Monday, September 10, 2012

T-Clad HPL Dielectric

HPL is a dielectric specifically formulated for high power lighting LED applications with demanding thermal performance requirements. This thin dielectric at 0.0015" (38μm) has the ability to withstand high temperatures with a glass transition of 185°C and phenomenal thermal performance of 0.30°C/W (RD 2018). Bergquist Thermal Clad HPL is available in scored array circuits, scored singulated circuit, punched singulated parts and in LED standard stars and squares configurations.

  •     High watt-density applications where achieving the lowest
  •     thermal resistance is required
  •     Backlighting
  •     Projectors
  •     LED applications
  •     Very low thermal impedance 0.02°C-in2/W (0.13°Ccm2/W)
  •     High thermal conductivity of 3.0 W/m-K
  •     High temperature applications
  •     Lead-free solder compatible
  •     RoHS compliant and environmentally green
  •     Available on all aluminum and copper metal substrates as
  •     well as Ultra Thin Circuits

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