighing 29 grams with the shorter cable, this is the smallest penta-band blade antenna capable of operating at 50% efficiency in every frequency band. Efficiency is important because it measures how much of the transmitted signal is actually used, rather than lost, by the antenna. The higher the efficiency, the less power is needed from the radio and the more economical the design. Greater efficiency also gives higher integrity to the data collection due to a greater signal emanating from the antenna.

A slightly flexible covering makes mounting easier and lowers the design cost as compared to a hard case antenna. It has a strong adhesive mounting and comes with an RG174 black cable and SMA male connector. Other specifications include a gain of minimum 1 decibel isotropic (dBi), a nominal impedance of 50 Ω, an omni-directional radiation pattern in the horizontal plane, vertical polarization, and a power rating of 3 watts.

“The W1920G0915 antenna gives M2M customers confidence in their cellular network connections,” said Elaine Baxter, marketing manager, Pulse Wireless Devices Antenna Division. “Its demonstrated efficiency exceeds the competition for this size of penta-band blade antenna.”

Pulse's penta-band blade antennas come packaged in bags with SMA connectors. The W1920G0915 and W1920G3638 are the SMA male versions with two cable length options. Custom cable options and alternative connectors are available upon request. They are easy to implement and come with Pulse's worldwide technical support. Prices for the W1920G0915 antennas are about $5.50 in quantities of 50,000 and for the W1920G3658 about $6.35 and may vary according to destination and order configuration. Delivery is about 8 weeks; products are available now.

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, introduces the first digital subscriber line (DSL) NanoFilter. Pulse's Z-321NF is the world's smallest in-line DSL customer premises equipment (CPE) MicroFilter. It offers
both voice and data protection by isolating DSL-band frequencies from voice-band equipment and telephone impedance changes from DSL equipment, and provides DSL band attenuation that prevents intermodulation distortion. The result is excellent voice band quality and optimal DSL data rates. The Z-321NF was designed specifically for the Southeast Asian, Indian, and Eastern European markets where 600 Ohm telephones are used.

“Pulse developed the first MicroFilter and is now introducing the first NanoFilter,” said Chad Oblak, product marketing manager, Pulse. “Each parameter of this quality product was carefully measured and tuned to provide functional performance that can be offered at price points that support high-volume DSL deployments in the Asian and Indian markets.”

Pulse's Z-321NF NanoFilter is just 36mm deep x 16.6mm long x 18mm high, works with any single-line phone, fax machine, or dial-up modem, and plugs into any standard phone jack. It is compatible with all major DSL standards including ADSL, ADSL2+, and VDSL2, meets CE standards, and is RoHS compliant. These filters are manufactured in Pulse's quality, high volume manufacturing facilities and are available in bulk packaging with approximately 800 DSL filters to a box. Normally there are 500 filters to a box, so adding the additional filters to the carton saves transit costs. Detailed specifications are available on data sheet EX143.

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, introduces the first long-term evolution (LTE) antenna that can adjust to 7 bands: LTE 700, 850, 900, 1800, 1900, 2100, and 2600 megahertz (MHz)Built on the smallest LTE antenna platform available. The antenna is for use in small portable LTE devices such as mobile phones, wireless routers, and wireless modems. The antenna was designed to meet future demands for world phones with truly global roaming that also work seamlessly in LTE multiple-input, multiple-output (MIMO) networks while providing normal WCDMA, CDMA, and GSM access.

The adjustable single-element antenna requires only a single feed to cover all seven cellular operating bands with no market-specific versions needed comes in an extremely compact size of 50.2 x 18.0 x 6.9 millimeters, which includes volume for speakers and other accessories within the antenna frame structure.

Pulse’s LTE antenna is manufactured using Laser Direct Structuring (LDS) technologyLDS enables finer tuning of the antenna during production by allowing for finer line width and spacing than any other 3D antenna manufacturing technology on the market. 3D shapes are needed to achieve ever smaller and thinner mobile devices. They provide better RF performance by optimizing the space available for the antenna and permit more design freedom, especially in the case of the round shape.

LTE provides the ability to deliver high data rates to a variety of consumer devices including Mobile Internet Devices (MIDs) and smartphones. To achieve maximum data rate, the current LTE standard calls for MIMO antenna technology, or using two separate antenna structures for multiple transmitting and receiving signals. The Pulse LTE antenna has been characterized in 2x2 MIMO implementation. The antenna configuration has two ports and diversity in all operating frequencies. The required antenna volume is small and there is significantly lower correlation between antennas than seen in any other handset MIMO configurations.

“Pulse wanted a universal, truly global antenna solution, and we believe this new 7-band antenna meets that goal,” said Maritta Timosaari, director sales and marketing, Pulse Finland Oy. “Thus far, to our knowledge, only 4-5 band industrialized solutions are available in the market, and very little work has been done with MIMOs. Until now, almost all MIMO solutions have been demonstrated only on a single band. Pulse’s 7-band LTE antennas are a natural evolution of Pulse’s switchable antenna family, which has been available since 2003. Based on Pulse’s well-known and proven antenna technology, they are readily available, are of high quality, and come with Pulse service and support.”

Pulse's 7-band LTE antennas are RoHS compliant and meet LTE, WCDMA, CDMA, GSM, and TD-SCDMA standards. They are packaged in trays. Engineering samples are available.

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, announces its new set of monopole antennas that deliver Zigbee 2.4 gigahertz (GHz) and ISM bands 868 megahertz (MHz), 915 MHz, and 2.4GHz. These antennas are excellent alternatives to using trace antennas because they occupy very little printed circuit board space while maintaining their key properties regardless of changes to the board. They provide a high-quality radio interface for multi-purpose machine-to-machine (M2M) devices and applications such as data loggers, remote control, tracking, monitoring, Smart Grid, automated meter reading (AMR), tags, remote keyless entry, industrial, metering, security, automation, and point-of-sale (POS).

The monopole family of ceramic antennas consists of the W3000, W3014, W3016, and W3043. Due to their small size they are ideally suited to solutions where PCB size is limited for the antenna. Compared to a PCB antenna, the high temperature ceramic (HTC) material used in the monopole family means they detune less due to human tissue proximity or device mechanics, making them an ideal choice for hand-held or body worn products. These antennas can be used for multiple functions because their operating frequencies can be changed simply by implementing different matching circuits.

The smallest antenna is the W3043, at 3.2 millimeters (mm) wide x 1.6mm long x 1.1mm high with a weight of 33 milligrams (mg). It is matched to 2.4 GHz or other frequencies.

The W3000, also compact, measures only 7mm x 1.6mm x 1.6mm and weighs 86mg. It's used for 2.4 GHz and ISM band 868. With clearance, these antennas measure 66mm2 (11 x 6mm). Compared to a typical 2.45 GHz FR-4 trace antenna which measures 200mm2 (20 x 10mm).

Pulse’s monopole antennas deliver 67% more board space. Thus a smaller device can be designed or space freed up for other components, and PCB costs are reduced.

The W3014 is a 10mm x 3.2mm x 1.5mm chip with a weight of 240mg. It uses ISM band 915 so it can be used for designs containing a suitable matching circuit. The W3016 is ideal for ISM band 868 and is 10mm x 3.2mm x 4mm with a weight of 600mg.

“With so many emerging applications in the M2M sector, designers need an antenna solution which accommodates different ground plane sizes and product dimensions,” said Elaine Baxter, marketing manager, Pulse Wireless Devices Antenna Division. "Pulse 's new range of ZigBee and ISM band ceramic monopole antennas offers a comprehensive and flexible portfolio which can be matched to the majority of M2M applications. They provide more reliability and higher performance than traditional trace antennas used on the PCB.”

All Pulse monopole antennas are RoHS compliant and fully compatible with surface mount devices. They are easy to implement and come with Pulse's worldwide technical support. The antennas are packaged in tape-and-reel. Prices range from $0.25 to $0.55 and may vary according to destination and order configuration. Additional information is available on datasheets W3000, W3014, W3016, W3043 or check out the full range of M2M Internal Antenna Products at the Pulse Antenna Applications section.

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, announces its new dual-band diversity ceramic antenna that operates at both 850 and1900 megahertz (MHz) bands. Designed for use in the US, the antenna provides a high-quality radio interface for multi-purpose machine-to-machine (M2M) devices such as broadband access, monitoring, automated meter reading (AMR), and security.

The W3047A dual-band antenna is compact, measuring just 3 millimeters (mm) wide by 12mm long by 3mm high with a low weight of 530 milligrams (mg).

“The W3047A has the world's smallest footprint and highest performance level for a dual-band ceramic antenna” said Kent Vu, product manager, Pulse Antenna Division. "It saves board space, is easy to incorporate, and is a cost saving solution, factors which make it desirable for an engineer to design in.”

The W3047A is RoHS compliant and fully compatible with surface mount devices. It is easy to implement and comes with Pulse's worldwide technical support. The antennas are packaged in tape-and-reel.

Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, introduces a near field communications (NFC) antenna that enables mobile phones to read data from a distance of up to 40mm. The antenna sends and receives clear signals even when installed in a handset in close proximity to the battery or metal housing. Pulse Electronics’ ferrite sheet antenna can be customized to the varying sizes of handset mechanics, is easy to implement, and enables safe, non-contact, wireless communication for NFC connectivity to mobile devices.

Pulse Electronics’ planar ferrite sheet-based antenna has dimensions of 35mm x 50mm with a minimum thickness of 0.30mm, including the ferrite/adhesive/antenna flex layers. The magnetic field strength can be optimized by the type and thickness of the ferrite material and the design of the radiator pattern. The antenna meets EMVco specifications ensuring global interoperability and compatibility of chip-based payment cards and acceptance devices.

“In order to achieve the EMVco target reading distance of 40mm it requires optimization between the mechanics and antenna.  Pulse customizes its NFC antennas, matching the circuit values for the device, so tuning is all that is needed to integrate it,” said Maritta Timosaari, sales and marketing director, Pulse Electronics Mobile Division.

NFC antennas are needed so mobile devices can communicate with other wireless devices for payments, access and control, credential storage and exchange, and content consumption. Pulse can optimize multi-antenna configurations with an NFC antenna for all-in-one solutions. In-house testing and measurement is done at Pulse Electronics global facilities to ensure that the antenna will perform optimally throughout its life cycle.

SEGGER Microcontroller has delivered the first in-circuit programmers for the Renesas Electronics RX Series of microcontrollers. The Flasher RX is based on SEGGER’s well-established Flasher series of production and field service programmers.

The Flasher RX offers multiple connectivity options to easily integrate into any production environment. On the interface side, these options are Ethernet, USB and RS232.

The Flasher RX can be operated via terminal connection (RS232) and via the flash programming software J-Flash, which offers a graphical user interface as well as a command line interface. Another option is to set up the Flasher for stand-alone operation and start programming with a simple push of a button.
The Flasher RX has a memory of 64 MB for storing the target data. The data files can be updated via an RS232 interface, via the J-Flash software or via USB using the mass-storage-mode of the Flasher RX.

“The Renesas Electronics RX devices with their highly efficient core are a very successful series of microcontrollers. As a result of the close collaboration with Renesas Electronics, we have our embedded software, debugging and production tools readily available for this new and very attractive platform,” says Dirk Akemann, Partnership Marketing Manager of SEGGER.

“We are pleased to have this versatile programming tool available for our rapidly expanding family of RX600 MCUs,” said Ritesh Tyagi, Director, Microcontroller Product Marketing, Consumer & Industrial Business Unit, Renesas Electronics America. "The Flasher RX is yet another milestone in our efforts to enhance the RX MCU ecosystem, providing design engineers with greater flexibility for designing, and programming, their solutions using RX600 microcontrollers."

SEGGER Microcontroller today announced that embOS, the powerful, easy to use RTOS, is available for the RL78 from Renesas.

The real-time kernel embOS supports a premium feature set, such as the embOSView task-level profiling tool, an unlimited number of tasks and no need for compile-time configuration. The plug-in for IAR’s Embedded Workbench provides task-sensitive information. This allows the developer to monitor all relevant data from suspended tasks and running tasks during debug sessions.

“Our company has a very long history with Renesas and especially with the predecessor of the RL78 the NEC 78k0. A number of years ago the embOS development started on an  NEC 78k0 processor that has now evolved into the RL78 cost-effective micro-controller with very low power consumption. Therefore it has been a logical step for us to offer a new embOS for this microcontroller,” says Dirk Akemann, Marketing Manager of SEGGER.

embOS is a high-performance real-time OS that has been optimized for minimum memory consumption in both RAM and ROM, as well as high speed and versatility. It supports fully nested interrupts for zero interrupt latency. embOS is a priority-controlled multi-tasking system, designed as an embedded operating system for real-time applications for all popular CPUs. It provides a migration path with identical APIs across all platforms.

“The availability of embOS for the RL78 is another example of the good results of the long partnership between Renesas and SEGGER. The small footprint and high performance of embOS complement the low-power-modes of the RL78 making both products a perfect match”, says David Noverraz, Product marketing manager for development tools at Renesas Europe.

SEGGER Microcontroller has developed a new tool to help the engineer shorten the time to create their application by replacing the tedious task of creating user interfaces in hand written code with a simple straight forward drag and drop interface. Using this tool, the emWin GUIBuilder, a developer gets a jump start when creating their user interface with emWin.

The emWin GUIBuilder supports drag and drop operations as well as keyboard operations to create the interface. This allows quick placement of widgets and adds the ability for precision corrections of the layout while working in a convenient PC development environment.

Once the design is ready to go, the developer saves the design as C-source code which can be loaded back into the editor to allow for later corrections to the layout even after adding code to further customize the interface.

It is now even possible to permit an individual not familiar with C to design an engaging user interface while being confident in the fact that the generated code has been optimized for minimum overhead.

“Rest assured; you do not have the typical code bloat often associated with WYSIWYG utilities.  The GUIBuilder has been designed with memory constrained embedded systems since its inception and we have never lost focus of this need in our solution. With our new GUIBuilder we have addressed the rising demand for an easy-to-use interface for GUI-creation”, says Shane Titus, director of SEGGER’s US operations.

emWin is designed to provide an efficient, processor- and LCD controller-independent graphical user interface (GUI) for any application that operates with a graphical LCD. It is compatible with single-task and multitask environments, with a proprietary operating system or with any commercial RTOS. It may be adapted to any size physical and virtual display with any LCD controller and CPU.

SEGGER Microcontroller has introduced a new tool for engineers to evaluate and test SEGGER’s NAND flash driver as well as the USB stack (emUSB) and the embedded file system (emFile) with various NAND flash memory to find the perfect fit for their upcoming project. The NAND-Flash EVAL board is equipped with a 48-pin TSOP socket for standard NAND flash memory and an Atmel® SAM3U ARM-based microcontroller (MCU). The MCU is preprogrammed with an application that automatically formats an unformatted NAND flash memory and runs a performance test. Afterwards the board behaves like a USB memory stick.

The engineer can use the board to test different flash memory and select the silicon he needs for his application without soldering or code creation. Of course the board also allows testing of custom code.

The SEGGER emFile NAND-driver is optimized for very high performance using minimum amount of RAM. With this hardware and the flash memory delivered with it. Write performance is 4.2 MB/s, read performance is 6.4 MB/s. The driver protects data from an unexpected reset, and uses wear-leveling to maximize the life of the NAND flash memory.

The software running on the NAND-Flash EVAL is delivered as a binary image for easy evaluation. This software is also included as a full development project for further modification and testing. The application layer of the project is left in source form and library evaluation versions of emFile, which include; the high performance NAND-driver, emUSB-Device with MSD class, and the extremely fast SEGGER embOS (RTOS). The engineer can program the NAND-Flash EVAL via USB or via JTAG/SWD debug interface. This permits the engineer to create and run their own applications on the board. The standard debug interface is accessible by a debug emulator such as the industry leading SEGGER J-Link (sold separately).

The Atmel SAM3U is based on the industry-standard ARM® Cortex™-M3 core. The MCU offers very high system-level integration, including an on-chip high-speed USB Device Controller with transceiver, PLL and NAND flash interface. The high level of integration in the Atmel SAM3U enabled SEGGER to build the NAND-Flash EVAL board as a two-chip system.

“The NAND-Flash EVAL board is a unique and efficient way to test and verify design decisions for software and hardware at very early stages of your development projects”, says Dirk Akemann, Marketing Manager at SEGGER.

SEGGER Microcontroller the developer and manufacturer of the embedded industry's most popular emulator, the J-Link, today announced that the IAR Branded J-Links (in yellow housing) will be discontinued. SEGGER will continue to work with IAR to ensure optimal J-Link support from the IAR Embedded Workbench.

IAR recently announced their decision to acquire Signum. This presents IAR with the option to sell one of two competing products: Their Signum emulator or the IAR branded version of the SEGGER J-Link. SEGGER feels that IAR's motivation will be to promote their newly acquired emulators rather than the proven J-Link, potentially damaging the excellent reputation the J-link and J-Trace have in the market.

"This acquisition took us by surprise. We regret that we have to do this, but we feel forced to discontinue production of IAR branded yellow J-Links. We hope that IAR understands the decision and expect that they will continue to fully support the broad base of J-Link users with the Embedded Workbench.", said Rolf Segger, founder and CTO at SEGGER.

"We believe that the J-Link product family is the most advanced emulator family available. It's popularity allows us to offer it at very reasonable prices, and it is widely used for software development in the commercial and educational market spaces, as well as for production flash programming. Anyone desiring the discontinued IAR J-Link, may acquire the original SEGGER J-Link.", said Ivo Geilenbrügge, managing director at SEGGER.

Built-in firmware intelligence provides a strong connection with your end device while performing at very high speeds. It also facilitates advanced features such as unlimited Flash Breakpoints, Power Debugging, and full SWD/SWO support. With the J-Links competitive pricing, wide target support, incredible speed, stability, and versatility, J-Link is second to none.

The SEGGER J-Link is the industry-standard for ARM debug emulators, supported by all major tool chains for ARM cores. The SEGGER J-Link is independent and will work with IDEs from: Freescale, IAR, KEIL, Mentor Graphics, Rowley, Renesas, Tasking, Phyton and others. In addition to those listed above; any RDI compliant debugger can be used with the optional RDI module, and any GDB compliant debugger with the free GDB-Server. Therefore; as projects change a different compiler/debugger might become necessary. With the J-Link family investments (monetary and learning curve) in development/production tools are preserved. Setup of a J-Link is done in mere minutes.

J-Link supports multiple CPU families, such as ARM 7/9/11, Cortex-M0,M1,M3,M4,R4,A5,A8,A9, Renesas RX in a single model; there is typically no need to buy a new J-Link or new license when switching to a different CPU family. SEGGER is also continuously adding support for additional cores, which in most cases, only requires a software/firmware update. Unlimited free updates are included with even the baseline model of the J-Link. SEGGER is excited to continue advanced development of its cutting edge embedded tool solutions to be utilized with the IAR IDE, or any other development environment you choose.

With the official opening yesterday of Oak Ridge National Laboratories ZEBRAlliance project, Seoul Semiconductor demonstrated how LEDs can help illuminate and define a home’s living area using a fraction of the energy consumed by traditional incandescent and compact fluorescent light bulbs.

ZEBRAlliance – the Zero Energy Building Research Alliance - is a collaborative effort among Schaad LLC, The Tennessee Valley Authority, the Department of Energy and the Oak Ridge Labs to field-evaluate two pairs of energy-saving residences. It will demonstrate energy conservation efforts that can reduce the load on the existing electrical grid and curb dependence on non-renewable energy sources throughout the project. Energy use, lighting quality and maintenance requirements will be monitored for two years. Data from the house outfitted with Seoul Semiconductor’s Acriche LEDs will be compared against that of a house using compact fluorescent lights.

Seoul Semiconductor’s unique Acriche LED is featured in solid state lighting installed throughout an energy-saving home at the ZEBRAlliance, and were chosen for the trend setting house because they do not use electronics to convert AC line voltage into DC as do most other solid state lighting devices. The result is a more energy- and cost efficient lighting product.

In addition, LEDs outlast conventional light bulbs – providing more than five times the light for each watt consumed when compared with a typical incandescent light for an energy savings up to 86% - and exhibit color qualities far preferable to those of traditional bulbs. Acriche will continuously evolve its performance to double its lumen by end of this year.

Seoul Semiconductor plans to extend its LED lighting solution in the market using data culled from what the company is calling “Acriche House.” The name “Acriche” was created by combining the Greek word “Acro”, meaning top with “rich” to coincide with the company’s ideals of enriching people’s lives with its advanced lighting technology.

Seoul Semiconductor has 5,500 patents, including Acriche product-related technologies, to operate multiple light-emitting cells with AC power, lights the patented Acriche technology of connecting multiple lights cells in a single chip allows for both AC and DC operation, simplifying operation in many applications including backlighting of LED TVs and solid state lighting.

Brian Wilcox, Vice President of North American sales for Seoul Semiconductor, said, “The ZEBRAlliance project marks the beginning of a new era in home lighting. The United States Congress has mandated elimination of ordinary incandescent bulbs by 2014; Europe did the same last year, banning the sale of incandescent bulbs over 100 watts. This market will grow substantially as consumers realize the benefits of brighter illumination combined with energy efficiencies.”
He added “Seoul’s participation in this project shows our determination to continue proliferation of this technology and solidify our position as a market leader”.

Leading global LED provider Seoul Semiconductor (SSC) today announced that Z-Power LED Series were installed as stage lighting at the opening ceremonies of the Asian Games 2010. The Guangzhou Games committee selected local SSC partner GOLDEN SEA Professional Equipment Ltd. to provide the Z-power LED Series-embedded lighting solution, which played a vital role in illuminating the on-stage performances with exceptionally high quality light, creating a fantastic visual experience. The win marks SSC’s continued growth in mainland China, one of the fastest growing LED lighting markets in the world.

SSC’s Z-Power Series RGB LED was chosen by GOLDEN SEA Professional Equipment Ltd. mainly for its outstanding lighting quality and brought to the Asian Games a truly fantastic and dramatic visual experience. With the added ability of generating pure, uniform white light that achieves 80 on the color rendering index (CRI), it also creates outstanding evening visibility, comfort and safety.

The Z-power Series is also extremely energy efficient, producing 100 lumens/W @350mA, achieving the industry’s highest luminous efficacy with only a single die. It also contains no toxic substances such as mercury, emits no harmful IR or UV rays, and cuts down dramatically on energy-based CO2 production, making it a perfect fit for the theme of this year’s Asian Games, “high-tech, energy saving, going green”. And, since the Z-power LED-embedded stage lights last 100,000 hours—over 130 times more than conventional lighting—maintenance costs can be significantly reduced.

“As a leading supplier of high quality lighting in mainland China, we strive to bring the most advanced, most value-added lighting solutions to our customers,” said Zhang Wei Kai, president of Golden Sea. “The Asian Games is one of the largest events in China this year, and I am sure our partnership with Seoul Semiconductor was instrumental in enabling us to secure this monumental win. Their LED lighting products are best-in-class, featuring excellent technology, energy efficiency, and are completely safe for the environment. It is always a pleasure working with them, and we looking forward to tightening our relationship in the future.”

Brian Wilcox, Vice President of North American sales for Seoul Semiconductor, said, “Seoul Semiconductor is proud to see that Z-Power Series RGB LED powered lighting was selected for the stage lighting at the opening ceremonies of the Asian Games. Featuring rich color, the Z-power Series provides exceptionally consistent lighting for a more pleasant viewing experience, and improves visual detail. Because it is also extremely energy efficient, long lasting, and safe for the environment, it is the best lighting solution for many different kinds of general lighting applications.”

SSC LED lighting has made groundbreaking appearances around the world, including at Paris’s most famous landmark, the Eiffel Tower. Bringing its world-class technologies to China, SSC continues to demonstrate a deep commitment to providing the region with safer, more efficient and more beautiful LED solutions, highlighted by their extensive use at the 2008 Beijing Olympic Games.

Today, SEOUL Semiconductor, the world’s leading LED manufacturer, released new high-brightness Z-Power LED Z series titled ‘Z7’ and ‘Z6’ and unveiled its plan to release one or two new product(s) every month to meet diverse customer needs and demands as the LED lighting market looks prosperous this year.

The Z-Power LED Z7 series (4W) is a high-brightness white LED made of special ceramic PCB. It offers 5,500K color temperature and 440lm brightness. In particular, the Z series offers an ultra-small package (9 X 7 X 3.2mm) for easy application to diverse indoor and outdoor lighting products in substitution of P7 LED series.

Compared to the P7 series, Z7 series are significantly small (about one seventh) in terms of the foot print. In fact, the brand-new product is thinner but brighter and more efficient than rival products. After all, the Z7 series is a perfect solution to indoor and outdoor lightings which requires long life and stability just like street lamps and tunnel lighting as well as downlight and commercial lights such as PAR30.

The Z-Power LED Z6 series also includes full-color LED products which can create red/green/blue and even white lights. In particular, the 4 LED chips in the Z6 package are individually operable in red, green, blue and white (1W each). If they are operated at the same time, the white color (4W) can be created in diverse color temperatures (pure, warm and neutral). In addition, Z6 series offers diversity of designs by comprising the four LED chips with independent circuits inside the package.

The Z6 series, which is available in an ultra-small package (9 X 7 X 1mm) is specially designed to create fancy lighting such as landscape lighting, stage lighting and digital signage based on full-color performance. Especially, the Z6 series has superior color mixing properties compared to rival products. Because it is scheduled to be released at about 30% less expensive, it could make a great contribution to the wide distribution of LED lighting.

Manuel Zarauza, the vice president of European sales from Seoul Semiconductor, said, “We expect to be able to take care of current technical and economic problems in the LED lighting market with the new Z-Power LED Z6/Z7 series.”

Meanwhile, the samples for both the Z6 and Z7 series are available now, and mass production will begin in February.

Leading global LED provider Seoul Semiconductor (SSC) today announced its new AC-powered LED lighting product named ‘Acriche A7’. Seoul Semiconductor had recently released two new high-brightness white LED products according to their 2011 plan that aims to release new products every month.

The brand-new ‘Acriche A7’ is smaller in size but significantly improved in terms of reliability and ESD-withstand. Acriche, which can operate under both AC and DC power supplies, is one of the flagship products of Seoul Semiconductor. It can be operated on common household AC voltages such as 110V/220V without a converter.

‘A7’ is a 3.2W LED, which has been a popular choice for general illumination applications. It provides 305lm and is offered in an ultra-small, ceramic-circuit package (8x8x3.7mm). Above all, it is very low in ‘cost/lm’ among other lighting-class LED products making it well-suited for commercial lighting products such as down lights, MR16, PAR30 and PAR38 replacement lamps, ‘A7’ can last over 40,000 hours and improves the lifespan of the end product because a converter is unnecessary.

Traditionally, DC LED lamps have lasted about 10,000 hours because of the short lifespan of some of the components in the converter. However, with the Acriche that does not require any converters, the lamp manufacturer can achieve cost-savings while improving system efficiency and lifetime.

The A7 series samples are now available upon request. Mass production will begin on Feb 15.

Leading global LED provider Seoul Semiconductor (SSC) today announced a new AC and DC-powered LED for downlight, named ‘A8.’ Based on its plan to release new product(s) every month in 2011, the global company introduced Acriche A8 followed after two high-brightness DC LED product and Acriche A7.

The brand new LED Acriche ‘A8’ replaces 60W incandescent bulbs with a single package is very competitive in terms cost by removing SMD process of dozens of DC LED package on expensive metal substrate for thermal emission and also to prevent using AC, DC converter. Acriche, the semiconductor light source which can operate under both AC and DC power supply, is one of the flagship brands of Seoul Semiconductor. It operates immediately without a converter at 110V/220V as well as under low/high voltage.

‘A8’ is a product specially designed for downlight, which is the most demanding among lighting LEDs these days. In particular, it is offered in an ultra-thin package (25x22x2mm), COB style with 700lm of brightness. So it is far better than rival products in terms of light efficiency enough to replace 60W light bulb with only one A8 package.

‘A8,’ customized for incandescent bulb / downlight and indoor lighting, can last up to the life of the LED chip because it does not require a converter. So far, DC LED lamps have lasted about 10,000 hours because of the short lifespan of the converter.

Seoul Semiconductor started its mass production of the latest Acriche, A8 series and samples are now available upon request.

With "environment" as the key word, automobile manufacturers are competing fiercely to develop cars with superior fuel efficiency. These eco-cars need efficient and reliable converters. We have employed DSP control ICs. They allow us to develop digital control products whose characteristics are not affected by temperature changes or age. Technology Overview: Our digital control system achieves high-speed control and added value by going from the old system of analog feedback control to our unique switching power algorithm.

(The Advantages of Digital Control)

1) Cuts the number of parts
2) Can maintain or improve reliability, without age deterioration
3) Easy to add high added value (can even control communication functions, etc., besides power)
4) Makes controls unfeasible with analog control possible (predictive control, self-learning functions, etc.)

• Operating frequency 60 MHz
• 16-bit calculation
• Incorporates 16-bit product-sum computing unit
• 9-step pipeline processing
• Computing circuits optimized for power control
  (SD/JRC original: optimal computing circuits of computing abilities far beyond the competition)
• Handles C language
• Code security function
• No need for external reset circuit
  (includes subclock, WDT, power-on reset, power voltage monitoring)
• Product inspection, test permission special terminal, consideration for testability
• Full scan and special module specialized inspection functionality
• High-speed clock BIST function
• Sleep mode/clock halt functions (energy saving)

Shindengen Electric Manufacturing Co., Ltd. (headquartered in Otemachi, Chiyoda-ku, Tokyo, Japan) imagined "a design to save energy easily just by putting it on top" when we developed the two types of non-insulating step-down DC-DC converter modules called the HNDS series and HNAS series.March 2009 marks the start of mass production, with over 1 million shipments expected in the first year, mainly to the industrial device market.

    * Designed to save energy easily just by putting on top!
    * HNDS series supports 12 V/24 V-type input
    * HNAS series supports 3.3 V/5 V-type input
    * Supports high-current (3 A) output
    * Incorporates comprehensive protection functions
    * Full range of mounting variations

In recent years, as momentum for protection of the global environment rises, energy-saving demands have intensified for devices of all kinds, not just products for consumers. Likewise, the market for industrial devices requires cuts in power consumption. To improve response speed and lower power consumption in memory and system LSIs used in industrial device control, etc., leaps are being made in lowering voltage and raising current. Power specifications, accordingly, grow increasingly diverse and complex. However, as faster product development is demanded of power design, it is becoming impossible to devote adequate time to consideration. Therefore, a number of cases can be seen in which the dropper method is used despite its low conversion efficiency because it is easy to design with, one factor slowing the movement towards energy conservation. We, however, have developed the concept of “a design to save energy easily just by putting it on top”into the non-insulating step-down DC-DC converter module HNDS series and HNAS series. It eliminates design headaches while helping to save energy with high-efficiency power. We have 3 mounting variations, considerate of the details of power designers' needs.

Shindengen Electric Manufacturing Co., Ltd. (headquartered in Otemachi, Chiyoda-ku) has developed a 10 kW power conditioner for photovoltaic generation with high-frequency isolation, the "PVS010T200." It achieves the highest level of power conversion efficiency in the industry*2, at 93%. Sales will start in Summer 2010, mainly to schools and public and industrial fields, as the start of the "SOLGRID*1 series."

Features of the "PVS010T200" 10 kW power conditioner for photovoltaic generation
  •     Uses Shindengen's proprietary power circuit technology to achieve achieve the highest level of power conversion efficiency in the industry*2: 93%
  •     Its design manages to be compact and lightand to offer superior heat dissipation and workability
  •     Size: 600(W)*260(D)*600(H)mm[o1]
  •     Weight: 60kg
  •     It uses high-frequency isolation, which eliminates the need to install a commercial transformer. Safety secured. (Prevents leak current from stray capacitance generated between photovoltaic cell and ground)
  •     Supports parallel operation (up to 8)
  •     Contains junction box function (up to 7 circuits, 10 A/circuit)
  •     Many options available (e.g. Built in transducer, SUS case, douser , no junction box type)
  •     JET certified Photovoltaic generation systems are gathering attention around the world as a source of renewable energy.
They have even gotten the Japanese government’s vigorous moving, for instance, in its School New Deal plan, which promotes the introduction of photovoltaic generation into schools. Photovoltaic generation systems need power conditioners to convert DC power generated from a photovoltaic panel to AC power. With momentum building for higher generation efficiency throughout the system, an intense need has grown for a power conditioner with improved conversion efficiency. So we developed the 10 kW "PVS010T200," the beginning of the "SOLGRID*1 series" of power conditioners for photovoltaic generation. It utilizes Shindengen's proprietary inverter power circuit technology to achieve the highest level of power conversion efficiency in the industry*2: 93%. The PVS010T200 uses high-frequency isolation to solve a problem found in the current status quo of non-isolated power conditioners, that leak current arises in photovoltaic generation system. The product also helps to save space and to make installation more convenient in that it does not need an isolating transformer installed externally. Yet further, it conforms to the requirements of guidelines for grid connection technology and offers many useful functions for improving the overall performance of the photovoltaic generation system, including the ability to sell surplus power. We are pushing for aggressive sales of the PVS010T200 into schools, public and industrial fields, where introduction of photovoltaic generation systems is spreading rapidly. It is the answer to the market's needs, with environmental performance at the highest level in the industry*2.

Tuesday, August 28, 2012

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, announces that its SmartER™ series of splitters have been tested and meet the new TR-127 standard for VDSL2 applications. TR-127 is a technical report developed by the Broadband Forum to ensure the highest quality delivery of voice, data, and video services (triple play) by maximizing the interoperability of splitters and in-line filters with digital subscriber line access multiplexers (DSLAMs]) and modems.

Telephone companies are now able to offer triple-play services to their customers. The signals for all three are brought to the home through the phone company’s twisted-pair copper telephone line. However, answering a ringing telephone can interfere with VDSL2 signals carrying High Definition Video (HDV) to the consumer’s television, causing the television picture to pixelate or degrade. Pulse’s high-performance video-grade splitters counteract this “ring trip” video degradation and protect the quality of the video service.*

Pulse has implemented a complete test set-up for TR-127 to ensure that its products are fully in compliance with the new standard and has verified that its SmartER ADSL/VDSL splitter modules are fully compliant with the TR-127 standard for VDSL2 applications. Without TR-127 testing during the design phase there is no way to ensure that the splitters are immune to interruptions caused by the telephone ringing, an on- or off-hook receiver, or answering the telephone while ringing. Splitter performance has a big influence on the quality of the video services. Some low-grade splitters can saturate in the presence of high voltages and currents, which means that they no longer prevent noise from interfering with the data packets sent at the same time. This causes data corruption and packet loss. High-grade splitters, like those in Pulse’s SmartER line, do not saturate since they meet TR-127.

Under TR-127, central office (CO) and customer premises equipment (CPE) splitters are tested with DSLAMs and modems as part of a full system test as opposed to being tested in isolation. Until the TR-127 standard was published there was no defined or accepted method of testing the quality of video grade splitters. The TR-127 standard is a
78-page document which has taken more than three years for industry experts to develop.

“By testing the system under real-life conditions, the splitters can be designed to ensure high-quality video service without interruption from the telephone that uses that same line,” explained Ronan Kelly, Pulse product engineer. “Splitters are the solution for the ring-trip problem, but only if they are of a high enough quality to meet the
TR-127 standards.”

Pulse has a chart detailing its Central Office splitter modules, their application, and the level of TR-127 compliance.

The white paper TR-127 Ensures Quality of Service for IPTV can be downloaded from the Pulse website.

* Note: Additional technical information and background on the ring-trip issue can be found by link to this article: Tripping the Video Fantastic - Video Splitters May Prevent the Ring Trip Problem, by Greg Gough” (Aug 2007).

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, introduces its new family of stubby external antennas. With an efficiency of more than 55% in all bands and a height of less than 50mm, Pulse's antennas enable wireless devices to access the major cellular networks worldwide. They provide a reliable wireless machine-to-machine (M2M) connection in applications such as smart metering, monitoring, industrial controls, and data-logging.

The stubby antennas cover frequency bands 824-960 and 1710-1990 MHz for all widely used cellular bands for 2G, 2.5G and 3G applications. They have a peak gain of 1 dBi in the 824–960 MHz range, 2 dBi in the 1710–1990 MHz range, and 2.5 dBi in the 1920–2170 MHz range, with an impedance of 50 Ohms. Operating temperatures range from -40 to 85 degrees Celsius.

Pulse's stubby cellular antennas come in two configurations. The W1900 and W1902 are straight antennas for connection to the top of a device or modem while the W1910 and W1911 have a right angle for a side connection. The W1910/11 is 49mm high and the W1900/02 is 49.5mm.

The peak radiated efficiency for Pulse's stubby antennas ranges from 50% to 65%, which is the percentage of the original radio signal which is actually radiated from the antenna. The higher the efficiency, the less power is needed from the radio and the more economical the design. A lower efficiency antenna requires amplification which draws more current, thereby increasing energy consumption. Greater signal strength provides higher efficiency resulting in higher system integrity.

“This new family of stubby antennas is a great addition to the expanding Pulse M2M antenna range,” explained Elaine Baxter, marketing manager, Pulse Wireless Devices Antenna Division. “These cellular antennas are reliable and come in small form factors that enable companies to quickly bring their wireless M2M modems to market.”

Pulse's stubby cellular antennas are packaged in quantities of 20 each. Antennas come standard with SMA male connectors and are available with SMA RP-male versions with additional connector options to follow. Pricing and lead times are available upon request. Additional information on these and other M2M external antenna products can be found on the Pulse website in the antenna application section.

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, introduces
its new compact JKM platform, a 10-pin 1x1 gigabit RJ45, used for connecting a transceiver to an Ethernet cable. Pulse's compact footprint design allows for a 38% savings of circuit board space compared with existing gigabit JK0 platforms. This new platform was designed for OEMs that need compact components for low-end Ethernet applications such as set-top boxes.

Electrically, the JKM has been tested to comply with IEEE specifications and standards, such as IEEE802.3. The platform is backward-compatible to 10 Mbps and 100 Mbps data throughputs and is configurable to the latest core topologies so that it performs optimally with many voltage/current mode PHYs (transceivers) available today. Mechanically, the footprint is similar to most 10/100 1x1 RJ45s for easy board re-spin to enable migration of future products into the gigabit arena. It is also configurable with or without LEDs and EMI-fingers.

"This new JKM platform is a great addition to the LAN product families here at Pulse," said Rowan Noble, Pulse field application engineer. "We are excited to offer it to our customers needing compact solutions for their projects."

The JKM platform is packaged in trays. Lead time is 6-8 weeks. The JKM-0001NL datasheet can be found on the Pulse website.

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, introduces its new low cost, weatherproof antennas for 2.4 GHz devices used in industrial, smart grid metering, security, broadband access, and other machine-to-machine(M2M) applications. These robust, high-efficiency, compact antennas meet Bluetooth, WLAN, WiFi, IEEE 802.11b/g, ZigBee IEEE 802.15.4, and 2.4 GHz ISM band system standards.

Pulse’s W5001, W5010, and W5011 antennas function in ruggedized conditions, offering IP65 water ingress protection in accordance with international standard IEC 60529, UV protection, and the ability to withstand 100 mph wind loading. They have a maximum gain of 1.5 dBi in the 2,400 to 2,500 MHz range, an efficiency of 70%, and an operating temperature range of -40°C to 85°C.  The antennas have a small footprint and low profile, measuring only 128mm x 18mm.

 “Pulse has been focusing on  development of the highest performance antennas for the emerging smart grid, security, and industrial markets and we feel we’ve achieved that with this series of 2.4 GHz outdoor antennas,” said Kent Vu, product manager, Pulse Wireless Devices.  "They are extremely efficient yet very compact.”

Pulse’s W5001, W5010, and W5011 antennas are available in three SMA connector configurations: fixed right angle, straight SMA, and RP-SMA.  They are packaged in quantities of 20 pieces per bag.

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, introduces its W4120  Series of multi-band active GPS antennas that combines compact size with the capability to support most major wireless services globally.  This low-cost antenna features a low-profile housing that complies with Ingress Protection 67, making it suitable for outdoor use.  The active GPS antenna provides accurate location-based information that can be communicated back to the tracking location via commonly used wireless frequencies around the world, enabling fleet management, pay-as-you-drive insurance, navigation, locating, and other telematics applications.

The W4120 series antennas operate over 5 frequency bands -- 824 to 894 MHz, 880 to 960 MHz, 1710 to 1880 MHz, 1850 to 1990 MHz, and 1920 to 2170 MHz -- plus GPS.  The amplifier input voltage of 3 or 5 volts DC provides 26dBic of gain and compatibility with most commercially available receivers.  The compact 136x38x14mm antennas come individually packaged with separate double-sided tape for easy installation in any environment.  Various cable lengths and connector options are available.

“As telematics are increasingly used in commercial and industrial as well as consumer electronics applications, demand for compact, high-performance multi-band antennas that also provide GPS capabilities continues to grow,” said Beatrice Colbeau, Pulse wireless device product manager.  “Pulse will continue supporting customers with a broad range of antenna products to meet their emerging needs.”

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, introduces its new Larsen brand NMO (“new Motorola”) high-frequency (NMOHF) vehicle-mounted mobile antenna mount featuring an integrated active GPS antenna in a single compact rugged package.  With a broad operating frequency range of 27 MHz to 6 GHz, this combination antenna/mount provides GPS coverage for vehicle tracking and location applications together with wireless voice/data coverage.

Pulse’s NMOHFGPS series mount combines aesthetics with a small footprint and low profile, measuring only 4.5” long by 2" wide and just 0.7" tall (114.30mm x 50.80mm x 17.78mm).  An input voltage of 3 or 5 volts DC provides compatibility with most commercially available GPS navigation systems.  The integrated NMOHF mount provides impedance matching at frequencies above 1 GHz, superior to that of the industry standard NMO mount.  The mount is easily converted from low to high frequency through the removal of the mount center pin, which creates a coax-type connection optimal for high-frequency applications.

“The Pulse Larsen line invented the original NMO mount, developed the NMO high-frequency mount, and continues to set the standard for NMO antenna technology by increasing the NMOHF mount series to include GPS/mobile combinations,” said Steve Bruegger, Pulse sales manager for the Larsen brand.  “This antenna/mount configuration is ideal for public safety, telematics, machine-to-machine (M2M), automated meter reading (AMR), or any mobile application which requires wireless and GPS capabilities.”

The NMOHFGPS antenna mount provides an IP65 rating to protect against possible water ingress.

Pulse Electronics, a worldwide leader in electronic component and subassembly design and manufacturing, announces that its new SmartER™ B8887NL central office (CO) splitter module, at just 8mm high, is the lowest profile splitter module available on the market today.  This lower profile enables denser mounting of multi-channel splitter cards, meaning more modules per digital subscriber line access multiplexer (DSLAM) or roadside cabinet.  In addition, since CO splitter modules are often the tallest component on the board, the lower profile increases the airflow area between multi-channel splitter cards.

Pulse’s B8887NL CO splitter modules separate plain old telephone service (POTS) and DSL data signals.  The modules are TR-127 compliant for VDSL2 applications.  TR-127 is a technical report developed by the Broadband Forum to ensure the highest quality delivery of voice, data, and video services [“triple play”] by maximizing the interoperability of splitters and in-line filters with DSLAMs and modems.*  The modules also meet ETSI 600 ohm and China MII standards and incorporate Pulse’s patented technology for better performance, increased compactness, and high-quality construction.

“Pulse’s new splitter module adds a significant measure of flexibility to DSLAM and rack system designs,” explained Ronan Kelly, Pulse product marketing engineer.  “It has a maximum height of 8mm as compared to 11.5mm to 14mm in our other SmartER products.”

Pulse’s entire CO splitter family can be customized to this smaller height and similar footprint.  Reducing the rack by 0.5U allows an additional 7 racks to be included in a standard 42U cabinet.  The modules come in trays, but other packaging options are available.  Price and availability depend on volume.

Pulse Electronics, a worldwide leader in electronic component and sub-assembly design and manufacturing announces the immediate availability of its point of entry RF filter module for multimedia over coax (MoCA) applications. The standalone CX5060 filter passes cable television (CATV) Docsis 3.0 signals, blocks MoCA signals, and provides RFI shielding and surge protection within a weatherproof metal housing. It is used
by CATV service providers to isolate MoCA service within a single service point. MoCA technology allows a DVR, TVs, and other video products to share content within a given residence.

Pass band frequency for the CX5060 filter is from 5MHz to1002MHz with an impedance of 75 ohms and provides over 40dB of insertion loss in the MoCA frequency band (1125 - 2300MHz). The CX5060 is designed to operate over the temperature range of -40dC to +85dC. The filter’s electrical performance provides significant blockage of MoCA signals generated within a service location from leaking into the CATV plant.

Pulse’s filter has a compact, robust mechanical design with rotating bezel for ease of installation. It measures 2 in (5.08cm) long overall with a max diameter of 0.67 in (1.7cm). This product is designed for “side of the house” outdoor applications for CATV service suppliers. The package meets CATV industry specifications to withstand installation demands and to provide a long embedded life.

“Pulse’s low pass RF filter performs to the rigorous electrical specifications of all our Pulse MoCA filter products,” said Fred Roden, senior product manager, Pulse. “Pulse precision filter products have been designed in numerous products successfully certified by the MoCA Alliance testing program such as set-top boxes, video gateways, and optical network terminals. Pulse has 5 years of experience designing and manufacturing MoCA filters in high volume with market pricing. We are confident that this point of entry filter will provide an outstanding product for the CATV suppliers’ networks.

The CX5060 point of entry filter meets CATV industry Society of Cable and Telecommunications Engineers (SCTE) standards. Products are sold by carton and shipped sealed in plastic bags. The price and availability depend on volume. More information on Pulse’s CX5060 filter can be found on data sheet CX5060.

Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced that Voxtel, Inc., a leading developer of sophisticated detectors and electro-optical imaging systems, has integrated Nextreme's OptoCooler UPF4 thermoelectric cooler into Voxtel's VDHAX line of hermetically-packaged avalanche photodiode (APD) receivers. The new OptoCooler-equipped APD device will be used for applications in military laser radar and optical communications and commercial telecommunications.

Avalanche photodiodes are extremely sensitive semiconductor-based detectors of light in the ultraviolet, visible, and near-infrared ranges of the electromagnetic spectrum. APDs can multiply the signal produced by incident light by as much as 100 million times, enabling photon detection at very low light levels. Performance of an APD is usually limited by thermally-generated noise, which can be reduced by cooling the chip. Cooling of the photodiode improves its efficiency, lowers noise, broadens the spectral and frequency response, and improves the overall gain. Cooling also improves the device's reliability and life span required by stringent military laser radar and freespace optical communications standards.

"Our customers are requiring smaller packages that produce higher heat densities," said George Williams, President and CEO of Voxtel, Inc. "Nextreme's OptoCooler enables a lower cost structure and permits a greater amount of cooling of our new APD receiver over a wide range of environments; thereby providing stable operation and improved performance."

With Nextreme's thin-film thermal bump technology at its core, the OptoCooler™ UPF4 was integrated directly into the VDHAX TO-8 package to deliver more than 45°C of cooling during operation. The UPF4 removes a maximum of 610 mW of heat at 85°C ambient in an active footprint of only 0.55 mm2.

"We are pleased that Voxtel has chosen Nextreme's OptoCooler UPF4 for their thermal management solution," said Dr. Paul A. Magill, vice president of marketing and business development for Nextreme. "This represents further validation of our technology in a new application space and opens up a new channel for our OptoCooler product line."

The OptoCooler UPF4 is one of several products in Nextreme's OptoCooler family of thermoelectric coolers designed specifically for the optoelectronics and telecommunications industries. All models are available now for production volume orders. Pricing is available upon request.

Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced the availability of the OptoCooler HV series, a new class of RoHS-compliant high voltage and high heat pumping thermoelectric coolers that are optimized for standard circuitry and power requirements. The first module in the series, the OptoCooler HV14, is the latest product in Nextreme's OptoCooler™ family of thermoelectric coolers designed specifically for the optoelectronics and telecommunications industry.

The OptoCooler HV14 operates at a maximum voltage of 2.9V and can pump 1.7 watts of heat at 85°C in a footprint of only 2.8 mm2. The module can create a temperature differential (T) of up to 51°C between its hot and cold sides, making it ideally suited for the cooling and temperature control of optoelectronic devices such as laser diodes and high brightness LEDs.

At the core of the OptoCooler module is Nextreme's breakthrough Thermal Copper Pillar Bump, an electronic device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular, copper pillar solder bumps) used in electronic and optoelectronic packaging. Thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or other electrical component. Based on market demand and recent technology advances, Nextreme has reduced the size of the thermal bump by 75%, thereby increasing voltages by 300% and reducing current draw by the same proportion. The net result eliminates the need for special voltage conditioning and reduces the overall electrical current required to operate the device.

The new platform uses an array-based assembly (ABA) process that represents a vast improvement in throughput capability and manufacturing tolerances. The ABA process decreases the size of Nextreme’s thermal bumps to approximately 125 microns, which makes them flip-chip bumping compatible with standard solder bumping processes commonly used in electronics packaging. Consequently, as product volumes scale, manufacturers of LEDs and other semiconductor chips can integrate cooling and temperature control functionality directly in the package during assembly, resulting in a high-volume, low cost thermal management solution.

"The new HV Series removes unique voltage and current requirements as barriers to the integration of thin-film thermoelectrics into electronics," said Dave Koester, Vice President of Engineering for Nextreme. "The standard voltages and current operating ranges of the new OptoCooler HV14 fit well within the typical power design criteria for optoelectronic components and systems."

The OptoCooler HV14 is RoHS compliant and is available for order now. Pricing is available upon request.

Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced that future thermoelectric products will be manufactured using RoHS-compliant assembly methods. The company has developed non-lead-based solder processes for use in the manufacturing of its thin-film thermoelectric product line, meeting a major milestone in contributing to a healthier environment.

The Restriction of Hazardous Substances (RoHS) directive restricts the use of hazardous materials, including lead-based solder, in the manufacture of various types of electronic and electrical equipment. The directive was adopted in 2003 by the European Union (EU) in an initiative to address the growing global issue of substances found in consumer electronics waste that pose health risks. Although the EU has led the RoHS initiative, companies like Nextreme who are in the global electronics supply chain have followed suit in making their products RoHS compliant.

"RoHS compliance is becoming critical for companies like ours that operate in a global environment," said Dave Koester, vice president of engineering for Nextreme. "In addition to the health and environmental benefits of going lead-free, it's far more cost-effective to offer a product family that conforms to the world standard."

As the replacement for lead-based solder, Nextreme is using a Gold/Tin (AuSn) alloy. AuSn solder provides excellent joint strength and thermal conductivity. With a melting point of 278°C, AuSn enables the use of standard processes for the integration of Nextreme devices into photonic, microelectronic and optoelectronic device packages, such as laser diodes, semiconductor optical amplifiers and sensors, and to operate at higher temperatures.

“Gold/tin’s higher melting point and its acceptance in the optoelectronics market make the use of this alloy advantageous during assembly of our micro-scale thermoelectric products," said Koester. "It's another breakthrough allowing us to offer thin-film thermoelectric devices that conform to standard assembly processes."

Nextreme's thin-film thermoelectric products are manufactured in volume with the Copper Pillar Bump process, an established electronic packaging approach that scales well into large arrays. The Thermal Copper Pillar Bump process integrates thin-film thermoelectric material into the solder bumped interconnects that provide mechanical and electrical connections for today's high performance/high density integrated circuits. The company began production manufacturing of its OptoCooler product line in July 2008.

Monday, August 27, 2012

Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, introduces its new ultra-thin, active global positioning system (GPS) antenna with Global 3G functionality including GPRS, GSM, UMTS, and WCDMA. The W4150GG5000 antenna can be installed with either side facing up so only one antenna is required, whether mounting on the windshield or dashboard, to make installation simple.  It receives location information from a GPS satellite and uses the cellular network to transfer this location information to a central control center or third party. The antenna assists in vehicle and asset tracking and location, navigation, emergency call systems, fleet tracking, insurance tracking, and pay-as-you-go transport systems.

Pulse Electronics' GPS/3G antenna comes in a small elliptical package of 100 x 50mm with a height of only 8mm so it takes up less space on a vehicle's dashboard or windshield. Designed for in-vehicle adhesive mounting, the antenna combines a Pulse Electronics GPS ceramic chip antenna, a low noise amplifier, and 3G antenna functions resulting in a thinner profile than standard GPS and 3G band antennas while still maintaining an excellent level of performance.

The 3G antenna is suitable for global operation providing coverage at frequencies of 824-960/1710-2170 MHz with a gain of 2/4 dBi and a radiated efficiency of up to 70%. The GPS operates at 1575.42 MHz frequency with a gain of 26 dBi max.

"The W4150 series delivers high performance functionality integrated into an ultra-slim elliptical package which provides an aesthetically pleasing addition. It can be installed with either side facing up, making it an extremely flexible solution for the windscreen or dashboard of any vehicle," said Beatrice Colbeau, product manager Pulse Wireless Device Division.  "This antenna joins the W4120 and W4000 families as part of a growing range of telematic solutions available from Pulse."

The antennas are individually packaged with double-sided tape for easy installation. The antenna can be installed with either side facing up. It comes with RG-174 cable in a variety of lengths and SMA male connectors. Lead-time is eight weeks.

Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, introduces the first dual central office VDSL2 splitter module. The B8891DVNL combines two central office (CO) splitter modules onto one platform. This compact configuration increases available printed circuit board space by 40% while reducing the component count, resulting in new possibilities for high density board applications. Designers can increase the number of channels, potentially increasing a 24 channel CO splitter board to a 48 channel board, while maintaining the same printed circuit board dimensions, or can get the same functionality from a much smaller circuit board.  

"This dual central office splitter module is the first of its kind in our product range and to the market globally," said Ronan Kelly, product marketing engineer for Pulse Electronics. "Due to its compact size, this product offers the advantage of potentially doubling the number of channels on a central office splitter board without the customer having to change the physical form factor of the board. The dual nature of the B8891DVNL enables it to be used in high density central office VDSL2 applications. This product uses Pulse's patented technology that allows for better performance, increased compactness, and high quality construction."

Pulse Electronics' dual CO splitter module is used on a rack card in a DSLAM or within roadside cabinets to combine or split the POTS (plain old telephone service) from DSL (digital subscriber line) data. The module is compliant to China MII YD/T 1187-2006 ADSL2+ and VDSL2 600 ohm applications. It is RoHS-6 compliant and TR-127 compliant for ADSL2 and VDSL2 applications. TR-127 is a technical report developed by the Broadband Forum to ensure the highest quality delivery of voice, data, and video services (triple play) by maximizing the interoperability of splitters and in-line filters with DSLAMs and modems.

The dual splitter modules are supplied in trays, but other packaging options are available. Price and availability depend on volume. Samples and prices are available upon request.

Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, announces that its laser direct structuring (LDS) process was selected by Samsung Electronics Co, Ltd. for  producing three-dimensional antennas to be incorporated into future Samsung products that use an antenna. Pulse's LDS process creates an antenna pattern in three dimensions on a plastic part, giving Samsung's mobile device product designers an almost unlimited ability to put the antenna anywhere and use almost zero volume.   

"The LDS process is a game changer for the mobile phone market as 3D shapes are needed to gain ever smaller and thinner mobile devices," explained John Houston, senior vice president, Pulse Electronics. "3D antennas save space, produce better RF performance, and provide freedom for design. The LDS process produces an outstanding 3D antenna, giving the designers flexibility for late definition, changes, or fine tuning during production to meet stringent carrier requirements. Pulse's LDS process will benefit Samsung in the design and production of its next generation mobile devices."

Samsung has found that by using Pulse Electronics' LDS process it can offer mobile developers the slimmer, more ergonomic, stylish, and high-performance mobile devices they prefer. Pulse has provided Samsung with its process knowledge, ability to enable engineers to achieve higher production yields, and final product quality. Through this extraordinary 3D LDS antenna technology, the end user finally can have an extremely slim phone compared to existing 2D antenna technology.

Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, introduces its new laser direct structuring (LDS) antenna lasering process for antenna parts which are too long or large to fit well in conventional laser machines. Pulse Electronic's lasering process saves as much as 30% over manufacturing done with previous LDS lasering machines, making LDS antennas cost competitive alternatives for laptop computers, tablets, and notebooks while providing superior RF quality and freedom of design.

Pulse Electronics' LDS antenna lasering process for long and large parts makes LDS antennas cost competitive alternatives for laptops, and tablets, while providing superior RF quality and freedom of design.

"In Pulse, the development of manufacturing technology has always been of major importance in enabling new designs and solutions which materialize into attractive and high performing products,” explained Esa Kalistaja, engineering manager, Pulse Electronics Mobile Division. "High RF performance 3D-shaped antennas are increasingly needed to gain ever smaller and thinner mobile devices, especially in the desired round shapes. Pulse's efforts in manufacturing technology reinforce the translation of in-house RF and design expertise to cost-effective LDS antennas, which offer many benefits over other antenna solutions."

Development of Pulse Electronics' new lasering concept is based on LPKF Laser & Electronics' new Fusion 3D 1100 laser machine, which is adapted with a Pulse-designed and manufactured part handling system. This newly developed system is more capable of lasering long, large, or complex parts. The process has less design and dimensional limitations, yet still meets production efficiency.

LDS is the most capable 3D antenna manufacturing technology on the market and produces a high-performing 3D antenna. The laser beam transfers the antenna design directly onto a molded 3D surface, making prototyping and production faster. It enables design freedom and flexibility with quick versioning during the project phase, design freezing in the late project phase, and the ability to fine-tune the design during production to meet stringent carrier requirements. The production process is fast and easy to implement with low customer-specific tooling costs.

Pulse also manufactures cable assemblies that can be directly connected to all solderable materials, which is more cost effective than using connectors. With the RF performance benefits of LDS, this new process makes LDS antennas viable for the tablet and laptop market.

Pulse's LDS process enables fast product ramp-ups and seamless transfer between R&D and manufacturing sites. Pulse will install this state-of-art LDS machinery in many of its global locations to enhance R&D services in each continent. Pulse has been using LDS technology to manufacture antennas for handsets and laptops for several years. The new systems make laser processing for volume manufacturing of antennas for larger wireless devices such as laptops and tablets a practical option. 

Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, introduces its new 10GBASE-T  (10 Gigabit over twisted -pair) integrated connector module (ICM) for servers, LAN on motherboard (LOM), adapter cards, and storage devices. This new 1x1 RJ4510GBASE-T platform is halogen free and RoHS compliant and offers customers a choice of multiple LED configurations and EMI tab options.
It meets PCIe mechanical requirements and supports the latest 10GBASE-T physical layer device (PHY) technology and applications.

"We expect market demand for 10GBASE-T Ethernet magnetics to increase as businesses and data centers rely more on server virtualization and as computer processing speed continues to increase," said Chad Oblak, product manager, Pulse Electronics. "Pulse Electronics has been a leading 10GBASE-T magnetic supplier and at the forefront of innovations for 10 gigabit Ethernet for many years. Our new connector module helps satisfy market demand for faster data connections between servers and for storage devices."

Pulse-designed 10GBASE-T products meet or exceed IEEE 803.an requirements and are tuned to have flat insertion loss curves and excellent return loss performance at high frequencies. The PHY-side return loss up to 400 MHz meets or exceeds return loss requirements. A low insertion loss over the 1 MHz to 400 MHz band allows for longer cable reach. This new platform is designed to help meet tough EMC system requirements such as FCC Part 15 class B.

In addition to the new 1x1 platform, Pulse currently has a wide selection of 10GBASE-T discrete magnetic products in production.  Pulse is currently working to release a 2xN (2 to 16 port) ICM targeted to the high-end switch market. Pulse Electronics continues to be proactive in developing products that are safe for the environment and reduce potential health risks.

The connector modules are packaged in trays. They are priced at approximately $8.50 each with volume discounts available. Samples and prices are available upon request.

Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, has collaborated with STMicroelectronics, one of the world’s largest semiconductor manufacturers and a leader in chips for smart metering, on research testing the accuracy of current sensing in metering applications. The application note, "Current sensing in metering applications using a Pulse Electronics current sensor and ST metering devices," is now available on the Pulse Electronics and STMicroelectronics websites.

The study tested STMicroelectronic’s STPMxx metering devices using several different current sensors. Pulse Electronics' di/dt current sensor, based on the Rogowski coil principle*, offered exceptional linearity over a wide current range. When used with  STPMxx ICs, the accuracy of the meter is boosted, meeting the Class 0.2 S accuracy limits defined by the IEC 62053-22 meter standard for currents from 0.1 A to 200 A.

“STPMxx presents multiple benefits because of a proprietary power calculation and digital signal processing algorithm developed specifically for Rogowski coil-based sensors and the capability of mutual current compensation when multiple sensors are used,” explained Giuseppe Privitera, energy metering application manager, Industrial and Power Conversion Division, STMicroelectronics.

"While the Rogowski coil principle is well-known and has been widely implemented in various current sensing devices, the engineering challenge has been to control the winding characteristics to achieve the accurate current measurements required for metering applications," said Gerard Healy, field application engineer at Pulse Electronics Europe and co-author of the paper with Privitera. " Pulse Electronics has developed a precision winding technique that controls the parameters which directly influence the output voltage. A patent-pending segmented winding approach allows for a high number of winding turns per unit length to provide a sufficiently large output voltage for detection and integration. Pulse's winding configuration meets Class 1 requirements for immunity to external magnetic fields and an additional Faraday shield over the winding prevents electrostatic voltage coupling from the AC voltage of the conductor.”

The Pulse Electronics current sensor used in the study was the PA2999.006NL, which has now been replaced with the improved PA3202NL. The coil winding technique is implemented in this highly automatable, low-cost standard product which is lightweight and, due to the Rogowski coil as a voltage source, is a zero power-consumption device with a stable voltage over a wide temperature range. The Pulse current sensor was developed as an alternative to the current transformer typically used in metering applications.

The STPMxx is a family of energy metering ASSPs (application specific standard products) designed to address a wide range of electricity metering requirements thanks to built-in features including signal conditioning, signal processing, data conversion, input/output signals, and voltage reference. These devices are designed for effective measurement of active, reactive, and apparent energy in a single- or poly-phase system using Rogowski coil-based sensors, current transformers, or shunt sensors, and can be implemented as a single-chip energy meter or as a peripheral measurement system in a microcontroller-based energy meter.

Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, introduces the first 700-LTE (long term evolution), high-performance, low profile antenna for LTE-enabled tablets. This switchable antenna for mobile connected PCs is only 1mm high. It enables 4 states for low band: 700-750MHz (LTE low), 750-790MHz (LTE high), 820-900MHz (GSM850), and 880-960MHz (GSM900), and covers 1800/1900/2100 for high band applications, with switching implemented directly from the device's display area.

"Real-time applications, games, video downloading, and other ultra-fast broadband services require LTE. Advanced antenna solutions are a key concept behind the superior performance of LTE. Yet, incorporating LTE in the thin, sleek, tablet PCs has provided challenges to tablet designers and manufacturers. In addition, tablets have to accommodate lower bands and GSM and these all have to be interchangeable. Pulse Electronics' new antenna makes switching frequencies easy, is only 1mm high, and provides high performance for mobile connected PCs," explained Maritta Timosaari, director of sales and marketing for Pulse Electronics Mobile Division.

Pulse Electronics' LTE antenna has a length of 65mm and a width of 12mm, incorporating flexibility as the length can be varied according to customer requirements. The antenna can be adjusted for various display sizes, as long as good grounding to the display shield can be provided. Because the antenna pattern is basically planar, it can be installed at the furthest point from the body, which makes it favorable for SAR-sensitive applications. It is compatible with metal tablet holders and with several antenna manufacturing technologies, such as LDS, flex, and sheet metal. The switch is a Sony SP4T.

Pulse Electronics' switchable antenna for LTE applications is RoHS compliant. It is customizable. Engineering samples are available.

Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, introduces pin-in-paste RJ45 connectors with integrated magnetics (ICM). The pin-in-paste method, also called pin-in-hole or intrusive reflow, is a process that allows through-hole components to be reflow soldered instead of wave soldered. The pin-in-paste option has been added to the Pulse Electronics PulseJack™ JXR0 and JXR1 1x1 tab down and tab up 100BASE-T ICM product families and is being developed for implementation in select Pulse Electronics 1000Base-T ICM families as well. Because the ICM is compatible in a pin-in-paste process, it completely eliminates the need for the added wave soldering process, saving time, increasing throughput, and reducing costs.

A typical production process of electronic printed circuit boards (PCB) consists of a component placement process and soldering of the components to the PCB. When you have both surface mount (SMT) components and through-hole (TH) components you have to process the PCB through both a reflow solder process for the SMT components and a wave soldering process for the TH components.  The ICM is often the only TH component on the PCB, so wave soldering would be necessary specifically for that part.

“Pulse Electronics designed these pin-in-paste through-hole ICMs in response to market demand to remove wave soldering from the PCB manufacturing process,” said Jonas Miller, product line manager, Pulse Electronics.  “These connectors can also be inserted into the PCB using industry standard pick-and-place equipment, eliminating the need for manual component placement.”

Pulse Electronics’ high temperature-rated RJ45 connectors withstand a maximum reflow temperature of 260oC and operate over an extended temperature range of -40 to + 85oC, meeting  all IEEE 802.3 specifications. They are packaged in tubes or tape and reel. Prices start at approximately $5.11 each.  High volume discounts are available. Lead time is 8 to 10 weeks.