Friday, September 28, 2012

CEA-Leti Forms Common Lab with IPDiA to Focus on 3D-Integration Technologies for Passive Components on Silicon

CEA-Leti and IPDiA have formed a common lab to capitalize on their complementary expertise in miniaturization and 3D integration on silicon.

The common lab is dedicated to developing new 3D-integration technologies for passive electronics components on silicon and will open the door to new applications in promising markets such as LED lighting, healthcare and aerospace that require extreme miniaturization. The partnership also will pave the way to improved miniaturization of passive components such as resistors, capacitors and inductors.

Specifically, the common lab is designed to develop:
  •     Very high-end passive components on silicon that will resist harsh environments
  •     Functional sub-mounts for lighting components
  •     Innovative assembly technologies allowing ultra-miniaturization of future products
IPDiA was founded in 2009 to commercialize innovative 3D technologies for integrating passive components. The company’s two axes of focus are integrated devices for high brightness LEDs and integrated passive devices for new medical, industrial, aerospace and defense markets.

CEA-Leti’s expertise in 3D technologies will allow IPDiA to go beyond the third generation of Passive Integration Connecting Substrate (PICS) components (250nF/mm²), which are being produced at IPDiA’s Caen site, and pursue the development of a future generation of PICS components (1µF/mm², then 2µF/mm²) and their assembly.

These products are designed, developed and manufactured by IPDiA in its production unit.

“The technologies to be developed in the common lab are one of the corner stones for industrial development of IPDiA, and our competencies in developing passive components in silicon will allow us to put a real industrial and independent offer in place,” said Franck Murray, CEO of IPDIA. “This partnership is also the result of a great human adventure, a common work between teams from various backgrounds generating creativity and new ideas.”

“This collaboration is in line with Leti’s strategy of working with innovative partners to develop and commercialize new technologies, it and will allow us to position ourselves in the front line of high-performance passive components on silicon

interposers,” said Leti CEO Laurent Malier. “Our complementary competencies in materials and 3D-silicon integration bring strong added value to this common lab.”

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