Wednesday, October 24, 2012

Nihon Dempa Kogyo Co.Ltd. today announced development of a "Mechanical 3D linear array probe" for advanced 3D/4D imaging applications in diagnostic ultrasound.This probe is targeted at breast scanning, but is also suitable for other clinical applications requiring high resolution 3D imaging over a wide field of view.

The mechanical 3D linear array probe is of novel design, with a sliding linear scan of a linear array. NDK's unique linear slide scan, the first of its type in the world, was developed to improved lateral resolution and increase diagnostic function compared to conventional circular scan geometries.

Additionally, the mechanical 3D linear array probe has a flat surface, allowing more even contact with soft tissue such as the breast.

NDK will start shipping a samples of this probe from June 2008.

NIHON DEMPA KOGYO CO., LTD. has developed an ultra-compact Voltage-Controlled Crystal Oscillator NV2520SA.

With the spread of digital broadcasting-capable mobile devices, there is a growing need for a compact and high-performance VCXO as a clock oscillator for the processing of complex image signals.

In order to meet this need, with the use of the high density mounting technology, we have developed NV2520SA , which is one of the industry’s smallest package (Dimension: 2.5 × 2.0 × 0.8mm). Although it is ultra-compact, it has Frequency control range "Min. ±100×10-6". Also, it has a wide Operating temperature range of from - 40 °C to +85 °C, and can be used under a wide variety of environmental conditions.

NIHON DEMPA KOGYO CO., LTD. has developed an ultra-compact Temperature Compensated Crystal Oscillator NT2016SB.

Recently, there has been a growing need for GPS-equipped mobile phones and mobile terminals. Amid the need for miniaturization, an extremely high precision has been required for the GPS function on these devices, and the need to reduce the power consumption has increased due to the multifunctionality of mobile phones.

In order to meet these needs, we have developed an ultra-compact, light and low profile (0.8 mm max) TCXO NT2016SB which has highly stable frequency-temperature characteristics and operates with lower power consumption due to the Enable/Disable function.

NIHON DEMPA KOGYO CO., LTD. has developed the world's first environment-friendly, miniaturized (2.5 x 2.0 x 0.9 mm) and ultralow power-driven crystal clock oscillator “NZ2520SF”.

Recently, eco-friendly products have become popular in various applications, and the move towards energy conservation has accelerated. For this reason, there is a strong demand for electronic components constituting these products to be environment-friendly, and due to the requirements for long-life battery and multi-functionality, energy conservation through both miniaturization and power saving is desired especially in compact devices such as mobile phones or handheld devices. In order to meet these market needs, we have developed a crystal clock oscillator that can be operated at ultralow power (0.8V min).

“NZ2520SF” is the world's first* 2.5 x 2.0 mm type crystal clock oscillator that can be operated at ultralow power (0.8V min). In comparison with existing crystal clock oscillators, the operating voltage is about 50% lower and the current consumption is at least 40% lower (Fig.1). This is equivalent to approximately 70% reduction in power consumption.

This product helps achieve low-power operation, has significant increase in battery life and reduction in environmental load especially in mobile devices such as multi-functional mobile phones, silicon audio players, PND (Personal Navigation Device)and notebook computers. Due to its wide frequency range (1.5 to 50MHz), other than mobile application devices, it can be used in a wide range of electronic devices, leading to environmental load reductions in various fields in the electronics industry.

NIHON DEMPA KOGYO CO., LTD. (President : Hiroshi Takeuchi) has developed and started to ship mass-produced compact high frequency range type VCXO (Voltage-Controlled Crystal Oscillators).

Miniaturization of devices is required at high-speed wireless broadband networks and base stations for mobile communications from the perspective of establishing low-cost installations and operation. High frequency clock signals between 600 MHz to 700 MHz are required for the optical transmission devices and optical multiple-wavelength transmission devices used in these base stations and core networks.

In order to meet the market requirements, NDK has developed the “NV7050SA” VCXO. It handles high frequency and has a small package, 7.0 × 5.0mm (one-tenth volume compared to the conventional products) while maintaining the same frequency stability and pull-ability range as the conventional products. Furthermore, ultralow phase jitter is achieved at a few tens of femtoseconds, which is an order of magnitude lower than previously developed products.

PLL frequency multiplication is generally used to obtain high frequencies in the range of hundreds of MHz, however the drawback is phase jitter is magnified during this process which can significantly degrade the quality of transmission signals. Through NDK's proprietary technical knowledge, high frequency fundamental crystal units were designed and applied to obtain high frequencies without the need for PLL frequency multiplication processing. This has enabled the phase jitter to reduce to values of one quarter to one fifth the level of phase jitter produced by conventional PLL multiplication type VCXO.

MSP430-JTAG-ISO-MK2 has power profiling functionality which can be used from MSPDebug. When a chip is running, the debugger continuously captures current consumption and MAB (program counter) samples, which can be read and analysed.

As of 4 Oct 2012, MSPDebug contains support for the following power profiling functionality:
  •     Basic statistics (average current, run time, charge consumption).
  •     Time-domain analysis, including exporting of raw samples to CSV format.
  •     Disassembly annotations, which show power consumption on a per-instruction basis.
  •     Hotspot/profile analysis to discover which functions are consuming the most power.
The driver for this device supports both raw USB and tty access, and can be used to perform firmware updates.

MSPDEBUG is open source tool, for debugging MSP430 microcontrollers. The project is hosted on Sourceforge

The next logical step is to create IDE with MSPGCC+Eclipse+MSPDEBUG plugin for one completely free development environment for MSP430 supporting all MSP430 devices and JTAGs on the market +  Power Profiling feature if you use MSP430-JTAG-ISO-MK2. The IDE will support Linux and Windows and we hope to be able to demonstrate it at Electronica 2012 in November.

MOD-IO2 is UEXT module with two relays and 7 GPIOs, which can work with any of our boards with UEXT connectors.As MOD-IO2 are stackable you can have as many IOs as you want to your UEXT board by simply plug together MOD-IO2 boards, so you can have 2,4,6 etc controllable relays.
The modules talk via I2C and the protocol is very easy. You can command the relays and read the GPIO status.

Everyone have chance to win this board if answer correctly our Quiz question.

Today at 17.00 o’clock our local Bulgarian time (GMT+3) we will post on Twitter our question.

You have one hour to reply to our tweet with the correct answer.

At 18.00 o’clock we will count the correct answers and ask to generate random number in range then anнounce the winner and ship the board by airmail next Monday.

UEXT connector allow many and different devices to be attached to it.

To may they all work together without collisions I2C protocol is used to address them.

The protocol is like this:

– this is the unique OLIMEX I2C address which is 0×48 this address is used to talk to all Olimex UEXT modules.

– this is the ID of every UEXT module TYPE which is attached to the I2C bus, for instance if we want to talk to MOD-IO2 this ID is 0×02

– as we can have many MOD-IO2 connected on the I2C but this is the MOD-IO2 address number which we talk to, each MOD-IO2 by default have address 0xA0, this address can be re-programmed to other value so many MOD-IO2 to be connected together.

– allow specific command to be sent to the UEXT module like switch relays, read GPIOs, read AINx etc.

Set-relay command is 0×40, Set-new-address command is 0xB0, read AIN0 is 0×10 read AIN7 is 0×17 and so on.

if we use I2CTOOL we can talk easily to MOD-IO2 connected to iMX233-OLinuXino, for instance to switch both relays ON we can do:

$ ./i2c-tool -w 0 0×48 4 0×02 0xA0 0×40 0×03

where -w means I2C write, 0 – this is I2C channel we write to channel 0, 0×48 is OLIMEX I2C address, 4 is number of bytes to follow, 0×02 is MOD-IO2 ID, 0xA0 is default MOD-IO2 address, 0×40 is set-relay command, 0×03 is set both relays

Gameduino is open source game shield for Arduino compatible boards and you can see number of games implemented on this shield.

We love it and decided that we have to make one but to be available for our boards with UEXT connectors, and this is how we made MOD-VGA.

What we add more to MOD-VGA is PS2 keyboard connector so one who want to use keypad or keyboard while play the games now have access to one.

Also original Gameduino is restricted to 400×300 pixels with 512 colors as use internal FPGA RAM as video memory. We decided to add optionally 32MB of SD-RAM as option to MOD-VGA so higher resolutions and more colors to be available (with proper new FPGA firmware). If someone is experienced with FPGA and want to play with MOD-VGA trying to implement higher resolutions please let me know I will send you board.

Originally MOD-VGA was intended mostly to run with Duinomite as it is monochrome, Ken Segler worked for a while on this idea but later on he got busy with other stuff so he never completed the MOD-VGA support in DuinoMite BASIC firmware.

So for the moment you can use MOD-VGA with Arduino and compatible.

LDMicro created by Jonathan Westhues is nice free program which can turn any PIC or AVR microcontroller in PLC with ladder logic.

The list of the supported devices is:
  •     PIC16F628(A), PIC16F88, PIC16F819, PIC16F877(A), PIC16F876(A), PIC16F887, PIC16F886
  •     ATmega128, ATmega64, ATmega162, ATmega32, ATmega16, ATmega8
LDmicro allow you to make your ladder schematic then to generate HEX code which does the ladder logic implementation in program code which you program to your AVR or PIC and got the ladder logic functionality.

LDmicro have interfaces in 7 languages.

PIC-IO supports PIC16F628 and AVR-IO supports ATMega8 you can use these boards with LDmicro, AVR-IO-M16 and MOD-IO have ATmega16 on it so they are ready to go.

You will need also programmers to load the generated HEX files to the boards, for PIC we recommend PIC-KIT3 and for AVR we recommend AVR-ISP-MK2

LDmicro adds nice functionality to PIC-IO and MOD-IO, AVR-IO, AVR-IO-M16 and offer yet another option to program these boards.

MOD-VGA is open source hardware project based on the popular Gameduino shield for Arduino. What we improved here is to add PS2 keyboard as what is Game play without keyboard anyway? and to add option for 32MB SDRAM on board which allow firmware to be improved at later stage to support higher resolutions and more features.

Right now MOD-VGA runs the normal Gameduino firmware and act as normal Gameduino.

Everyone have chance to win this board if answer correctly our Quiz question.

Today at 17.00 o’clock our local Bulgarian time (GMT+3) we will post on Twitter our question.

You have one hour to reply to our tweet with the correct answer.

At 18.00 o’clock we will count the correct answers and ask to generate random number in range then anнounce the winner and ship the board by airmail next Monday.

OLinuXino was designed with the idea everyone to may tailor it later to his own needs and now we start to see fruits of this.

When we announced the start of this project many people were comparing iMX233 with Raspberry Pi, Beagle Bone and  was telling us that our Linux board is with so small amount of RAM and at lower frequency and that it would not be popular and people will have no much use of it.

The practice though proved that we were right with our idea big time.

Now every week we get messages from customers of ours who successfully implemented large scale projects based on iMX233-OLinuXino, as it’s reliable, robust, simple … and easy to re-produce.

Both Raspberry Pi and Beagle Bone use BGA processors which are troublesome to assembly in companies with limited resources, but even home amateur could arrange assembly in house of iMX233 based board with TQFP package.

One project which we learned is for web based water pool controller / data logger with potential of 50K units per year (do they really have so many in house pools in USA? I envy)

Another project was fleet management with GPS/GSM for vehicle logging with potential several thousands units per year.

Today we got message from Australia for project based on OLinuXino for Lighting in the Cloud.

The interesting here is that this project first was based on the famous Raspberry Pi, but then they moved it to iMX233-OLinuXino-MICRO.
Why? Because OLinuXino is Open Source Hardware – once you make your project then you can customize it to your needs – something you can’t do With RPi.

Also since the big demand we read on element14 forum that RS Components didn’t deliver any RPi to their customers since July this year as Broadcom can’t ship them processors (!)
So if you need 1-2 boards to play at home RPi may give you more as specs, but if you want to make PRODUCT, OLinuXino is much more attractive as platform.

In the long term RPi wins the kids to play games at home, OLinuXino wins when you make Product and industrial apps.

Yesterday we got yet another amazing project by our friend Dimitar Gamishev.

He was playing with A13-OLinuXino-WIFI and decided to learn how to write Android applications, but he didn’t stop with “Hello world”

What he decided to try is to interface low level resources to his Android application like to implement I2C communication and control of MOD-IO connected to A13-OLinuXino UEXT connector.

With it you can switch on/off relays on MOD-IO and read the Input status and ADC analog values (the trimmer potentiometer on the picture).

The sources are at GitHub what he did was to use Android NDK to implement the I2C communication in C then to export it and make it public for use by the Android SDK java applications. As you can see the result is Android APK which you can run and it communicates with MOD-IO connected to UEXT.

Using the same approach all GPIOs, SPIs, I2C and etc resources on A13-OLinuXino can be made available for native Android SDK applications and you can intereface real world hardware with pure Android application code.

OMRON Healthcare Co., Ltd., a wholly owned subsidiary of OMRON Corporation announced that its i-Temp digital thermometer (model MC-670-E) wins Reddot Design Award (*1), in the category of Product Design 2008.

Reddot Design Award is recognized as one of the top three renowned design competitions (*2) in the world and awarded by Nordrhein Westfalen Design Center in Germany since 1955. Each year many entries are submitted from throughout the world for a variety of industrial products. There are three different categories for the awards: ‘product design’, ‘communication design’, and ‘design concept’. The entries are reviewed and evaluated according to the nine criteria such as degree of innovation, functionality, formal quality, ergonomic consideration and environmental friendliness to honor excellent and outstanding designs. In 2008, total of 3,203 submissions were made from 51 countries throughout the world, and 676 products were selected as the winners.

Our award-winning thermometer, i-Temp (MC-670-E) is the European version of the model MC-670, which was launched in Japan in November 2004. Sharing many features with MC-670 - a flat tip that allows users to hold it comfortably in the armpit, a large, easy-to-read LCD and a sleek body that fits easily in the hand - i-Temp was released in Europe, the Middle East and Africa in October,2007. i-Temp was highly regarded by the judges for its easy-to-read large LCD, innovative and functional design and its high quality for users of all ages. i-Temp also won the ‘iF Design Gold Award’ in 2007.

Reddot gala award ceremony will be held on June 23, 2008 in the Essen Aalto-Theater. The award-winning products were exhibited in Reddot Design Museum from June 24 to July 27, 2008 and will be preserved there permanently thereafter.

OMRON Corporation (TOKYO: 6645, ADR: OMRNY) today announced that, in cooperation with Hitachi, Ltd., it has achieved compatibility between its V750 series UHF RFID reader/writer and Secure RFID Protocol. Additional security functions provided by the protocol will be available as an option beginning in July 2008.

Secure RFID Protocol was developed through the Secure Electronic Tag Project led by Japan’s Ministry of Economy, Trade and Industry (METI), with Hitachi as a core partner, from August 2006 to March 2007. The protocol provides enhanced security functions including communication distance control, which restricts the communication range of tags, and reading prohibition, which limits access to tags through password authentication, while maintaining compatibility with the UHF RFID international standard ISO/IEC 18000-6 Type C. A Secure RFID Protocol-ready IC developed by Hitachi, “µ-Chip(mu-chip) Hibiki,” is already on the market.

RFID in the UHF band (860MHz to 960MHz) realizes longer communication ranges among passive-type tags and conducts faster and more diverse data processing as compared with HF band (13.56MHz) systems. Prompted by major retailers in the USA, UHF RFID systems are increasingly being used around the world in areas ranging from manufacturing, distribution and logistics to stores, offices, public services and amusement/sports facilities. However, in open systems shared by multiple companies, one company’s unique data (embedded on a tag) could easily be passed on to other companies along with shared data. The fact that all companies in an open system can read and alter all the data on tags is becoming an obstacle to the utilization of RFID systems.

To date, Omron has developed a number of RFID reader/writers, inlays and tags mainly focusing on the HF and UHF bands. Omron’s products are designed not only to comply with common standards, but also to easily incorporate new functions and advanced technologies developed in response to market needs. By readying the V750 reader/writer for Secure RFID Protocol, Omron acknowledges that protecting company and product information is critical to increasing the use of RFID in distribution and logistics. In Japan, feasibility studies and trials of secured RFID systems are increasingly being carried out by book and home appliance distribution chains, and Omron intends to proactively participate in those studies.

New functions can be added to the V750 reader/writer by updating or supplementing its firmware. Secure RFID Protocol will be separated from the standard functions provided by the current product, and will be offered as an option to be added upon request. The protocol will be ready for the Japanese version of the V750 reader/writer in July 2008; other versions will be provided based on the protocol’s popularity in other countries.

The Secure RFID Protocol-ready V750 reader/writer can be seen at the Hitachi Group and Nissei Limited booths (West 10-53 and West 13-11, respectively) at the 3rd RFID Solutions Expo (RIDEX), being held at Tokyo Big Sight from May 14-16, 2008.

Yo Nakajima, General Manager of Hitachi’s Security Smart ID Solutions Division, offered the following remarks on the V750 reader/writer: “Hitachi welcomes the start of sales of interrogators that support the Secure RFID Protocol. The protocol has been developed with partners aiming to realize functions that fulfill needs for UHF IC tags in Japanese industry. We believe this protocol will expand worldwide and become the optimal UHF IC tag air protocol in the distribution and logistics area. We are expecting full-scale diffusion and market expansion of secured IC tags, triggered by sales of Omron’s V750 reader/writer. Hitachi will also keep making efforts to promote the protocol, and by so doing contribute to realizing a securer, safer and more comfortable society with all of our partners.”

OMRON Corporation (TOKYO: 6645, ADR: OMRNY) today announced the release of three new products, the SYSMAC CJ2 programmable controller, EtherNet unit for CS/CJ series and CX-One FA Integrated Tool Package version 3.0, to markets. All of these products support EtherNet/IP for industrial use.1

The Company also announced the release of NS-series NS-V2 programmable terminals that have been upgraded to support EtherNet/IP.

These products help to reduce the TCO in designing and developing production equipment for immediate startup with quick delivery, as well as equipment that requires greater complexity and higher speed in control operations.

Products released today include the following models:
  •     SYSMAC CJ-series Programmable Controller CJ2 CPU Units
  •     CJ2H-CPU68-EIP and four other models
  •     EtherNet/IP Units for CS/CJ-series Programmable Controllers
  •     CS1W-EIP21 and CJ1W-EIP21
  •     NS-V2-series Programmable Terminals
  •     NS12-TS01B-V2 and 25 other models (system version upgrade)
  •     CX-One FA Integrated Tool Package Version 3.0
  •     CXONE-AL01C-V3 and 11 other models
With current international competition, manufacturing sites for key production industries, such as automobiles, semiconductors and liquid crystal and plasma displays, demand 1) immediate equipment startup with large capital investment in the first period, 2) fast additions and changes in production models, volumes and line compositions after the equipment is in operation, and 3) meeting traceability and other global requirements for quality, safety and environmental needs. These demands require even greater amounts of quality data along with faster accumulation and processing of production management data.

Manufacturers of special equipment and machinery must flexibly respond to these rapid changes, cope with the increase in management data resulting from improved device functionality and performance, and achieve control with greater performance and accuracy with more precise production processes. These manufacturers are actively introducing control devices for open networks, standardization and specifications that allow the development of control systems with greater speed and precision and enable stable worldwide product procurement.

All the new products marketed by OMRON support EtherNet/IP, a global standard industrial protocol promoted by the ODVA.2 In addition to the convenience of universal Ethernet, EtherNet/IP can be used for both information and control networks. Data links are faster (30 times faster, according to OMRON’s own research) and the data communications capacity is larger (nine times the capacity, as above). These features make the products ideal for production equipment that will require increasingly larger capacity and higher speeds in the future.

The SYSMAC CJ2 CPU units feature large capacity and a built-in EtherNet/IP-compatible multifunctional Ethernet port. The program capacity of 400K steps is 1.6 times the capacity, while the 832K words of data memory is twice the capacity of previous OMRON products. In addition, the CJ2 CPU units are ideal for devices that require high speed and high precision with both faster speeds for executing special instructions, such as overseeing processing and floating-point math, and increased speed for immediate refreshing of basic I/O.

Also, less design time is required because PT screen data and PLC programming can be developed in parallel with improved tag access through EtherNet/IP for full access to memory in the CJ2 CPU unit from an NS-series programmable terminal.

The CX-One FA Integrated Tool Package that supports the SYSMAC CJ2 CPU units and the NS-V2-series PTs also supports EtherNet/IP. This provides an environment for setting up the all layers of FA networks, and allows users to set up both SYSMAC CJ2 CPU units and NS-V2-series PTs from the same software package.

OMRON Corporation (TOKYO: 6645, ADR: OMRNY) today announced plans to release the XF3C, a low-profile FPC connector with a pitch of only 0.25 mm, in early September. The XF3C represents a 20% reduction in footprint compared to previous OMRON connectors.

FPCs (flexible printed circuits) are used in a wide range of applications, including mobile devices. Recently, there has been an increase in the use of FPC connectors with impact-resistant backlock mechanisms for mobile devices such as cellular phones, MP3 players, and notebook PCs. In addition, demand is strong for smaller FPC connectors to meet the need to reduce mounting space inside devices accompanying the trend toward smaller and thinner devices.

In response, OMRON developed the XF3C connector, which has a pitch of 0.25 mm, a depth of 3.8 mm (when locked), and a footprint approximately 20% smaller than that of previous OMRON connectors, which had a 0.3 mm pitch. Within its 0.85 mm height, the connector contains the contact structure for both the upper and lower contacts, eliminating the need to differentiate between them and in turn contributing to the standardization of connectors.

OMRON Corporation (TOKYO: 6645, ADR: OMRNY) today announced the release of two new products in its SYSMAC CJ2 series of programmable controllers, CJ2 CPU units and basic I/O units, to markets.

Model numbers are as follows. CJ2H CPU units: CJ2H-CPU68, CJ2H-CPU67, CJ2H-CPU66, CJ2H-CPU65 and CJ2H-CPU64. Basic I/O units: CJ1W-ID212, CJ1W-ID233, CJ1W-OD213 and CJ1W-OD234.

OMRON's industrial automation business (OMRON IA) developed the SYSMAC CJ series to meet customer demand for high-speed programmable controllers, which has increased as manufacturing industry equipment becomes more complicated and the work of fabrication more minute. In developing the CJ2H CPU units released today, OMRON IA reexamined not only the CPU's processing power but also the interface with the units to be connected, offering customers total improvement of system throughput. In addition, the company plans to release a succession of high-speed, high-performance units including analog and positioning units, starting with the basic I/O units released today.

Osaka University, Kintetsu Corporation ( 'Kintetsu'), OMRON Corporation ( 'OMRON') and Hankyu Corporation ( 'Hankyu') today received the prestigious Milestone designation1 from the Institute of Electrical and Electronics Engineers (IEEE2) in recognition of the parts they played in the development and deployment of automated railway ticket gates.

IEEE is the world's leading professional association in the fields of electrical, electronics and computer engineering, and telecommunications. The IEEE Milestone designation recognizes the innovations achieved by the four parties over the period from 1965 to 1971. These achievements range from research on the logic architecture for high-speed validation of commuter passes to the deployment of automated ticket gates capable of accepting both magnetic tickets and commuter passes.

Nearly 40 years ago, Osaka University and Kintetsu launched a research project aimed at automating commuter ticket inspection and validation. The project reflected an earnest desire to relieve congestion at ticket gates in train stations during rush hour, which was a major social issue in Japan at the time. The first outcome of this joint research was a calculation method for verifying the prescribed route and section of each passenger's commuter pass. This method was further refined so that it could be implemented on routes where fares differ depending on the boarding and destination stations. The joint efforts of Kintetsu and OMRON then led to the development of a new mechanism called the 'Normally Open Gate System', which was unique to Japan. This system can speedily check and validate a large number of commuter passes in succession while keeping the gate open. The development drove progress in the practical application of automated ticket gates. R&D work on automated ticket gates was then taken over by OMRON and Hankyu, finally leading to the deployment of the world's first automated ticket gate system at Hankyu Railway's Kita-Senri station in March 1967. The system consisted of machines that accepted punch-card commuter passes and machines that handled regular tickets with magnetically recorded (barcode) information.

Later, the Congress of Japan Railway Cybernetics (CJRC) established magnetic recording as the standard data recording technology for ticket gate machines. In response, Kintetsu and OMRON jointly developed an automated gate machine that met the CJRC's standards with its ability to read magnetic commuter pass cards in 1971. In April of the same year, automated ticket gate machines were installed and put into operation at Kintetsu Railway's 19 stations including Osaka-Abenobashi station. This large-scale, simultaneous deployment prompted many other railway companies to introduce automated ticket gates in their own systems. In 1972, Hankyu replaced their gates at Kita-Senri station with new machines designed for use with both magnetic card type commuter passes and tickets. By 1975, virtually all private railway lines and subways in the Kansai area (Osaka, Kobe and Kyoto) had implemented automated ticket gate systems.

In the 1970s, deployment of automated ticket gates accelerated, centering on the Kansai region of Japan. In the Kanto region (Tokyo and neighboring prefectures), deployment was slower due to the complexity of the railway network. The challenge was to create common-use tickets for connecting the lines of multiple transit operators. With technological breakthroughs that enabled tremendous increases in data storage capacity for magnetic tickets, the deployment of gate systems advanced quickly in the Kanto region after 1990.

In 1991, East Japan Railway Company (JR East) launched its 'IO-Card', a stored value card that could be directly inserted into ticket gates. Hankyu introduced a similar system on all of its lines in 1992. Such developments greatly improved passenger convenience.

In 1996, the 'surutto KANSAI' prepaid rail pass service was launched by five railway companies in Kansai. It allowed the use of a single common card on many different lines operated by multiple railroads, subways and buses in the Kansai region-the first of its kind in Japan. During the course of these developments, technological breakthroughs produced by OMRON and other manufacturers gave rise to further improvements in passenger convenience through the introduction of gates that could simultaneously process a ticket and card or two cards together. The debut of automated ticket gates for Shinkansen (bullet train) tickets also expanded usage of these machines.

Recently, the deployment of automated ticket gates compatible with contactless IC cards has spread throughout Japan. At the same time, more and more rail, subway, bus and other service companies allow common use of a single IC card. New applications of automated ticket gates that go beyond inspecting train passes/tickets are also being promoted, such as OMRON's new 'Anshin Goopas' (Goopas Child Safeguard). This service is designed to send an email notification to a parent's mobile phone when a child commuting to school passes through a ticket gate using a specific IC card. Through these and other services, the recipients of this IEEE Milestone designation are determined to continue contributing to people's safety, security and comfort.

Wednesday, October 17, 2012

Stealthy defects that used to slip through your best production line defenses will now sound the alarm – and get stopped cold, right on the line. That’s because SnakeEye non-contact infrared thermal sensors actually detect the undetectable. So defective products or packaging that previously found their way into customers’ hands never leave your plant. SnakeEye’s breakthrough Infrared μCalorimetry™ technology can detect the tiniest amount of heat energy in a product without ever touching it, accurately validating sealing integrity.

Whether hot-melt, cold glue, two-part mixtures, UV-activated or any other process, SnakeEye detects the presence or absence and precise position of adhesive on every product on the line. In fact, recent controlled tests showed a SnakeEyeequipped line to deliver 99.997% perfect product, with just .003% scrap!

SnakeEye is small enough to mount easily on new or existing production line machinery, and can add value while cutting waste in any industry, product or process:

• Case sealing: SnakeEye verifies that hotmelt glue or other coatings have been properly applied; eliminates the possibility of scrap or defective shipping cases.

• Packaging: SnakeEye verifies sealing integrity on every package – no more “open flap” nightmares.

• Bottling & Canning: SnakeEye ensures that labels and laser-engraved date codes are applied to every container – and that product is inside even opaque containers.

• Pharmaceutical: SnakeEye instantly detects induction heater malfunction, missing labels or foil safety seals, enhancing validation and cutting costly waste.

• Press-Fit Manufacturing: Interference-fitted metal or plastic parts release a distinctive, detectable heat pulse during manufacturing. SnakeEye ensures proper fit and perfect product.

• Non-wovens: SnakeEye ensures only high-quality product gets shipped – and cuts scrap to virtually zero.

The great solution for applications with limited space

HARTING has increased the extensive product portfolio with the new High Density D-Sub 44 pole over moulded cable assembly.

One of the advantages of the new High Density D-Sub cable assembly is a 45° cable entry. Therefore, this cable assembly can be used for applications with limited space. Additionally, the cable assembly offers the advantages of the over moulding technique, rendering the assembly in the field not necessary.

A high performance cable is assembled with the premium HD D-Sub 44 pole HARTING connectors. Due to the 360° shielding of the connector and the cable the complete assembly fulfils important requirements regarding EMC protection. HARTING’s solution is offered in the degree of protection IP 20 and is therefore especially suited for use in cabinets and control units.

The high performance High Density D-Sub cable assembly is available in different standard lengths for a wide range of installations, demonstrating HARTING's strengths as an expert provider of system components.

The HARTING MicroTCA™ backplane connector passes the ruggedized environmental test according to the draft specification MTCA.3.

The PICMG, a leading standards organization for the communications, industrial and embedded computer industries, recently announced the successful completion of the “MicroTCA Conduction Cooled” testing. The MTCA.3 subsidiary specification of MicroTCA targets to defense and aerospace applications with extreme requirements for vibration, shock and temperature range based on MIL-STD-801. The goal was to show that the card edge connector system meets the stringent environmental requirements for the target markets. The test was performed by the independent testing and research company Contech Research.

In the test setup, a backplane equipped with HARTING MicroTCA connectors featuring con:card+ technology was used. After completion, the HARTING connector is now the first and currently the only MicroTCA connector recommended for a Conduction Cooled MicroTCA system. This test shows, that the MicroTCA hardware standard can be used in harsh environments and is also an viable alternative platform for industrial and transportation applications. The MTCA.3 specification is expected to be finalized end of this year. The final test results can be obtained freely at PICMG’s website,, under the Resources section.

12x Power from the Cable to the Board

Thanks to the Han® Q 12/0 PCB Adapter, the HARTING connector in the small
Han® 3 A series with the highest number of pins now has the option of direct connection to device boards. In addition to the actual
PCB adapter, special versions of the
Han® Q 12/0 connector's male and female inserts for the PCB Adapter will be available.

The PCB Adapter's installation is independent of the connector – it can be pre-installed according to the pinhole pattern on the board, as with other passive elements. The male or female insert for the PCB Adapter is installed after the board has been installed in the housing by being mounted on to the PCB and fixed in place on the bulkhead-mounted housing with the fixing screw. Thanks to the separate connector for the PCB Adapter, all 12 contacts and the PE conductor can be used. Consequently 12 contacts + PE are available for the connection to the PCB, with the following technical parameters in accordance with DIN EN 61984:

- 7.5 A braking current
- 250 V rated voltage
- 4 KV rated impulse voltage at pollution degree 3

HARTING has consequently added a further PCB Adapter model to its program, which includes the existing solutions from the Han DD®, Han E®, Han-Modular ® and
Han® Q series.

Light weight and lower costs

Versatile use, light weight and lower costs. Han-Eco®, the new HARTING connector family with a plastic housing, combines the high processing quality, safety and reliability of the entire HARTING portfolio with an ideal mix from the familiar and highly flexible Han-Modular® system.

Han-Eco® is predestined for applications that do not need the entire range of product features found in the Han® B housing series – and it simultaneously offers weight and cost advantages. In addition, a higher contact density to housing size ratio is achieved. Like the Han® B standard series, the Han-Eco® series is available in the sizes 6 B, 10 B, 16 B and 24 B. Depending on the size, bulkhead-mounted housings and hoods are available with straight and angled cable outlets and metric threads. The entire range of modules from the
Han-Modular® series is available for the Han-Eco® housing. The special feature: A module has more room in any of the four sizes than in the equivalent counterpart in the Han® B standard series.

Fast Track Switching

HARTING is introducing the first managed Industrial Ethernet switches with Fast Track Switching technology at SPS/IPC/DRIVES in Nurnberg. The devices will be presented at the fair stand in an actual PROFINET network. Experience the advantages of determinism in conjunction with Conformance Class B and openness according to Standard IEEE 802.3-based Ethernet protocols.

Two 10-port switches are joining the FTS switch product family: the FTS 3100-A with 10 copper ports and the 3082-ASFP with 8 copper ports and 2 slots for SFP modules. The switch detects PROFINET real-time frames and accelerates them in a cut-through method. They are always given priority for transmission, and therefore always take precedence over non-real-time frames. As a result, automation data reach their destination on time, regardless of the remaining network load – guaranteed every time.

The integration of the PROFINET stack makes the switch a PROFINET Conformance Class B Device, which, like other automation devices, can be planned and configured with automation tools. Numerous alarms and diagnoses from the PLC can be received, for example, for voltage monitoring or linkchange of ports. Optionally, the PLC can also process an important status message such as "Link down" via input data.

And of course the FTS switches also support functions such as VLANs, RSTP for redundant topologies, LLDP for topology display and all common management functions. Visit our stand at the fair and see for yourself how Fast Track Switch makes PROFINET calculable, allowing it to guarantee the greatest availability in a network.

New in the Han-Modular® Series

A new Han® 70 A Crimp module – predestined for applications presenting the toughest mechanical demands – is now available for the Han-Modular® series from the HARTING Technology Group.

The Han® 70 A Crimp module is plug compatible with the Han® 70 A Axial screw module already used in many applications. The transmission of a great deal of power in the most compact space is one special feature. For example, this allows up to 12 power contacts with 70 A and 1000 V to be implemented in a pluggable version in a Han® 24 B connector.

Technical details:
- 2 power contacts per module and up to 6 modules per connector
- High working voltage of 1000 V
- Large conductor cross-section of 10 to 25 mm²
- Crimp termination technology, crimping tools already on hand can be used
- Contacts can be removed without tools
- Plug compatible with the 70 A Axial screw module

As an open connector system, the Han-Modular® series is especially flexible and allows adaptation to users' individual requirements. Consequently, users can put together "their" connectors to satisfy the required configuration. In order to increase the number of possible configurations, new additions are continually joining the current 36 modules for electrical, optical and gaseous signals.

Creative Combinations

Han-Yellock® – after leaving the starting gate at the Hannover Messe 2010, Harting's innovative series continues to stride ahead, driven by determined and targeted expansion. The new housing size 60 is meaningfully scaled for a balanced dimensions/benefits ratio. Flat installation dimensions ensure a compact profile in machines and switch cabinets. A function-oriented cable outlet angle improves the handling in densely packed connector panels. The Han-Yellock® housings are simple and swift to use, and protect the interface against unintentional or unauthorized opening. Mating and locking are done in one step.

Covers protect the connector against moisture and dirt when it is not inserted, and contribute to the connection's longevity. What makes the Han-Yellock® series special is the possibility of snapping the protective covers in place on both sides of the housing. Customers can choose the direction of the cover swivel area, allowing adaptation to the individual application during the planning or refitting stage.

Flexibility is the key to contact transmission. Inserts from the widespread Han-Modular® program can be snapped into place in all Han-Yellock® housings without tools by using an adapter frame. This assembly is possible on the insertion or termination side, which simplifies work sequences during commissioning and cabling work. The adapter frame allows a broad spectrum of signal and power transmission with various media to be integrated into an interface, and offers an unbeatable combination of flexibility and product variety.

A Powerful Solution

HARTING has developed the new
Han® HC 250high current connector as a powerful interface that impresses by requiring little space, transmitting high current intensities and allowing flexible configuration of the number of poles. The HC 250 one-pole crimp module can be connected in various frame geometries to produce the required number of poles in a compact space – and in the existing
Han® HPR housing.

Technical details:
- Rated current 250 A at a rated voltage of 2000 V
- Termination cross-sections are: 35 mm2, 50 mm2 and 70 mm2
- Maximum four-pole interfaces in a size 24 B HPR housing, making it particularly suitable for motor connections
- High quality plastic with good smoke and inflammability levels
- Removal tool for simple installation and removal of the contacts and inserts
- Confusion of a number of interfaces is reliably prevented by multiple coding options for the individual inserts

The requirements in the railway industry are changing, as increasing mobility means greater flexibility in the journey and connection times. Powerful drive systems with high acceleration levels, reliable operating states and simple maintenance possibilities are called for here – and these are exactly the requirements that the Han® HC 250 satisfies.

HARTING offers two comprehensive solution packages

HARTING offers two comprehensive solution packages for cabling data networks in industry.

Profile-specific cabling is based on standardized industrial and automation protocols, which also include PROFINET. The HARTING PROFINET cabling portfolio comprises types A, B and C PROFINET cables, connectors such as RJ45 and M12, and accessories such as panel feed-throughs and hybrid interfaces for simultaneously supplying devices with data and voltage.

The second solution package is based on the structured cabling defined by ISO/IEC 11801 and 24702 (industrial premises cabling). Unlike profile-specific cabling, this portfolio is always executed with eight wires. HARTING’s Ha-VIS preLink® is a cabling system that outstandingly combines both aspects of industrial-use cabling while also opening up completely new possibilities for PROFINET. For example, Ha-VIS preLink® allows structured cabling up to the automation island, in order to pass the data services seamlessly on to the automation solution.

PNO has already recognized this advantage and released the structured cabling for PROFINET Conformance Classes A and B.

The new "Board-to-Board" and "Board-to-Cable" connector family, available in 48 different lengths

HARTING's new har-flex connector series is a space-saving, rugged and flexible PCB connector for the widest range of board-to-board and board-to-cable applications. In addition to straight connector models, the product family also includes compatible insulation displacement connectors, along with angled models.

In order to offer PCB designers the greatest possible flexibility for using increasingly size-conscious and cost-intensive PCB resources, HARTING has a flexible solution on hand in the har-flex. Based on a 1.27 mm grid, the har-flex product family offers customers all even-numbered models from 6 to 100 pins. For mezzanine applications, the series has straight models in four different stack heights that allow parallel PCB distances between 8 and 13.8 mm to be bridged.

har-flex connectors offer process advantages

The har-flex connector family in SMT technology is delivered in tape & reel packaging. 100 percent coplanarity testing and standard fitting with so-called pick & place pads guarantee a simple, fully automatic and reliable assembling process.

With the complete har-flex product family, HARTING is offering diverse solutions for all board-to-board applications that need a space-saving connection with the rigorous combination of simple, automatic and efficient fabrication and the highest quality requirements.

Designed with modern manufacturing requirements in mind, Henkel Electronic Materials has formulated Multicore MF210, a no-clean sustained activity flux that is compatible with both lead-free and tin-lead processes. The halide-free, resin-free material is effective with a wide range of solder resists, as well as rosin and OSP-based protectants for maximum adaptability.

Multicore MF210’s wide process window affords electronics specialists the latitude necessary to accommodate varying conditions for both tin-lead and lead-free manufacturing. With a pre-heat temperature range of 80°C to 130°C and a one- to three-second contact time on the wave, Multicore MF210 delivers sustained activity without resin even in the most demanding environments. The material’s unique formulation enables its use in both single- and dual-wave processes, with no degradation in activity level and its low solids content results in very low residue levels for a no-clean operation.

Unmatched advantages

Henkel Global Technology Champion for Solder Materials, Richard Boyle, explains why Multicore MF210 is such a significant industry advance. “There are so many variables in manufacturing today and modern materials must be able to adapt,” comments Boyle. “Multicore MF210 delivers this adaptability and then some. It has an extremely wide process window, excellent performance on challenging oxidized surface finishes, works well in both tin-lead and lead-free processes, affords high speed soldering with both single- and dual-wave systems and, because of its low residues, offers improved first time yield for pin testing. Add to this its ability to be used with spray, foam or wave fluxing systems and Multicore MF210’s advantages are pretty much unmatched among fluxes.”

Multicore MF210’s sustained activity level ensures that cleaning of OSPs and highly oxidized bare copper is extremely effective, thereby enabling excellent solder wetting and through hole penetration. In addition, the activity capability helps reduce solder microballing by improving coalescence and limiting the presence of stray particles around the solder joint.

Ideal for any process where high throughput is a necessity and minimum flux residue is a key requirement, Multicore MF210’s performance has been proven for multiple applications in the consumer electronics, automotive and alternative energy sectors.

Henkel as a systems provider for medical engineering lately developed the brand-new LOCTITE AssureCure system. The revolutionary technology combines a newly developed LOCTITE adhesive with a new monitoring system. This promises to provide a hitherto unrivalled level of reliability and precision in the curing of light cure adhesives as the basis for perfect bonding.

Light cure adhesives are used for a wide range of medical items, such as syringes, catheters, blood filters or cannulas. The technology enables to speed production processes while producing aesthetically pleasing, clear bondlines. Henkel has now introduced a new technology designed to quantitatively and cost-effectively assess the degree of cure of light cure adhesives. A simple in-line process, the LOCTITE AssureCure System includes new adhesive technology, fiber optic light sources, light detector unit, and software that ties into the users’ PC or PLC.

The LOCTITE AssureCure Monitoring System is designed to detect, measure, analyze, record and provide a degree of cure metric relative to the transition of specially formulated adhesives from a liquid to a solid (cured). Results can be displayed numerically, corresponding to the degree of cure, or as a pass/fail measurement.  Once integrated into a production line, the LOCTITE AssureCure system provides a reliable, quantitative measurement of the adhesive cure in less than one second. Directly correlated to the strength build of the adhesive, the LOCTITE AssureCure measurement system provides assurance that the adhesive has cured completely and reached the desired strength for the target application.

By confirming that the adhesive used to bond the components has cured, the innovative system provides a reliable, in-line, non-destructive method. In particular the LOCTITE AssureCure system offers significant value to manufacturers. It provides an in-line quality check on 100% of production parts and reduces extensive in-process quality checks and associated scrap components. The new LOCTITE AssureCure system easily integrates into existing production lines downstream of the light curing operation and provides an immediate, non-destructive analysis of all bonded assemblies measured. LOCTITE AssureCure equipment is positioned directly after a production line’s existing light cure equipment and provides assurance that the adhesive has cured completely and reached the desired bond strength for the target application.

The matching LOCTITE light cure adhesives can be provided in a range of viscosities, physical properties and package configurations. For medical device applications, LOCTITE AssureCure adhesives meet strict ISO 10993 biocompatibility requirements.

Sealants with new properties offer advantageous design possibilities in numerous industrial manufacturing processes. One such sealant that is especially suitable for use in refrigeration equipment is Terostat 301. In these applications the first heat-conductive butyl sealant from Henkel replaces classic heat-conductive pastes to improve heat exchange between the inner housing and the heat exchanger.

The product has a heat conductivity rating of approx. 0.8 W/mK. At the same time it also provides durable fixing of the coils to the refrigerator housing – unlike heat-conductive pasts which require an extra step to fix the coils using adhesive tapes or screw-fasteners. Terostat 301 is highly tacky and adheres to nearly all materials. For processing, the product is heated to 120 to 140°C and can then be applied automatically at high speed. The sealant develops its full performance characteristics directly after application. In other words, no curing time is required. In addition to its use in refrigerators, Terostat 301 can also be employed in sanitary applications or heating systems, where it can improve the heat transfer to thermostats or sensors.

The key criteria for the use of hotmelt adhesives in the packaging industry include high yield, productivity and long-term availability. Under the Technomelt brand, Henkel is now launching two hotmelt adhesives onto the market that have been developed specifically to meet these requirements. Alongside their bond strength, Technomelt Supra 145 and Technomelt Supreme are compelling products affording low consumption values as well as improved flowability in automatic application systems. Both products make use of a new raw material base, which offers the customer a broader spectrum of products, greater choice and enhanced flexibility.

Like all products in the Technomelt Supra line, the Technomelt Supra 145 innovation is defined by high processing quality and low consumption values. Compared to conventional hotmelts, Technomelt Supra 145 has a much higher thermal stability and flows more evenly without stringing or signs of cracking. Moreover, its self-cleaning properties ensure excellent processability. The low stickiness of the granules furthermore improves flowability in automatic application systems. Another advantage of the new Supra 145 is its high heat stability, which allows packaging to be transported safely, even in warm regions.

Building on the worldwide success of the Technomelt Supra product line, Technomelt Supreme from Henkel represents a new generation of hotmelt adhesive products. In contrast to conventional products in granule form, Technomelt Supreme is crystal clear and offers not only an impressive performance but also a unique appearance. Low consumption values in addition to outstanding thermal stability and adhesion are among the product attributes of Technomelt Supreme. This innovative hotmelt adhesive furthermore has high heat resistance and excellent cold flexibility, thereby allowing it to be used in packaging for both warm-fill contents and deep-freeze goods.

Both Technomelt Supra 145 and Supreme are manufactured on the basis of a new category of raw material, thus enabling Henkel to make more efficient use of existing raw materials. For customers in the packaging industry, this translates in particular to supply dependability, flexibility and a wide range of products.

Ceramishield RobotIQ is a system developed by Henkel specifically for fully automatic coating of contact tips and gas shrouds in welding robots. This combination of the dry-film coating Ceramishield LW-1 and fully automatic coating equipment offers long-term spatter protection in MIG/MAG robotic welding applications.

During metal welding processes, spatters of liquid metal reduce the service life of contact tips and gas shrouds as well as impairing the quality of the weld seams. Systems supplier Henkel has developed a reliable solution to this problem: Ceramishield RobotIQ combines a new application system with the related ceramic coating Ceramishield LW-1. All works steps are fully automatic so that consumables like contact tips and gas shrouds are effectively protected with a minimum of effort. With a height of 50 centimeters and weighing 22 kilograms, the coating system can easily be integrated into existing welding lines without any downtimes.

Automatic coating system promises continuous protection

With Ceramishield RobotIQ, the heat-resistant dry-film coating can be applied fully automatically within seconds. An integrated compressed air system ensures fast and reliable cure. The coating application rate can be individually adjusted to suit the welding process parameters. Continuous monitoring during the production process is assured by an electronic monitoring system. Settings can be easily checked on an LED panel. The LEDs also give instant information about the production status and any process errors. Ceramishield RobotIQ has an integrated water flushing circuit and is therefore self-cleaning, eliminating the need for any manual cleaning.

Ceramishield LW-1 meets the highest expectations

The Ceramishield LW-1 coating was developed specifically for the new Ceramishield RobotIQ application system. The coating is based on boron nitride particles shaped like platelets which align themselves parallel to the surface of the object being coated. The relatively dense coating is impenetrable to molten metal and resists heat up to 900 degrees Celsius. Ceramishield LW-1 is therefore ideally suitable for use in welding processes. Thanks to its exceptional durability, just one application is sufficient to protect contact tips and gas shrouds in all MIG/MAG welding processes for several hours. The ceramic shield thus formed effectively repels spatter.

Multiple competitive advantages

The use of Ceramishield RobotIQ has a positive impact on production costs and process speed: Since spatter build-up in the welding torch is significantly reduced, the welding process does not have to be interrupted so often to clean the welding equipment. This avoids costly downtime. Another advantage is that no oil-based cleaning chemicals are required – loose spatter can be easily and quickly removed. At the same time, consumable parts do not need to be replaced so often, since the physical and thermal protective coating increases their service life by an average of four to five times.

Furthermore, Ceramishield RobotIQ improves the quality of the weld seams and has a positive effect on environmental performance. The new coating prevents spatter from adhering to the gas shrouds and interrupting the flow of gas. This helps to avoid irregularities in the welding process. The result is precise and immaculate weld seams. Containing no greases, solvents or silicones, the Ceramishield LW-1 coating also complies with the most advanced health and safety standards and environmental regulations.

With its P3 Scribex 400 series, Henkel has developed a safe and environmentally sound cleaning solution for removing graffiti from rail vehicles. Unlike standard products, these cleaners do not require hazard labeling. They contain no hazardous ingredients, have low flammability and a low content of volatile organic compounds (VOC).

This new generation of powerful graffiti removers for cleaning the exterior of trains also offers multiple benefits in terms of sustainability. Scribex 400 is based on raw materials that are fit for the future without any drawbacks regarding health and safety requirements. The new formulation contains no allergenizing or ecotoxicological ingredients such as NMP or terpenes. The low VOC content of  8.6 percent minimizes pollutant emissions in the workshops. P3 Scribex 400 products also offer advantages in terms of transport and storage: The product series has a high flash point of 78°C and therefore requires no hazard labeling.

The P3 Scribex 400 series removes all known synthetic and bitumen-based spray and dispersion paints from painted surfaces without attacking the surfaces themselves. Thanks to their low-odor solvent, the products are pleasant to use and ideal for applications in indoor areas. The cleaners already deliver full performance at temperatures as low as 5°C. Their special composition also prevents rapid evaporation in warm weather, which extends the working time. The products are available in three different viscosity grades to accommodate different kinds of application equipment. The graffiti remover is offered as a sprayable liquid and as a gel. After a short contact time of five to ten minutes, the cleaner is simply washed off with water.

Under the motto “Take off to tomorrow”, Henkel is presenting a new generation of hotmelts for edgebanding and profile wrapping at the LIGNA 2011 trade fair in Hannover. In addition to high thermal stability and minimal application weights, the innovative hotmelt Technomelt Supreme is characterized mainly by its use of a new polymer base. By opening up this raw materials category, adhesives manufacturer Henkel is offering its customers not only supply security but also a broader spectrum of product solutions.

“Take off to tomorrow” is the motto under which Henkel will be presenting itself at this year’s LIGNA in Hannover, from Monday, May 30, to Friday, June 3. At stages along an innovation path, visitors can learn about the new products and talk shop with the Henkel experts. Among a series of innovations, one stands out in particular and best symbolizes the chosen motto for this year’s event: Technomelt Supreme. This is the new brand name under which an innovative product line of thermoplastic hotmelts for edgebanding and profile wrapping is being introduced. Technomelt Supreme is based on a new generation of polymers developed by Henkel that will be setting standards in the furniture industry in the coming years.

High thermal stability, minimal application weights

With their improved properties profile, the new thermoplastic hotmelts offer advantages not just during processing but also for the end-user. The new polymers that form the backbone of the hotmelts ensure better thermal stability of the bond. Another benefit provided by Technomelt Supreme is its improved cohesive behavior, allowing a significant reduction in application weights. This, in turn, results in much slimmer and more attractive bondlines.

System solutions for precise determination of application weights

To ensure that the benefits offered by Technomelt Supreme can be fully utilized for consistently good results in the production of furniture parts, Henkel has developed special supporting equipment. The ProMeter makes it possible for the first time to determine application weights precisely without any major modification to the edgebanding machine. The reduced application weights significantly improve the appearance of the bondlines on the end product.

For its new Technomelt Supreme product generation, Henkel has invested in a new production line at its site in Bopfingen. The foundations for future success lie in 20 years’ experience of producing hotmelts by extrusion techniques.

At this year’s LIGNA trade fair in Hannover, Henkel is represented as a member of Gütegemeinschaft Dreidimensionale Möbelfronten e.V., a quality association for three-dimensional furniture fronts. Founded in March 2011, the association has set itself the task of establishing a verifiable quality system with the aim of introducing an RAL quality mark. The initiators of this quality association include furniture front manufacturers 3B, Arko and Ilcam as well as finish foil producer Renolit SE and representatives of the panels industry.

Verifiable and reproducible production parameters are a basic prerequisite for achieving consistently high quality standards in the manufacture of furniture fronts. With the aim of supporting efforts in this direction Henkel already began some years ago to develop metrics and equipment enabling customers to incorporate quality control directly into ongoing production. To draw attention to the significance of quality and innovation in the production of furniture parts, Henkel has joined the recently established quality association Gütegemeinschaft Dreidimensionale Möbelfronten e.V.

System solutions for optimizing process parameters

Henkel has developed a series of system solutions that make it possible to assure consistently high quality levels in furniture front manufacturing. The 3D Profiler enables line operators and line suppliers to track, control and optimize process parameters which are otherwise difficult to determine. ProControl is a system for precise measurement of adhesive application amounts, helping to maintain a balance between quality and costs. The closed Clean System was designed to facilitate the application of one-component 3D adhesives. 3D thermoforming technology is used to produce to produce a variety of parts, including up-market kitchen furniture fronts. The adhesive holding the components together – the panel substrate and the finish foil – plays a vital role here.

Innovative adhesive solutions for the furniture industry

DORUS FD 150/6 LS has a low activation temperature of 55 degrees Celsius. The lower the processing temperature in the press, the longer the life of the membrane. Other features characterizing this one-component 3D PU dispersion adhesive are its high heat and moisture resistance and its extremely high initial bond strength. By maximizing processing reliability, DORUS FD 150/6 LS helps to increase productivity in furniture part production.

Nihon Dempa Kogyo Co., Ltd. (President : Hiroshi Takeuchi), has developed small-sized TCXO "NT7050BB" of the 7.0 x 5.0 x 2.0mm size, which is popular package size in network equipment, by realizing high hold over frequency stability (*1) ±100ppb (0.1ppm = 0.1 x 10-6) to meet standard of femtocell base station and basic type networks such as Stratum3.

The communication carriers going forward need to maintain, expand service area and improve communication quality to prepare for increase of communication traffic. Still some areas such as underground towns and indoors are difficult to receive radio signals. Use of small-sized femtocell base station set up inside house or office enables mobile phone communication to be stable.

Though a femtocell base station is as small as a palm, it is required to meet very strict standard, frequency stability ±100ppb, same as other base stations. Until now this frequency stability was realized using an OCXO for temperature control. However, femtocell base station is set inside office or house and are required to be of small size, low heat generation and low electric power consumption.

"NT7050BB" itself has realized general frequency stability ±100ppb by developing high precision crystal oscillator utilizing NDK's high-level synthetic quartz processing technology and incorporating a high level temperature compensated circuit. This is how we developed a crystal oscillator which meets stability standard of femtocell base station, ±100ppb TCXO as a single unit, with low current consumption (6mA Max.) and quick rise time.

The NT7050BB meets the standard for femtocell base station as a single unit, making it possible to reduce number of parts, cost, power consumption (*2) and shrink the size (*3) of the base station. It also contributes much to basic usability of mobile phone "whenever or wherever available" by expanded coverage area and stabilizing the communication environment - through femtocell use.

At the same time we are firmly believe that this small size, high stability, low power consumption product allows the circuit design margin in development of basic type networks equipment.

Nihon Dempa Kogyo Co., Ltd. (Hiroshi Takeuchi, President) has developed the "NT2016SA", TCXO (temperature-compensated crystal oscillator) with low phase noise and reduced harmonics in 2016 (2.0×1.6×0.8mm Max.) package for use in wireless LAN.

In recent years, mobile phones and portable terminals, have added wireless LAN functionality. With the increased sophistication of terminals, miniaturization, low-profile and integration are required. Crystal devices are no exception.

Phase noise appears near the output frequency (carrier) of an oscillator and causes error in the signal containing useful information. As the data transmission rate increases, it's effect becomes more pronounced with an increase in data errors.

Harmonics are high-frequency appearing with integral multiplication of output frequency of the oscillator. For some oscillators, even-order harmonics may overlap in the frequency band (2.4GHz-band, 5GHz-band) of wireless LAN and effect the transmission. With the NT2016SA, even-order harmonics are controlled by suppressing the second-harmonics. The effect on the frequency band of wireless LAN is reduced.

Phase noise has been improved by about 4dB compared to that of our previous oscillators by improving the IC. In addition, the second-harmonic level has been improved by about 15dB by improving the symmetry of output waveform.

Even though the NT2016SA TCXO is 2016-size, it contributes to the realization of the wireless LAN with reduced data error and high capacity data transmission.

Nihon Dempa Kogyo Co., Ltd. (Hiroshi Takeuchi, President) has developed the TCXO (temperature-compensated crystal oscillator) with a wide temperature range in ultra-compact size of 2520 (2.5×2.0×0.8mm Typ.) for GPS applications in vehicles or other outdoor-type apparatuses.

In recent years, the role of the GPS in automobiles has been getting more and more significant. It has widely spread in the range from the system used by drivers for capturing the position of the vehicle, such as the Car Navigation System, up to the system informing the position of the vehicle to external party, such as the e-call (*1), or the system of tracing the vehicle from outside, such as SVT (*2).

In order to be applicable to such various GPS applications in vehicles, a Frequency Temperature Characteristic of ±3.0ppm has been realized (commonly around ±10ppm in the past). Furthermore, in the product with the ±0.5ppm of Frequency Temperature Characteristic, the Operating Temperature Range has been expanded to -40 to +85deg.C from -30 to +85deg.C, which previous model used.

With the higher accuracy applied for the GPS and expanded Operating Temperature Range, the available locations for installing GPS equipment has become wider. The locations have been limited in the past, such as the dashboard of vehicle, etc, but now can be installed in locations with severe temperature conditions.

Even with it's compact 2520-size, it is applicable to a wide range of usage, mainly used for in-vehicle, such as Telematics, etc.

“NAPiCOS” is QCM (*) technology based analyzer for biological molecular interaction, with which differential measurement by QCM twin sensor is available. The system enables users to make high sensitivity measurements for molecular interaction such as biological protein binding, DNA binding and so on with just simple injection of sample. Additionally, NAPiCOS system can be used for gas measurement in materials developments and environmental monitoring fields. NAPiCOS series consist of two types, manual operation type”NAPiCOS system” and Automatic operation type “NAPiCOS Auto.”We at NDK will contribute to establish safe & untroubled living conditions through quantification and analysis of specific substance in biochemistry, clinical, environment and food chemistry fields etc.

◊NAPiCOS is a coined word created by NDK, combining the words “nano,” “pico” and “sensor.”A possibility of trace amount measurement with nano and pico level is infused into the word NAPiCOS as a new measurement technology proposed by high technology crystal products manufacturer NDK.”

(*) QCM : Shortened words of Quartz Crystal Microbalance. Molecular level measurement method using quartz crystal as sensor board.

Nichicon Corporation develops chip-type aluminum electrolytic capacitors ideally suited to use as power sources in medium to high voltage products such as vehicle ballast resistors and LED lights, widely acclaimed for their long life and energy efficiency. The line-up will be on display at the CEATEC JAPAN 2012 exhibition to be held at Makuhari Messe from 2–6 October (Tues-Sat).

In recent years, high voltage, chip-type aluminum electrolytic capacitors have been in demand mainly as vehicle ballast resistors, but have also been a key to the increasingly vibrant development of energy-saving power source products for the expanding LED market. These kinds of applications demand the ability to withstand even higher voltages, miniaturization, higher capacity, longer life and better reliability from aluminum electrolytic capacitors.

Adding to our line-up of high voltage, chip-type aluminum electrolytic capacitors to meet your diverse needs, we are able to offer you the best products that focus mainly on smooth input for various power sources. We also address your requirements for surface mounting to allow for miniaturization of set devices.

These products, based on the technology fostered by Nichicon, are assembled with the optimal components including a newly developed electrolyte solution with capacity to withstand higher voltages and providing better reliability, as well as high voltage, high amplification foil. This has enabled us to create an industry breakthrough range with voltage ratings of 450V and 500V and a longer life guarantee of 10,000 hours at 105°C and 4,000 hours at 125°C.

Nichicon Corporation has developed the CM series of chip-type aluminum capacitors which deliver an endurance guarantee of 2,000 hours at 105°C, with high capacitance and low impedance in response to the constant demand in all industries, from digital electronics to automotive and for a small, high capacitance product ideally suited to miniaturization of set devices and higher performance. The series will be on display at the CEATEC JAPAN 2012 exhibition to be held at Makuhari Messe from 2–6 October (Tues-Sat).

Demand for chip-type capacitors is growing as manufacturers look to mount more densely on set devices for electronic equipment and consumer appliances. Capacitors for use in digital equipment needs to be low in noise and impedance. In addition to denser mounting, the miniaturization of set devices and their increasingly high performance means that capacitors themselves must be made smaller, with higher capacitance and lower impedance. We believe that our CM line-up not only responds to the need for denser surface mounting than ever, but also contributes a solution to the constant demand for smaller and lighter set devices, as well as reducing parts count.

Based on technology developed by Nichicon, this product applies a new separator and high voltage, high amplification foil, and is assembled with optimal components. This has enabled us to create a smaller, higher capacitance product from the current 105°C low impedance chip-type CL series. The CM series allows us to contribute to the reduction of parts count for each set device, as well as saving space and improving efficiency.

In terms of endurance, the CM series has guaranteed service of 2,000 hours at 105°C.

Nichicon Corporation has developed a new series, the PH series, which is a high voltage, smaller size, high capacitance radial leaded type aluminum capacitor principally suited for household digital appliances, and AC adaptors, power sources of all kinds. The line-up will be on display at the CEATEC JAPAN 2012 exhibition to be held at Makuhari Messe from 2–6 October (Tues-Sat).

With the increasing miniaturization of household digital appliances and AC adaptors, the need has arisen for even smaller aluminum capacitors with higher capacitance. Demand is growing particularly fast for higher voltage radial leaded  aluminum electrolytic capacitors in the 400 to 450V rated voltage range that are used in primary power sources.  In the future, as devices continue to miniaturize, board space will reduce and the density of mounted parts will increase.

To meet these market needs, Nichicon has developed the PH series line-up of high voltage, smaller size, high capacitance leaded aluminum capacitors.

The PH series applies the Nichicon capacitor manufacturing technologies such as the adoption of high capacitance, high strength aluminum electrolytic foil and the optimization of electrode design and electrode uptake, and have led to around a 20% size reduction over the current PZ series and up to 50% more capacitance. These are the best aluminum capacitors for digital electronics batteries, AC adaptors and other power sources where miniaturization is  most important.

Nichicon Corporation’s "EV (electric vehicle) Power Station" V2H (vehicle to home) system and "Home Power Station" residential power storage system have won the Semi-Grand Prix in the 2012 CEATEC Awards. These honors come in the Products and Services category, which recognizes companies for creating prosperous and ideal lifestyles.

At CEATEC Japan, one of the world’s most comprehensive trade shows for the IT and Electronics industries, the CEATEC Awards are presented to exihibiting companies possessing technologies, products, services, and systems that show extraordinary innovation. These award selections are promoted in the news around the world.

The "EV Power Station" is a V2H system for charging EV batteries and supplying power from these batteries, and it is the first such system that allows electricity from the EV’s battery to be sent into a home. The "EV Power Station" charges the EV at night, and in the daytime it uses the EV’s battery to supply power to the home during peak electricity demand hours, thus contributing to peak-time shifts. As well, the electricity stored in the large-capacity battery of a Nissan Leaf EV can be used as residential backup power in the case of a power outage.

With the "Home Power Station" residential power storage system, users can charge the battery late at night when electricity rates are lower, and then use this electricity during peak use daytime hours to save on their electricity bills. They can also achieve greater energy self-sufficiency by storing up surplus electricity in the daytime using solar power and then using this electricity at night. And in the case of a power outage, the system’s high-capacity storage can provide backup power to a home.

In selecting the "EV Power Station" and "Home Power Station", the CEATEC Award judges recognized how these systems combine with EVs, undoubtedly a crucial transport mode of the near future; how their innovative technologies can contribute to solving the energy problems that humans are certain to face; and the significant fact that these systems are already on the market and have been proven practical.

These awards have provided Nichicon with even further stimulus to pool the company’s collective expertise and develop even more products and services that respond to the needs and expectations of society.

Wednesday, October 10, 2012

The reliable Han® HPR housing series from HARTING now includes a protective cover for size 3 A bulkhead and surface mounting housings. It protects the contact inserts from the environmental influences when not in use, which can otherwise cause outages for outdoor applications in the rail and industrial sectors. This is particularly important for interfaces that are not always in use, such as service interfaces, for this the new protective cover provides reliable security.

The Han® 3 HPR protective cover is fitted with the same screw locking system used for the hoods, and fulfills the IP 68 protection according to IEC 60529 in locked position. It is optionally available with a stainless steel lanyard, ensuring that the protective cover will not be lost.

The primary application of the Han® HPR series are in the areas of electrical interfaces in vehicles, applications with increased climatic demands, wet areas and sensitive interfaces that need to be protected or shielded.

The Han® HPR housing range from HARTING now includes the new Han® 16 HPR enlarged housing. It is now possible to assemble the 4-pole version of the Han® HC Modular 250 contact system to the Han® HPR size 16 B as well as the previous size 24B.

This allows high current applications with a rated current of 250 A and a rated voltage of 2000 V with up to four contacts in a compact design. Therefore new contact holding frames and a new Han® 16 HPR enlarged hood and bulkhead mounting housing were produced. In spite of its compact size, the “enlarged” housing version provides plenty of room for cabling.

In terms of further technical parameters, the new Han® 16 HPR enlarged housings have the same features as the reliable Han® HPR housing series. The hood has four M25 cable entries. The new housings are fitted with the usual screw locking system and fulfills the IP 68 protection according to IEC 60529 in locked position.

HARTING HA-VIS preLink® offers ideal cabling solutions for developing data networks in industrial and functional buildings. The range now includes a robust industrial box in IP 20/30 for mounting on walls and pillars. It is even possible to mount on top hat rails to DIN EN 60715 with the new Ha-VIS preLink® AP Box. It simply consists of two housing sections and preLink RJ45 HIFF modules. The AP Box is pre-assembled and is quick and easy to install. Cables can be fed in from above or below. Both RJ45 ports have angled outlets and can be labeled.

The HARTING Technology Group has rounded off the HARTING RJ Industrial® series by new RJ45 PCB jacks with integrated tranformers. The highly compact dimensions of these RJ45 connectors enable convenient and simple integration into all established IP 65/67 interface types, from PushPull to Han® 3A.

The reduced height is also an advantage in scenarios involving plug-in cards, allowing the realization of very flat assemblies and modules. Versions for 10/100 Mbit and 1 Gbit are now available in connection with the initial market launch, while versions for PoE as well as individual adaptations to specific customer wishes are planned and can be rapidly executed. In connnection with SMD LEDs on the customer PCB, integrated light-pipes enable signalling of the port status. These industry standard female connectors can be processed by all standard soldering methods such as wave-soldering or SMT reflow.

HARTING har-flex®, the new connector series designed for a wide range of board-to-board and board-to-cable applications, now includes an angled version. Adding to the straight models and ribbon cable connectors previously available, this now makes highly flexible and modular equipment configurations possible.

HARTING is responding to the continuing trend for even more compact equipment design. But circuit boards are not just getting smaller – they no longer have to have a rigid layout. har-flex® connectors make a wide range of equipment circuit board layouts possible. All versions are freely combinable and adapt to the housing. har-flex® meets all the latest requirements of transmission protocols such as Gigabit Ethernet and PCI Express: data rates up to 3.125 Gbit are easily achievable.

The compact, robust design also ensures reliable operation, even in adverse conditions. It combines the performance of a modern computer with the robustness of an industrial device. har-flex® connectors can be used in both control cabinets and mobile devices. The complete har-flex® product family from HARTING delivers versatile solutions for all circuit board applications requiring a space-saving connection and consistently combines easy, automatic and efficient handling with high quality.

The Han® 70 A Hybrid Module is the latest model in the Han-Modular® series – the highly flexible open connector system from HARTING. Applications also requiring power supply and signal contacts are now possible with the Hybrid Module, with smaller and more economical connectors.

The Han® 70 A Hybrid Module has a power contact for ampacity of 70 A at a rated voltage of 1000 V and four additional signal contacts designed for up to 400 V. Standard Han® E crimp contacts with ampacity of 16 A are used for this.

The power contact has axial screw terminals. Cables measuring from 6 to 22 mm² (8-4 AWG) can be connected without using an expensive special tool. A secure and durable connection can be made with a regular 2.5 mm hexagon screwdriver.

The Han-Modular® series enables users to create their own “personal” connector to the desired configuration. Various modules are available for electrical, optical and gaseous signals and the range is constantly updated.

The new Ha-VIS RF-R500 from HARTING offers customers an extremely powerful and versatile RFID Reader. It makes the use of RFID technology – the automatic recognition of objects – possible, even in demanding industrial environments without line of sight. Several hundred objects can be captured automatically over distances up to 16m and immediately stored on an existing IT system e.g. SAP. Automatic capture minimizes possible sources of error, enabling the optimization of logistics processes, for example.

Tools and wagon maintenance management can also be simplified and accelerated, achieving considerable cost savings. The full benefits of the reader can be seen in the example of tracking wagons going into a maintenance shed. Protected by a robust aluminum housing with a protection category up to IP 64, the reader can also be used in harsh environments in sheds or by the tracks. 4 W transmission power and four antenna connections for each device deliver wide coverage at minimum cost, as long antenna cables can be added. The powerful processor and optimized software means that wagons traveling past quickly can be captured.

The HARTING Technology Group is working with the DFKI (German Research Centre for Artificial Intelligence) to promote future-safe technology and incorporate it in its products as early as possible. HARTING smart Power Units are being incorporated into the SmartFactoryKL as part of a joint project to test and develop the HARTING smart Power Network concept. The SmartFactoryKL is a demo facility at the am DFKI Institute in Kaiserslautern, where new technology can be tested under near manufacturing conditions. Work will be carried out with HARTING at this facility to address the issue of energy efficiency in the future. This will provide HARTING with new ideas for technology and practical examples of how smart Power Networks can increase industrial process efficiency.

Han-Yellock® – the innovative connector design from HARTING – now has two more product components for housings and insulators. The Han-Yellock® universal hood and the Han-Yellock® mixed adapter frame make cable layout even more flexible.

The universal hood provides enough space for a range of cable entry combinations. For example, the drillings can be used for layouts ranging from 3x M20, 2x M25, 2x M32 to 1x M50 cable glands. Individual cables can be fed in, fitted with separate cable connections. Standard cable connections can be used, with the added benefit that maintenance can be carried out by replacing separate individual cables.

This range of cable entry options is particularly important for use with modular insulators. The new Han-Yellock® mixed adapter frame sets a new benchmark for potential wiring combinations. Alongside Han-Yellock® modules with bridging functionality, Han-Modular® modules can also be used for a wide range of transmission data. The unique functionalities of the individual products merge into a single compact interface. This reduces the number and size of connectors on a panel, together with quick mating operation.

CUI Inc releases the industry’s first self-compensating No-Bus digital point of load dc-dc module family. The modules are specifically designed for customers who value the efficiency and compensation advantages inherent in digital power but do not want to incorporate digital bus communication in their systems. The NSM2P series will allow customers to access many of the same features as a fully digital POL, however the access will be via header pins that will connect to a USB dongle and CUI’s Digital Power GUI. The designer can dynamically test and manipulate the desired functions within their system, monitor the results, and set the desired fault management functions. In production, the engineering header is pulled and the specified parameters are loaded into the module by CUI based on the customer’s specific requirement.

The NSM2P has the same features and functions of the recently announced NDM2P series without the need for a serial bus connection on the board, also offering true cycle-by-cycle self compensation, autonomously balancing the trade-offs between dynamic performance and system stability. With this feature, designers are able to bypass the traditional practice of building-in margins to account for factors such as component ageing, manufacturing variations, and temperature, which inevitably lead to higher component cost and longer design cycles. The NSM2P’s take full advantage of Powervation’s cycle by cycle self compensation feature, the module is able to dynamically set optimum stability in real time as conditions change.

Offering efficiencies above 93% at half load, the NSM2P series is available with an input range of 4.5~14 Vdc and a selectable output range of 0.6~3.3 Vdc in three compact DIP configurations; a 12 A version measuring 0.825 (L) X 0.500 (W) X 0.286 (H) in., a 25 A version measuring 1.01 x 0.54 x 0.32 in., and a 50 A version measuring 1.215 x 0.79 x 0.36 in. SMT and SIP versions will be available as well. Additional features include 1% Vout accuracy, precision ramp control, margining, and a multi-config pin that allows up to 8 configuration files to be stored in a single part number as well as a nested footprint between the three modules to support dual layout needs. The NSM2P modules are optimized for the complex needs in the low core voltages requirements of today’s most advanced chips.

“We pride ourselves in making digital power as simple and accessible as possible for engineers,” said Mark Adams, CUI’s Senior Vice President. "The NSM2P series will allow our customers to enjoy the flexibility and performance of digital power in a package that is even easier to design in than an analog point of load module," Adams concluded.

The NSM2P series the latest addition to CUI’s Novum® Advanced Power product line, which focuses solely on the design and development of leading edge power platforms. NSM2P engineering samples are available immediately for select customers.

CUI Inc announced the release of its second generation digital point of load dc-dc modules for distributed power architecture applications. The NDM2P series is the latest addition to CUI’s Novum® Advanced Power product line, which focuses solely on the design and development of leading edge power platforms. The modules offer true cycle-by-cycle compensation, autonomously balancing the trade-offs between dynamic performance and system stability. With this feature, designers are able to bypass the traditional practice of building-in margins to account for factors such as component ageing, manufacturing variations, and temperature, which inevitably lead to higher component cost and longer design cycles. With the NDM2P’s self compensation feature, the module is able to dynamically set optimum stability in real time as conditions change. With the addition of these second generation modules based on Powervation’s digital IC, CUI continues to be the only module manufacturer in the industry to offer a full portfolio of self compensating digital POL modules.

Offering efficiencies above 93% at half load, the NDM2P series is initially available in three compact DIP configurations; a 12 A version measuring 0.825 (L) X 0.500 (W) X 0.286 (H) in., a 25 A version measuring 1.01 x 0.54 x 0.32 in., and a 50 A version measuring 1.215 x 0.79 x 0.36 in. SMT and SIP versions will be available as well. Additionally, to support dual layout needs, the modules are footprint nested.

The NDM2P series is available with an input range of 4.5~14 Vdc and a programmable output range of 0.6~3.3 Vdc. Features include active current sharing, voltage sequencing, voltage tracking, synchronization and phase spreading, programmable soft start and stop, as well as a host of monitoring capabilities. All features are dynamically programmable via PMBus commands or a simple, easy to use GUI.

“This is our second generation of fully-featured digital modules based on the Powervation technology,” said Mark Adams, CUI’s Senior Vice President. "The NDM2P is our highest performance family to date, targeting customers that value high efficiency and fast transient response in an extremely compact module design."

Engineering samples are available immediately for select customers.