Sunday, January 15, 2012

Two Component UltraFast Curing Epoxy Adhesive Featuring High Temperature Resistance and High Bond Strength Now Certified to Meet NASA Low Outgassing Specifications

Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT-1 has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT-1 retains fast setup times even when mixed in relatively small masses. EP65HT-1 normally will setup in 3-5 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths approaching 3,000 psi. Service temperature range is 60°F to +400°F. EP65HT-1 offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT-1 has now been qualified to meet NASA low outgassing specifications.

EP65HT-1 bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT-1 has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT-1 is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries.

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